PCA9510ADP,118

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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Product content declaration of PCA9510ADP,118
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
PCA9510ADP,118SOT505TSSOP829.074500 mg YesYesYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9352 798 441182012-05-1551 | Unlimited26030 sec.1 | Unlimited24020 sec.3Bangkok, Thailand
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - AuAluminum and its compoundsAluminum, metal7429-90-50.0000010.0010000.000003
Beryllium and its compoundsBeryllium, metal7440-41-70.0000010.0010000.000003
Copper and its compoundsCopper, metal7440-50-80.0000010.0010000.000003
Gold and its compoundsGold, metal7440-57-50.09449499.9930000.325004
Iron and its compoundsIron, metal7439-89-60.0000010.0010000.000003
Magnesium and its compoundsMagnesium, metal7439-95-40.0000010.0010000.000003
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0010000.000003
Silver and its compoundsSilver, metal7440-22-40.0000010.0010000.000003
Subtotal0.094500100.00000000.325027
Copper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-814.55000097.00000050.043853
Nickel and its compoundsNickel, metal7440-02-00.4500003.0000001.547748
Subtotal15.000000100.000000051.591601
Die EncapsulantBoron and its compoundsTetraphenylphosphonium tetraphenylborate15525-15-20.0650000.5000000.223564
Epoxy Resins2,5-Di-tert-butyl-1,4-phenylenebis(oxymethyloxirane)64777-22-60.2600002.0000000.894254
Epoxy ResinsProprietary Material-Other Epoxy resins0.2600002.0000000.894254
Inorganic Silicon compoundsSilica, vitreous60676-86-011.18000086.00000038.452940
Inorganic compoundsCarbon Black1333-86-40.0650000.5000000.223564
Magnesium and its compoundsMagnesium Aluminum Hydroxide Carbonate11097-59-90.0650000.5000000.223564
Magnesium and its compoundsMagnesium dihydroxide1309-42-80.1950001.5000000.670691
Organic Silicon compoundsOther organic Silicon Compounds0.0650000.5000000.223564
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.0650000.5000000.223564
Organic compoundsOther organic compounds.0.0650000.5000000.223564
Phenols and Phenolic ResinsPhenol polymer with 4, 4'- bis (methoxymethyl)- 1, 1'-bisphenyl205830-20-20.5200004.0000001.788509
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.1300001.0000000.447127
Zinc and its compoundsZinc Hydroxide20427-58-10.0650000.5000000.223564
Subtotal13.000000100.000000044.712721
Epoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.0033093.3094000.011383
AcrylatesProprietary Material-Other acrylates0.0088258.8252000.030354
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.0033093.3094000.011383
Palladium and its compoundsPalladium, metal7440-05-30.0001660.1655000.000569
PolymersProprietary Material-Other polymers0.0016551.6547000.005691
Silver and its compoundsSilver, metal7440-22-40.08273682.7358000.284565
Subtotal0.100000100.00000000.343944
Pre-plating - Precious metal - NiPdAuGold and its compoundsGold, metal7440-57-50.0030001.0000000.010318
Nickel and its compoundsNickel, metal7440-02-00.29100097.0000001.000877
Palladium and its compoundsPalladium, metal7440-05-30.0060002.0000000.020637
Subtotal0.300000100.00000001.031832
Semiconductor DieInorganic Silicon compoundsSilicon7440-21-30.56840098.0000001.954978
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0116002.0000000.039898
Subtotal0.580000100.00000001.994875
Total29.074500100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of PCA9510ADP,118
产品内容声明 PCA9510ADP,118
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - Au
焊丝-金
OOOOOO
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Pre-plating - Precious metal - NiPdAu
预电镀-贵金属-镍钯金
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of PCA9510ADP_118
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
26 Sep 2019
Test Report
26 Sep 2019
Test Report
26 Sep 2019
Test Report
26 Sep 2019
Copper Lead-Frame, Pre-Plated NiPdAuTest Report
21 Jun 2019
Test Report
21 Jun 2019
Test Report
21 Jun 2019
Test Report
21 Jun 2019
Die EncapsulantTest Report
5 Feb 2020
Test Report
5 Feb 2020
Test Report
5 Feb 2020
Test Report
5 Feb 2020
Epoxy AdhesiveTest Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
23 Mar 2020
Pre-plating - Precious metal - NiPdAuAU PLATINGTest Report
16 Nov 2018
Test Report
16 Nov 2018
Test Report
16 Nov 2018
Test Report
16 Nov 2018
NI PLATINGTest Report
18 Nov 2018
Test Report
18 Nov 2018
Test Report
18 Nov 2018
Test Report
18 Nov 2018
PD PLATINGTest Report
16 Nov 2018
Test Report
16 Nov 2018
Test Report
16 Nov 2018
Test Report
16 Nov 2018
Semiconductor DieTest Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.