GTL2002DC,125

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of GTL2002DC,125Last Revision (GMT):
Sunday, 04 April 2021, 11:18:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
GTL2002DC,125SOT765VSSOP89.364278 mg NoYesYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 774 981252021-01-0481 / Unlimited26030 sec.1 / Unlimited24020 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuAluminum and its compoundsAluminum, metal7429-90-50.0000010.0010000.000006
Beryllium and its compoundsBeryllium, metal7440-41-70.0000010.0010000.000006
Copper and its compoundsCopper, metal7440-50-80.0000010.0010000.000006
Gold and its compoundsGold, metal7440-57-50.05427199.9930000.579588
Iron and its compoundsIron, metal7439-89-60.0000010.0010000.000006
Magnesium and its compoundsMagnesium, metal7439-95-40.0000010.0010000.000006
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0010000.000006
Silver and its compoundsSilver, metal7440-22-40.0000010.0010000.000006
Subtotal0.054278100.00000000.579628
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-82.33928097.47000024.980890
Iron and its compoundsIron, metal7439-89-60.0576002.4000000.615104
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0007200.0300000.007689
Zinc and its compoundsZinc, metal7440-66-60.0024000.1000000.025629
Subtotal2.400000100.000000025.629312
Die EncapsulantDie EncapsulantAntimony OxidesAntimony(III) oxide1309-64-40.0952001.7000001.016629
Epoxy ResinsProprietary Material-Other Epoxy resins0.95200017.00000010.166294
Halogenated Organic CompoundsProprietary Material-Other brominated organic hydrocarbons0.0728001.3000000.777423
Inorganic Silicon compoundsQuartz14808-60-74.48000080.00000047.841382
Subtotal5.600000100.000000059.801727
Epoxy AdhesiveEpoxy AdhesiveCopper and its compoundsCupric oxide1317-38-00.0250002.5000000.266972
Inorganic Silicon compoundsSilicon dioxide, syntetic112945-52-50.0002000.0200000.002136
PolymersPlastic: EP - Epoxide, Epoxy0.20480020.4800002.187035
Silver and its compoundsSilver, metal7440-22-40.77000077.0000008.222737
Subtotal1.000000100.000000010.678880
Pre-plating - Precious metal - NiPdAuPre-plating - Precious metal - NiPdAuGold and its compoundsGold, metal7440-57-50.0017001.0000000.018154
Nickel and its compoundsNickel, metal7440-02-00.16490097.0000001.760947
Palladium and its compoundsPalladium, metal7440-05-30.0034002.0000000.036308
Subtotal0.170000100.00000001.815410
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-30.13720098.0000001.465142
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0028002.0000000.029901
Subtotal0.140000100.00000001.495043
Total9.364278100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 GTL2002DC,125
Product content declaration of GTL2002DC,125
上次修订 Last Revision (GMT):
Sunday, 04 April 2021, 11:18:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of GTL2002DC_125Last Revision (GMT):
Sunday, 04 April 2021, 11:18:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Copper Lead-Frame, Pre-Plated NiPdAuAU PLATINGTest Report
19 Oct 2020
Test Report
19 Oct 2020
Test Report
19 Oct 2020
Test Report
19 Oct 2020
C194Test Report
19 Oct 2020
Test Report
19 Oct 2020
Test Report
19 Oct 2020
Test Report
19 Oct 2020
NI PLATINGTest Report
19 Oct 2020
Test Report
19 Oct 2020
Test Report
19 Oct 2020
Test Report
19 Oct 2020
PD PLATINGTest Report
19 Oct 2020
Test Report
19 Oct 2020
Test Report
19 Oct 2020
Test Report
19 Oct 2020
Die EncapsulantTest Report
12 Aug 2020
Test Report
12 Aug 2020
Not AvailableNot Available
Epoxy AdhesiveTest Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
1 Apr 2019
Pre-plating - Precious metal - NiPdAuNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.