MC10XS3535DHFKR2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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Product content declaration of MC10XS3535DHFKR2
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
MC10XS3535DHFKR2SOT1631-3HQFN24917.672052 mg YesNoYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9340 705 795282019-11-064Not ApplicableNot ApplicableNot Applicable3 | 168 hours26040 sec.3Tianjin, China
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - Au 1Copper and its compoundsCopper, metal7440-50-81.12106098.8200000.122163
Gold and its compoundsGold, metal7440-57-50.0009080.0800000.000099
Palladium and its compoundsPalladium, metal7440-05-30.0124791.1000000.001360
Subtotal1.134446100.00000000.123622
Bonding Wire - Au 2Aluminum and its compoundsAluminum, metal7429-90-512.901246100.0000001.405867
Subtotal12.901246100.00000001.405867
Copper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-8174.91281297.22780019.060492
Gold and its compoundsGold, metal7440-57-50.0539700.0300000.005881
Nickel and its compoundsNickel, metal7440-02-04.3215582.4022000.470926
Palladium and its compoundsPalladium, metal7440-05-30.3418100.1900000.037248
Zirconium and its compoundsZirconium, metal7440-67-70.2698500.1500000.029406
Subtotal179.900000100.000000019.603953
Die EncapsulantBismuth and its compoundsBismuth, metal7440-69-97.0094320.9975000.763828
Epoxy ResinsProprietary Material-Other Epoxy resins52.5710957.4813005.728745
Inorganic Silicon compoundsSilica, vitreous60676-86-0595.80527684.78800064.925730
Inorganic compoundsCarbon Black1333-86-42.1031810.2993000.229187
Organic Phosphorus compoundsOther organic phosphorous compounds6.6587850.9476000.725617
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins38.5522305.4863004.201090
Subtotal702.700000100.000000076.574196
Epoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.1389953.3094000.015147
AcrylatesProprietary Material-Other acrylates0.3706588.8252000.040391
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.1389953.3094000.015147
Palladium and its compoundsPalladium, metal7440-05-30.0069510.1655000.000758
PolymersProprietary Material-Other polymers0.0694971.6547000.007573
Silver and its compoundsSilver, metal7440-22-43.47490482.7358000.378665
Subtotal4.200000100.00000000.457680
Semiconductor Die 1Inorganic Silicon compoundsSilicon, doped6.11163398.0000000.665993
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1247272.0000000.013592
Subtotal6.236360100.00000000.679585
Semiconductor Die 2Inorganic Silicon compoundsSilicon, doped3.92000098.0000000.427168
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0800002.0000000.008718
Subtotal4.000000100.00000000.435886
Solder WireLead and its compoundsLead, metallic lead and lead alloys7439-92-16.10500092.5000000.665270
Silver and its compoundsSilver, metal7440-22-40.1650002.5000000.017980
Tin and its compoundsTin, metal7440-31-50.3300005.0000000.035961
Subtotal6.600000100.00000000.719211
Total917.672052100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MC10XS3535DHFKR2
产品内容声明 MC10XS3535DHFKR2
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - Au 1
焊丝-金
OOOOOO
Bonding Wire - Au 2
焊丝-金
OOOOOO
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Semiconductor Die 1
半导体芯片
OOOOOO
Semiconductor Die 2
半导体芯片
OOOOOO
Solder Wire
焊丝
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MC10XS3535DHFKR2
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - Au 1Test Report
18 Feb 2019
Test Report
18 Feb 2019
Test Report
18 Feb 2019
Test Report
18 Feb 2019
Bonding Wire - Au 2Test Report
16 Oct 2019
Test Report
16 Oct 2019
Test Report
16 Oct 2019
Test Report
16 Oct 2019
Copper Lead-Frame, Pre-PlatedNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantNot AvailableNot AvailableNot AvailableNot Available
Epoxy AdhesiveTest Report
1 Apr 2019
Test Report
1 Apr 2019
Test Report
15 Jun 2018
Not Available
Semiconductor Die 1Test Report
29 May 2018
Test Report
29 May 2018
Test Report
29 May 2018
Test Report
20 May 2019
Semiconductor Die 2Test Report
20 May 2019
Test Report
20 May 2019
Test Report
20 May 2019
Test Report
20 May 2019
Solder WireNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.