At NXP, our focus is on the quality of our product as well as its reliability related to the intended application. This application is characterized by a mission profile, which is a collection of relevant environmental and functional loads that a product is exposed to during its full life cycle when used in specific environments over time.
To guarantee a product’s reliability capability we:
A semiconductor product is an application solution (sometimes including software) for one or more use areas and consists of the following technology building blocks:
The reliability capability of the product and its building blocks for a specific application area is demonstrated using knowledge based qualification (KBQ) methodology, as described in JEDEC Standards JESD94, JEP122, and JEP148 and promoted by the automotive industry by way of AEC-Q100/Q101 standards, as well as the robustness validation standard J1879 from the Society of Automotive Engineers (SAE) and Zentralverband Elektrotechnikund Elektronikindustrie (ZVEI). It is applicable to both new developments and changes to technology, products and manufacturing (e.g., recipe, equipment, process, materials, design/construction).The industry uses accelerated reliability testing to simulate application life in a reasonable amount of time.
Our strategy is to determine the reliability capability by applying (where possible) the test-to-failure concept, extending reliability qualification conformance tests beyond the required levels and assessing any physical or electrical degradation of a product during those tests.
For the building blocks or complete products, the reliability capabilities are evaluated with a set of conformance tests related to specific application areas. The tests and their requirements are defined by using knowledge of potential failure modes and rules for structural similarity. These rules and tests can be used to qualify derivatives of released building blocks. For new failure modes and new or modified acceleration models or model parameters, the applicability of conformance test requirements, as well as structural similarity rules are updated.
Applicable reliability knowledge, data, tools and methods are accessible through NXP’s Reliability Knowledge Framework (RKF).
NXP uses 3 types of read points in determining the reliability capability of the building blocks:
Generic Mission Profiles as used by NXP are:
Some examples showing standard / robust read points
|Accelerated Stress Test||Industry Standard / NXP Mission Profile / Use Life||JESD47 / Commercial, Home and Industrial / 5-10 years||AEC Q100 Grade 1 / A1 / 15 years|
|High-Temperature Operating Life Test (HTOL)||JESD22-A108||1000h / 2000h 1) Tj=150 °C||1000h / 2000h Tj=150 °C|
|Preconditioning (PC)||J-STD-020||Performed prior to THB, HAST, T/C and AC|
|Temperature Cycling (TC)||JESD22-A104||500c / 1000c -65°C - 150 °C||500c / 1000c -65°C - 150 °C|
|Highly Accelerated Stress Testing (HAST)||JESD22-A110||96h / 192h 85%RH / 130 °C||96h / 192h 85%RH / 130 °C|
|Temp and Humidity Bias (THB)||JESD22-A101||1000h / 2000h 85%RH / 85 °C||1000h / 2000h 85%RH / 85 °C|
|High Temperature Storage Life (HTSL)||JESD22-A103||1000h / 2000h Ta=150 °C||1000h / 2000h Ta=150 °C|
|Human Body Model (HBM)||ANSI/ESDA/JEDEC JS-001-2012||2kV / 2.5kV||2kV / 2.5kV|
|Charged Device Model (CDM)||JESD22-C101||500V / 750V||500V (corner 750V) / 750V|
|Latch-Up (LU)||JESD78||± 100 mA - Ta, max / ± 100 mA - Tj, max||± 100 mA - Ta, max / ± 100 mA - Tj, max|