BAP64-04,215

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of BAP64-04,215Last Revision (GMT):
Thursday, 22 July 2021, 09:50:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
BAP64-04,215SOT23TO-236AB7.550505 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9340 556 882152021-07-05151 / Unlimited26030 sec.1 / Unlimited24020 sec.3Guangdong, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.01050499.9900000.139116
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000014
Subtotal0.010505100.00000000.139130
Copper Lead-Frame, Pre-Plated AgCopper AlloyAluminum and its compoundsAluminum, metal7429-90-50.0022140.1050000.029321
Chromium and Chromium III compoundsChromium, metal7440-47-30.0053980.2560000.071488
Cobalt and its compoundsCobalt, metal7440-48-40.0105420.5000000.139624
Inorganic Silicon compoundsSilicon7440-21-30.0063680.3020000.084333
Inorganic compoundsCarbon7440-44-00.0009700.0460000.012845
Inorganic compoundsSulfur7704-34-90.0004850.0230000.006423
Iron and its compoundsIron, metal7439-89-61.17551455.75200015.568683
Manganese and its compoundsManganese, metal7439-96-50.0210640.9990000.278970
Nickel and its compoundsNickel, metal7440-02-00.88543141.99400011.726777
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0004850.0230000.006423
Subtotal2.108470100.000000027.924887
Copper PlatingCopper and its compoundsCopper, metal7440-50-80.27853799.9900003.688987
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000280.0100000.000369
Subtotal0.278565100.00000003.689356
Silver PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000060.0100000.000083
Silver and its compoundsSilver, metal7440-22-40.06295999.9900000.833834
Subtotal0.062965100.00000000.833918
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins0.71700015.0000009.496054
Inorganic Silicon compoundsSilicon dioxide7631-86-93.44160072.00000045.581057
Inorganic compoundsCarbon Black1333-86-40.0239000.5000000.316535
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0956002.0000001.266140
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.47800010.0000006.330702
Phosphorus compoundsTriphenyl phosphine603-35-00.0239000.5000000.316535
Subtotal4.780000100.000000063.307024
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0000210.0100000.000278
Bismuth and its compoundsBismuth, metal7440-69-90.0000420.0200000.000556
Iron and its compoundsIron, metal7439-89-60.0000210.0100000.000278
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000210.0100000.000278
Tin and its compoundsTin, metal7440-31-50.20989599.9500002.779880
Subtotal0.210000100.00000002.781271
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-30.09800098.0000001.297926
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0020002.0000000.026488
Subtotal0.100000100.00000001.324415
Total7.550505100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 BAP64-04,215
Product content declaration of BAP64-04,215
上次修订 Last Revision (GMT):
Thursday, 22 July 2021, 09:50:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜合金
Copper Alloy
OOOOOO

镀铜
Copper Plating
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of BAP64-04_215Last Revision (GMT):
Thursday, 22 July 2021, 09:50:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Test Report
19 Apr 2021
Copper Lead-Frame, Pre-Plated AgAG PLATINGTest Report
8 Aug 2019
Test Report
8 Aug 2019
Test Report
8 Aug 2019
Test Report
8 Aug 2019
CU PLATINGTest Report
27 Jul 2019
Test Report
27 Jul 2019
Test Report
27 Jul 2019
Test Report
27 Jul 2019
YEF42Test Report
18 Jun 2019
Test Report
18 Jun 2019
Test Report
24 Jun 2019
Test Report
24 Jun 2019
Die EncapsulantTest Report
27 May 2020
Test Report
27 May 2020
Test Report
27 May 2020
Test Report
27 May 2020
Post-plating - Lead FreeTest Report
27 Nov 2020
Test Report
27 Nov 2020
Test Report
31 May 2019
Test Report
27 Nov 2020
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.