LPC1788FBD144,551

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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Product content declaration of LPC1788FBD144,551
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC1788FBD144,551SOT486-1LQFP1441260.665500 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9352 926 375512012-07-1152 | 1 year26030 sec.2 | 1 year24020 sec.3Kaohsiung, Taiwan
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - AuAluminum and its compoundsAluminum, metal7429-90-50.0000610.0010000.000005
Calcium and its compoundsCalcium7440-70-20.0001210.0020000.000010
Copper and its compoundsCopper, metal7440-50-80.0000610.0010000.000005
Gold and its compoundsGold, metal7440-57-55.99130898.8420000.475250
Iron and its compoundsIron, metal7439-89-60.0000610.0010000.000005
Magnesium and its compoundsMagnesium, metal7439-95-40.0000610.0010000.000005
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000610.0010000.000005
Palladium and its compoundsPalladium, metal7440-05-30.0697071.1500000.005529
Silver and its compoundsSilver, metal7440-22-40.0000610.0010000.000005
Subtotal6.061500100.00000000.480817
Copper Lead-Frame, Pre-Plated AgCopper and its compoundsCopper, metal7440-50-8345.22300097.00000027.384187
Nickel and its compoundsNickel, metal7440-02-010.6770003.0000000.846934
Subtotal355.900000100.000000028.231121
Die EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins101.32560012.0000008.037469
Inorganic Silicon compoundsOther silica compounds743.05440088.00000058.941440
Subtotal844.380000100.000000066.978909
Epoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.1528943.3094000.012128
AcrylatesProprietary Material-Other acrylates0.4077248.8252000.032342
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.1528943.3094000.012128
Palladium and its compoundsPalladium, metal7440-05-30.0076460.1655000.000607
PolymersProprietary Material-Other polymers0.0764471.6547000.006064
Silver and its compoundsSilver, metal7440-22-43.82239482.7358000.303204
Subtotal4.620000100.00000000.366473
Post-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0006310.0030000.000050
Bismuth and its compoundsBismuth, metal7440-69-90.0002100.0010000.000017
Copper and its compoundsCopper, metal7440-50-80.0002100.0010000.000017
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0010520.0050000.000083
Tin and its compoundsTin, metal7440-31-521.03789699.9900001.668793
Subtotal21.040000100.00000001.668960
Pre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0004230.0100000.000034
Silver and its compoundsSilver, metal7440-22-44.22957799.9900000.335504
Subtotal4.230000100.00000000.335537
Semiconductor DieInorganic Silicon compoundsSilicon nitride12033-89-524.434000100.0000001.938183
Subtotal24.434000100.00000001.938183
Total1260.665500100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of LPC1788FBD144,551
产品内容声明 LPC1788FBD144,551
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - Au
焊丝-金
OOOOOO
Copper Lead-Frame, Pre-Plated Ag
铜引线框架,预镀银
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Post-plating - Lead Free
封装后电镀- 无铅
OOOOOO
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of LPC1788FBD144_551
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
26 Sep 2019
Test Report
26 Sep 2019
Test Report
26 Sep 2019
Test Report
26 Sep 2019
Copper Lead-Frame, Pre-Plated AgTest Report
12 Mar 2019
Test Report
12 Mar 2019
Test Report
12 Mar 2019
Test Report
12 Mar 2019
Die EncapsulantTest Report
16 Oct 2019
Test Report
16 Oct 2019
Test Report
16 Oct 2019
Test Report
16 Oct 2019
Epoxy AdhesiveTest Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
1 Apr 2019
Test Report
23 Mar 2020
Post-plating - Lead FreeTest Report
20 Jun 2019
Test Report
20 Jun 2019
Test Report
20 Jun 2019
Test Report
20 Jun 2019
Pre-plating - Precious metal - AgTest Report
25 Dec 2017
Test Report
25 Dec 2017
Test Report
25 Dec 2017
Test Report
25 Dec 2017
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.