MC06XS3517AFKR2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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Product content declaration of MC06XS3517AFKR2
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
MC06XS3517AFKR2SOT1631-8HQFN24926.420121 mg YesNoYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9340 704 835282019-10-042Not ApplicableNot ApplicableNot Applicable3 | 168 hours26040 sec.3Tianjin, China
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - Au 1Gold and its compoundsGold, metal7440-57-52.142674100.0000000.231285
Subtotal2.142674100.00000000.231285
Bonding Wire - Au 2Aluminum and its compoundsAluminum, metal7429-90-50.027447100.0000000.002963
Subtotal0.027447100.00000000.002963
Copper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-8416.88536397.22140044.999602
Gold and its compoundsGold, metal7440-57-50.0381630.0089000.004119
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0064320.0015000.000694
Nickel and its compoundsNickel, metal7440-02-07.0155971.6361000.757280
Palladium and its compoundsPalladium, metal7440-05-30.1702340.0397000.018375
Silver and its compoundsSilver, metal7440-22-44.2584130.9931000.459663
Zinc and its compoundsZinc, metal7440-66-60.4257980.0993000.045962
Subtotal428.800000100.000000046.285696
Die EncapsulantEpoxy ResinsOther Epoxy resins18.6884004.0000002.017270
Inorganic Silicon compoundsSilica, vitreous60676-86-0425.16110091.00000045.892904
Inorganic compoundsCarbon Black1333-86-44.6721001.0000000.504318
Miscellaneous substancesProprietary Material-Other miscellaneous substances.4.6721001.0000000.504318
Phenols and Phenolic ResinsOther phenolic resins14.0163003.0000001.512953
Subtotal467.210000100.000000050.431763
Epoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.0473243.3094000.005108
AcrylatesProprietary Material-Other acrylates0.1262008.8252000.013622
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.0473243.3094000.005108
Palladium and its compoundsPalladium, metal7440-05-30.0023670.1655000.000255
PolymersProprietary Material-Other polymers0.0236621.6547000.002554
Silver and its compoundsSilver, metal7440-22-41.18312282.7358000.127709
Subtotal1.430000100.00000000.154358
Semiconductor Die 1Inorganic Silicon compoundsSilicon, doped14.79800098.0000001.597331
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3020002.0000000.032599
Subtotal15.100000100.00000001.629930
Semiconductor Die 2Inorganic Silicon compoundsSilicon, doped9.11400098.0000000.983787
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1860002.0000000.020077
Subtotal9.300000100.00000001.003864
Solder WireLead and its compoundsLead, metallic lead and lead alloys7439-92-12.22925092.5000000.240631
Silver and its compoundsSilver, metal7440-22-40.0602502.5000000.006503
Tin and its compoundsTin, metal7440-31-50.1205005.0000000.013007
Subtotal2.410000100.00000000.260141
Total926.420121100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MC06XS3517AFKR2
产品内容声明 MC06XS3517AFKR2
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - Au 1
焊丝-金
OOOOOO
Bonding Wire - Au 2
焊丝-金
OOOOOO
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Semiconductor Die 1
半导体芯片
OOOOOO
Semiconductor Die 2
半导体芯片
OOOOOO
Solder Wire
焊丝
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MC06XS3517AFKR2
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - Au 1Test Report
30 Jan 2019
Test Report
30 Jan 2019
Test Report
30 Jan 2019
Test Report
30 Jan 2019
Bonding Wire - Au 2Test Report
16 Oct 2019
Test Report
16 Oct 2019
Test Report
16 Oct 2019
Test Report
16 Oct 2019
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
24 Oct 2019
Test Report
24 Oct 2019
Test Report
24 Oct 2019
Not Available
NI PLATINGTest Report
24 Oct 2019
Test Report
24 Oct 2019
Test Report
24 Oct 2019
Not Available
PD PLATINGTest Report
24 Oct 2019
Test Report
24 Oct 2019
Test Report
24 Oct 2019
Not Available
Die EncapsulantTest Report
9 Sep 2019
Test Report
9 Sep 2019
Test Report
9 Sep 2019
Test Report
9 Sep 2019
Epoxy AdhesiveTest Report
1 Apr 2019
Test Report
1 Apr 2019
Test Report
15 Jun 2018
Not Available
Semiconductor Die 1Test Report
29 May 2018
Test Report
29 May 2018
Test Report
29 May 2018
Test Report
20 May 2019
Semiconductor Die 2Test Report
20 May 2019
Test Report
20 May 2019
Test Report
20 May 2019
Test Report
20 May 2019
Solder WireNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.