Ultra-low Power, Low Latency Audio for Wireless Gaming Headphone

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Product Details

Block Diagram

NxH3x70

NxH3x70 Block Diagram

Features

Key Features

  • Bluetooth® Low Energy 4.2 certified with proprietary audio streaming extension
  • Programmable TX output power of −10 dBm to +4 dBm in 2 dB steps
  • Sensitivity −90 dBm in Bluetooth LE 2 Mbps modulation mode and −94 dBm in Bluetooth LE 1 Mbps modulation mode
  • Industry-lowest current consumption of RX current < 4 mA at 1.2V and TX current < 7 mA (0 dBm output power) at 1.2V
  • Integrated audio interfaces and audio processing
  • WLCSP package < 7.25 mm2 with 34 bumps
  • Low number of external passive components
  • Pb-free and compliant with RoHS Directive 2011/65/EU (RoHS 2)
  • Operating temperature -20 °C to +85 °C

Part numbers include: NXH3670ADK, NXH3670SDK, NXH3670UK.

Wireless Audio Modules

Documentation

Quick reference to our documentation types.

1-5 of 8 documents

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Design Resources

Hardware

2 hardware offerings

Software

1 software file

Note: For better experience, software downloads are recommended on desktop.

Engineering Services

1-5 of 9 engineering services

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To find a complete list of our partners that support this product, please see our Partner Marketplace.

Training

1 trainings

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