TEA19051BT

Overview

The TEA19051BT supports the following protocols:

USB Type-C v.1.3
USB Power Delivery (USB-PD) including Programmable Power Supply (PPS)
Battery Charging 1.2 (BC1.2)
Qualcomm^® QuickCharge^™ QC2.0, QC3.0, and QC4+

A complete smart-charging Switch Mode Power Supply (SMPS) can be built in combination with the TEA193x primary controller and the TEA199x secondary side Synchronous Rectifier (SR) controller.

The TEA19051BT can be provided in several small packages with low pin count. Due to its small number of external components, a small form factor SMPS can be built that meets efficiency requirements like CoC Tier-2, EuP Iot6, and DOE v6 with an extremely no-load power (< 30 mW).

The TEA19051BT has a high level of digital integration. It incorporates all required circuits, including a charge pump to drive an external NMOS load switch directly, a USBPD physical interface (PHY), and an integrated driver for fast output discharge.

Features

General

Full safe application for high-power adapters, which protect against overload conditions
Wide output voltage operating range (2.9 V to 20 V)
Ultra-high efficiency together with TEA193x QR/DCM controller and TEA199x SR controller
Very low no-load power (< 30 mW for the complete system solution)
High power density
Dedicated SW pin to drive external NMOS directly
Constant Voltage (CV) and Constant Current (CC) control (programmable level)
Precise voltage and current control with low minimum step size (voltage 12-bit DAC, current 10-bit DAC)
Low-cost SO10 package (suitable for reflow soldering and wave soldering)
Low-cost Bill Of Materials (BOM; ≈15 external components)
Embedded MCU (with ROM, RAM, and MTP memory)
Discharge pin for fast discharge
Built-in series regulator and programmable cable compensation
Non-volatile MTP memory for storage of system configuration parameters

Protocol support

USB Type-C v.1.3
USB Power Delivery (USB-PD) 2.0 and 3.0 including Programmable Power Supply (PPS)
Supports Qualcomm^® QuickCharge^™ QC4.0 protocols
Battery Charging 1.2 (BC 1.2)
Unstructured Vendor Defined Messages (VDMs), which can be used for MTP programming, e.g. to get Vendor IDs

Protections

OverTemperature Protection (OTP): one internal and one external
Adaptive OverVoltage Protection (OVP)
Adaptive UnderVoltage Protection (UVP)
OverCurrent Protection (OCP)
UnderVoltage LockOut (UVLO) protection
Output Short Protection (OSP)
Open-Supply Protection (OSUP)
pen-ground protection (OGP)
Overvoltage protection DP, DM, CC1, and CC2 pins
Soft short protection at CC1 and CC2 pins
Soft short protection at the output

Features

General

Full safe application for high-power adapters, which protect against overload conditions
Wide output voltage operating range (2.9 V to 20 V)
Ultra-high efficiency together with TEA193x QR/DCM controller and TEA199x SR controller
Very low no-load power (< 30 mW for the complete system solution)
High power density
Dedicated SW pin to drive external NMOS directly
Constant Voltage (CV) and Constant Current (CC) control (programmable level)
Precise voltage and current control with low minimum step size (voltage 12-bit DAC, current 10-bit DAC)
Low-cost SO10 package (suitable for reflow soldering and wave soldering)
Low-cost Bill Of Materials (BOM; ≈15 external components)
Embedded MCU (with ROM, RAM, and MTP memory)
Discharge pin for fast discharge
Built-in series regulator and programmable cable compensation
Non-volatile MTP memory for storage of system configuration parameters

Protocol support

USB Type-C v.1.3
USB Power Delivery (USB-PD) 2.0 and 3.0 including Programmable Power Supply (PPS)
Supports Qualcomm^® QuickCharge^™ QC4.0 protocols
Battery Charging 1.2 (BC 1.2)
Unstructured Vendor Defined Messages (VDMs), which can be used for MTP programming, e.g. to get Vendor IDs