LPC2478FBD208K

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of LPC2478FBD208KLast Revision (GMT):
Saturday, 03 April 2021, 05:57:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC2478FBD208KSOT459-1LQFP2082553.925620 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 840 695572020-05-2052 / 1 year26030 sec.2 / 1 year22520 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-82.19134199.9900000.085803
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002190.0100000.000009
Subtotal2.191560100.00000000.085811
Copper Lead-Frame, Pre-Plated AgCopper Lead-Frame, Pre-Plated AgCopper and its compoundsCopper, metal7440-50-8628.05576095.01600024.591780
Inorganic Silicon compoundsSilicon7440-21-34.8253000.7300000.188937
Iron and its compoundsIron, metal7439-89-60.8394700.1270000.032870
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.1983000.0300000.007764
Magnesium and its compoundsMagnesium, metal7439-95-41.1699700.1770000.045811
Manganese and its compoundsManganese, metal7439-96-50.3966000.0600000.015529
Nickel and its compoundsNickel, metal7440-02-021.3503003.2300000.835980
Zinc and its compoundsZinc, metal7440-66-64.1643000.6300000.163055
Subtotal661.000000100.000000025.881725
Die EncapsulantDie EncapsulantEpoxy ResinsOther Epoxy resins28.5324001.5600001.117198
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-666.5756003.6400002.606795
Inorganic Silicon compoundsSilica, vitreous60676-86-01437.77690078.61000056.296741
Inorganic Silicon compoundsSilicon dioxide7631-86-9159.8546008.7400006.259172
Inorganic compoundsCarbon Black1333-86-43.1093000.1700000.121746
Miscellaneous substancesOther miscellaneous substances (less than 10%).56.8819003.1100002.227234
Phenols and Phenolic ResinsOther phenolic resins5.6699000.3100000.222007
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-670.5994003.8600002.764348
Subtotal1829.000000100.000000071.615241
Epoxy AdhesiveEpoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.1290673.3094000.005054
AcrylatesProprietary Material-Other acrylates0.3441838.8252000.013477
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.1290673.3094000.005054
Palladium and its compoundsPalladium, metal7440-05-30.0064550.1655000.000253
PolymersProprietary Material-Other polymers0.0645331.6547000.002527
Silver and its compoundsSilver, metal7440-22-43.22669682.7358000.126343
Subtotal3.900000100.00000000.152706
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0009000.0030000.000035
Bismuth and its compoundsBismuth, metal7440-69-90.0003000.0010000.000012
Copper and its compoundsCopper, metal7440-50-80.0003000.0010000.000012
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0015000.0050000.000059
Tin and its compoundsTin, metal7440-31-529.99700099.9900001.174545
Subtotal30.000000100.00000001.174662
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0002900.0100000.000011
Silver and its compoundsSilver, metal7440-22-42.89971099.9900000.113539
Subtotal2.900000100.00000000.113551
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-324.43537998.0000000.956777
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4986812.0000000.019526
Subtotal24.934060100.00000000.976303
Total2553.925620100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC2478FBD208K
Product content declaration of LPC2478FBD208K
上次修订 Last Revision (GMT):
Saturday, 03 April 2021, 05:57:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC2478FBD208KLast Revision (GMT):
Saturday, 03 April 2021, 05:57:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
16 Jul 2020
Test Report
16 Jul 2020
Test Report
16 Jul 2020
Test Report
16 Jul 2020
Copper Lead-Frame, Pre-Plated AgAG PLATINGTest Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
C7025Test Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
Die EncapsulantTest Report
14 Dec 2020
Test Report
14 Dec 2020
Test Report
14 Dec 2020
Test Report
24 Dec 2019
Epoxy AdhesiveTest Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
23 Mar 2020
Post-plating - Lead FreeNot AvailableNot AvailableNot AvailableNot Available
Pre-plating - Precious metal - AgNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.