Documentation

ID and Description Vendor ID Format Size K Rev # Date Last Modified Download Code Files
AN1907 — AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages   NXP   pdf   889   3   5/13/2009  
AN3263 — Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages   NXP   pdf   8024   0   6/07/2006