BAP64-06W,115

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of BAP64-06W,115Last Revision (GMT):
Thursday, 08 April 2021, 02:40:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
BAP64-06W,115SOT323SC-705.481900 mg YesYesYesTin (Sn)Alloy42e3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9340 565 451152021-01-2781 / Unlimited26030 sec.1 / Unlimited24020 sec.3Seremban, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.01189999.9900000.217056
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000022
Subtotal0.011900100.00000000.217078
Die EncapsulantDie EncapsulantEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.66980019.70000012.218391
Inorganic Silicon compoundsSilica, vitreous60676-86-02.41400071.00000044.035827
Inorganic compoundsCarbon Black1333-86-40.0102000.3000000.186067
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.3060009.0000005.582006
Subtotal3.400000100.000000062.022292
Iron Lead-Frame, Pre-PlatedIron Lead-Frame, Pre-PlatedAluminum and its compoundsAluminum, metal7429-90-50.0016200.0900000.029552
Chromium and Chromium III compoundsChromium, metal7440-47-30.0037800.2100000.068954
Cobalt and its compoundsCobalt, metal7440-48-40.0075600.4200000.137908
Copper and its compoundsCopper, metal7440-50-80.23490013.0500004.285011
Inorganic Silicon compoundsSilicon7440-21-30.0045000.2500000.082088
Inorganic compoundsCarbon7440-44-00.0007200.0400000.013134
Inorganic compoundsProprietary Material - Other inorganic compounds0.0003600.0200000.006567
Iron and its compoundsIron, metal7439-89-60.84906047.17000015.488425
Manganese and its compoundsManganese, metal7439-96-50.0153000.8500000.279100
Nickel and its compoundsNickel, metal7440-02-00.63972035.54000011.669677
Phosphorus compoundsProprietary Material-Other inorganic phosphorous compounds0.0003600.0200000.006567
Silver and its compoundsSilver, metal7440-22-40.0421202.3400000.768347
Subtotal1.800000100.000000032.835331
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0000060.0030000.000115
Bismuth and its compoundsBismuth, metal7440-69-90.0000020.0010000.000038
Copper and its compoundsCopper, metal7440-50-80.0000020.0010000.000038
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000100.0050000.000191
Tin and its compoundsTin, metal7440-31-50.20997999.9900003.830405
Subtotal0.210000100.00000003.830789
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-30.05880098.0000001.072621
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0012002.0000000.021890
Subtotal0.060000100.00000001.094511
Total5.481900100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 BAP64-06W,115
Product content declaration of BAP64-06W,115
上次修订 Last Revision (GMT):
Thursday, 08 April 2021, 02:40:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
铁铅框架,预镀
Iron Lead-Frame, Pre-Plated
铁铅框架,预镀
Iron Lead-Frame, Pre-Plated
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of BAP64-06W_115Last Revision (GMT):
Thursday, 08 April 2021, 02:40:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
28 Apr 2020
Test Report
28 Apr 2020
Test Report
28 Apr 2020
Test Report
28 Apr 2020
Die EncapsulantTest Report
24 Feb 2020
Test Report
24 Feb 2020
Test Report
24 Feb 2020
Test Report
24 Feb 2020
Iron Lead-Frame, Pre-PlatedNot AvailableNot AvailableNot AvailableNot Available
Post-plating - Lead FreeTest Report
20 Jun 2019
Test Report
20 Jun 2019
Test Report
20 Jun 2019
Test Report
20 Jun 2019
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.