MC35XS3400CHFK

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of MC35XS3400CHFK
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
MC35XS3400CHFKSOT1631-2HQFN24931.351239 mg YesNoYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9340 704 725572019-10-044Not ApplicableNot ApplicableNot Applicable3 | 168 hours24530 sec.3Tianjin, China
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-512.901246100.0000001.385218
Subtotal12.901246100.00000001.385218
Bonding Wire - AuGold and its compoundsGold, metal7440-57-52.299993100.0000000.246952
Subtotal2.299993100.00000000.246952
Copper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-8174.90129997.22140018.779306
Gold and its compoundsGold, metal7440-57-50.0160110.0089000.001719
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0026980.0015000.000290
Nickel and its compoundsNickel, metal7440-02-02.9433441.6361000.316029
Palladium and its compoundsPalladium, metal7440-05-30.0714200.0397000.007668
Silver and its compoundsSilver, metal7440-22-41.7865870.9931000.191827
Zinc and its compoundsZinc, metal7440-66-60.1786410.0993000.019181
Subtotal179.900000100.000000019.316021
Die EncapsulantBismuth and its compoundsBismuth, metal7440-69-97.0094320.9975000.752609
Epoxy ResinsProprietary Material-Other Epoxy resins52.5710957.4813005.644605
Inorganic Silicon compoundsSilica, vitreous60676-86-0595.80527684.78800063.972135
Inorganic compoundsCarbon Black1333-86-42.1031810.2993000.225820
Organic Phosphorus compoundsOther organic phosphorous compounds6.6587850.9476000.714960
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins38.5522305.4863004.139387
Subtotal702.700000100.000000075.449516
Epoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.1389953.3094000.014924
AcrylatesProprietary Material-Other acrylates0.3706588.8252000.039798
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.1389953.3094000.014924
Palladium and its compoundsPalladium, metal7440-05-30.0069510.1655000.000746
PolymersProprietary Material-Other polymers0.0694971.6547000.007462
Silver and its compoundsSilver, metal7440-22-43.47490482.7358000.373103
Subtotal4.200000100.00000000.450958
Semiconductor Die 1Inorganic Silicon compoundsSilicon, doped14.70000098.0000001.578352
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3000002.0000000.032211
Subtotal15.000000100.00000001.610563
Semiconductor Die 2Inorganic Silicon compoundsSilicon, doped7.59500098.0000000.815482
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1550002.0000000.016643
Subtotal7.750000100.00000000.832124
Solder WireLead and its compoundsLead, metallic lead and lead alloys7439-92-16.10500092.5000000.655499
Silver and its compoundsSilver, metal7440-22-40.1650002.5000000.017716
Tin and its compoundsTin, metal7440-31-50.3300005.0000000.035432
Subtotal6.600000100.00000000.708648
Total931.351239100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MC35XS3400CHFK
产品内容声明 MC35XS3400CHFK
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - Al
焊丝-铝
OOOOOO
Bonding Wire - Au
焊丝-金
OOOOOO
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Semiconductor Die 1
半导体芯片
OOOOOO
Semiconductor Die 2
半导体芯片
OOOOOO
Solder Wire
焊丝
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MC35XS3400CHFK
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
16 Oct 2019
Test Report
16 Oct 2019
Test Report
16 Oct 2019
Test Report
16 Oct 2019
Bonding Wire - AuTest Report
30 Jan 2019
Test Report
30 Jan 2019
Test Report
30 Jan 2019
Test Report
30 Jan 2019
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
24 Oct 2019
Test Report
24 Oct 2019
Test Report
24 Oct 2019
Not Available
NI PLATINGTest Report
24 Oct 2019
Test Report
24 Oct 2019
Test Report
24 Oct 2019
Not Available
PD PLATINGTest Report
24 Oct 2019
Test Report
24 Oct 2019
Test Report
24 Oct 2019
Not Available
Die EncapsulantNot AvailableNot AvailableNot AvailableNot Available
Epoxy AdhesiveTest Report
1 Apr 2019
Test Report
1 Apr 2019
Test Report
15 Jun 2018
Not Available
Semiconductor Die 1Test Report
20 May 2019
Test Report
20 May 2019
Test Report
20 May 2019
Test Report
20 May 2019
Semiconductor Die 2Test Report
29 May 2018
Test Report
29 May 2018
Test Report
29 May 2018
Test Report
20 May 2019
Solder WireNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.