LPC2214FBD144/01K

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LPC2214FBD144/01KLast Revision (GMT):
Saturday, 03 April 2021, 07:59:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC2214FBD144/01KSOT486-1LQFP1441271.220220 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 848 935572020-10-1522 / 1 year26030 sec.2 / 1 year22520 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-81.55825499.9900000.122579
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001560.0100000.000012
Subtotal1.558410100.00000000.122592
Copper Lead-Frame, Pre-Plated AgCopper AlloyCopper and its compoundsCopper, metal7440-50-8334.78032595.01600026.335352
Inorganic Silicon compoundsSilicon7440-21-32.5720890.7300000.202332
Iron and its compoundsIron, metal7439-89-60.4474730.1270000.035200
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.1057020.0300000.008315
Magnesium and its compoundsMagnesium, metal7439-95-40.6236440.1770000.049059
Manganese and its compoundsManganese, metal7439-96-50.2114050.0600000.016630
Nickel and its compoundsNickel, metal7440-02-011.3806143.2300000.895251
Zinc and its compoundsZinc, metal7440-66-62.2197480.6300000.174616
Subtotal352.341000100.000000027.716756
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0003560.0100000.000028
Silver and its compoundsSilver, metal7440-22-43.55864499.9900000.279939
Subtotal3.559000100.00000000.279967
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins91.51828010.6000007.199247
Inorganic Silicon compoundsQuartz14808-60-7771.86172089.40000060.718175
Subtotal863.380000100.000000067.917422
Epoxy AdhesiveEpoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.1528943.3094000.012027
AcrylatesProprietary Material-Other acrylates0.4077248.8252000.032073
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.1528943.3094000.012027
Palladium and its compoundsPalladium, metal7440-05-30.0076460.1655000.000602
PolymersProprietary Material-Other polymers0.0764471.6547000.006014
Silver and its compoundsSilver, metal7440-22-43.82239482.7358000.300687
Subtotal4.620000100.00000000.363430
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0006310.0030000.000050
Bismuth and its compoundsBismuth, metal7440-69-90.0002100.0010000.000017
Copper and its compoundsCopper, metal7440-50-80.0002100.0010000.000017
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0010520.0050000.000083
Tin and its compoundsTin, metal7440-31-521.03789699.9900001.654937
Subtotal21.040000100.00000001.655103
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0004230.0100000.000033
Silver and its compoundsSilver, metal7440-22-44.22957799.9900000.332718
Subtotal4.230000100.00000000.332751
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-320.08197498.0000001.579740
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4098362.0000000.032240
Subtotal20.491810100.00000001.611980
Total1271.220220100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC2214FBD144/01K
Product content declaration of LPC2214FBD144/01K
上次修订 Last Revision (GMT):
Saturday, 03 April 2021, 07:59:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC2214FBD144_01KLast Revision (GMT):
Saturday, 03 April 2021, 07:59:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
16 Jul 2020
Test Report
16 Jul 2020
Test Report
16 Jul 2020
Test Report
16 Jul 2020
Copper Lead-Frame, Pre-Plated AgTest Report
12 Mar 2019
Test Report
12 Mar 2019
Test Report
12 Mar 2019
Test Report
12 Mar 2019
Die EncapsulantTest Report
22 May 2020
Test Report
22 May 2020
Test Report
22 May 2020
Test Report
22 May 2020
Epoxy AdhesiveTest Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
23 Mar 2020
Post-plating - Lead FreeTest Report
20 Jun 2019
Test Report
20 Jun 2019
Test Report
20 Jun 2019
Test Report
20 Jun 2019
Pre-plating - Precious metal - AgNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.