MC10XS3425EKR2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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Product content declaration of MC10XS3425EKR2
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
MC10XS3425EKR2SOT1746-2HSOP32488.631824 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9340 706 125182019-04-0733 | 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire 1Copper and its compoundsCopper, metal7440-50-80.68238698.8200000.139652
Gold and its compoundsGold, metal7440-57-50.0005520.0800000.000113
Palladium and its compoundsPalladium, metal7440-05-30.0075961.1000000.001554
Subtotal0.690534100.00000000.141320
Bonding Wire 2Aluminum and its compoundsAluminum, metal7429-90-512.701290100.0000002.599358
Subtotal12.701290100.00000002.599358
Copper Lead-FrameCopper and its compoundsCopper, metal7440-50-8108.73412496.39550022.252772
Iron and its compoundsIron, metal7439-89-62.6508002.3500000.542494
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0191760.0170000.003924
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0930600.0825000.019045
Silver and its compoundsSilver, metal7440-22-41.1280001.0000000.230849
Tin and its compoundsTin, metal7440-31-50.0338400.0300000.006926
Zinc and its compoundsZinc, metal7440-66-60.1410000.1250000.028856
Subtotal112.800000100.000000023.084866
Die EncapsulantAcrylonitrile compoundsAcrylonitrile/Butadiene copolymer, carboxyl terminated (26/74)68891-46-30.3326800.1000000.068084
Epoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-27.3189602.2000001.497848
Epoxy ResinsProprietary Material-Other Epoxy resins10.9784403.3000002.246771
Inorganic Silicon compoundsSilica, vitreous60676-86-0285.43944085.80000058.416056
Inorganic Silicon compoundsSilicon dioxide7631-86-913.3072004.0000002.723359
Inorganic compoundsCarbon Black1333-86-40.9980400.3000000.204252
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins14.3052404.3000002.927611
Subtotal332.680000100.000000068.083981
Epoxy Adhesive 1Cyanide compoundsPolymethylene polyphenyl isocyanate (PAPI)9016-87-90.0080580.5100000.001649
Epoxy ResinsOther Non-halogenated Epoxy resins0.0688254.3560000.014085
Organic Tin compounds - SpecificDibutyltin dilaurate77-58-70.0005370.0340000.000110
Organic compoundsAlkanes, C14-1690622-46-10.22120014.0000000.045269
Polymers1,3-Benzenedicarboxylic acid, polymer with 1,4-benzenedicarboxylic acid, 1,4-butanediol and hexanedioic acid66027-02-90.0805805.1000000.016491
Silver and its compoundsSilver, metal7440-22-41.20080076.0000000.245747
Subtotal1.580000100.00000000.323352
Epoxy Adhesive 2Inorganic Silicon compoundsSilicon dioxide7631-86-91.31400060.0000000.268914
Organic Silicon compounds3-(trimethoxysilyl)propyl methacrylate2530-85-00.1095005.0000000.022409
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.1095005.0000000.022409
Organic compoundsOther Bismaleimides0.43800020.0000000.089638
Polymers1-Methoxy-2-propyl acetate108-65-60.21900010.0000000.044819
Subtotal2.190000100.00000000.448190
Post-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0032380.0200000.000663
Tin and its compoundsTin, metal7440-31-516.18676299.9800003.312670
Subtotal16.190000100.00000003.313333
Semiconductor Die 1Inorganic Silicon compoundsSilicon, doped7.74200098.0000001.584424
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1580002.0000000.032335
Subtotal7.900000100.00000001.616759
Semiconductor Die 2Inorganic Silicon compoundsSilicon, doped1.86200098.0000000.381064
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0380002.0000000.007777
Subtotal1.900000100.00000000.388841
Total488.631824100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MC10XS3425EKR2
产品内容声明 MC10XS3425EKR2
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire 1
焊线
OOOOOO
Bonding Wire 2
焊线
OOOOOO
Copper Lead-Frame
铜引线框架
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive 1
环氧树脂粘合剂
OOOOOO
Epoxy Adhesive 2
环氧树脂粘合剂
OOOOOO
Post-plating - Lead Free
封装后电镀- 无铅
OOOOOO
Semiconductor Die 1
半导体芯片
OOOOOO
Semiconductor Die 2
半导体芯片
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MC10XS3425EKR2
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire 1Test Report
18 Feb 2019
Test Report
18 Feb 2019
Test Report
18 Feb 2019
Test Report
18 Feb 2019
Bonding Wire 2Test Report
24 Oct 2018
Test Report
24 Oct 2018
Test Report
24 Oct 2018
Test Report
24 Oct 2018
Copper Lead-FrameTest Report
12 Mar 2019
Test Report
12 Mar 2019
Test Report
12 Mar 2019
Test Report
12 Mar 2019
Die EncapsulantTest Report
18 May 2018
Test Report
18 May 2018
Test Report
18 May 2018
Test Report
18 May 2018
Epoxy Adhesive 1Test Report
30 Oct 2018
Test Report
30 Oct 2018
Test Report
2 Apr 2019
Not Available
Epoxy Adhesive 2Test Report
25 Sep 2019
Test Report
25 Sep 2019
Test Report
18 Oct 2018
Not Available
Post-plating - Lead FreeTest Report
17 Aug 2018
Test Report
14 Mar 2018
Test Report
17 Aug 2018
Test Report
17 Aug 2018
Semiconductor Die 1Not AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 2Not AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.