TJA1027T/20,118

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of TJA1027T/20,118Last Revision (GMT):
Sunday, 04 April 2021, 01:21:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
TJA1027T/20,118SOT96-1SO870.002564 mg YesYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 942 111182021-02-0251 / Unlimited26030 sec.1 / Unlimited24020 sec.3Bangkok, Thailand
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.04329799.0000000.061850
Palladium and its compoundsPalladium, metal7440-05-30.0004371.0000000.000625
Subtotal0.043734100.00000000.062475
Copper Lead-Frame, Pre-PlatedCopper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-831.30656097.83300044.722019
Iron and its compoundsIron, metal7439-89-60.6721602.1005000.960193
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0003200.0010000.000457
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0048320.0151000.006903
Zinc and its compoundsZinc, metal7440-66-60.0161280.0504000.023039
Subtotal32.000000100.000000045.712611
Die EncapsulantDie EncapsulantBoron and its compoundsTetraphenylphosphonium tetraphenylborate15525-15-20.1800000.5000000.257133
Epoxy Resins2,5-Di-tert-butyl-1,4-phenylenebis(oxymethyloxirane)64777-22-60.7200002.0000001.028534
Epoxy ResinsProprietary Material-Other Epoxy resins0.7200002.0000001.028534
Inorganic Silicon compoundsSilica, vitreous60676-86-030.96000086.00000044.226951
Inorganic compoundsCarbon Black1333-86-40.1800000.5000000.257133
Magnesium and its compoundsMagnesium Aluminum Hydroxide Carbonate11097-59-90.1800000.5000000.257133
Magnesium and its compoundsMagnesium dihydroxide1309-42-80.5400001.5000000.771400
Organic Silicon compoundsOther organic Silicon Compounds0.1800000.5000000.257133
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.1800000.5000000.257133
Organic compoundsOther organic compounds.0.1800000.5000000.257133
Phenols and Phenolic ResinsPhenol polymer with 4, 4'- bis (methoxymethyl)- 1, 1'-bisphenyl205830-20-21.4400004.0000002.057068
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.3600001.0000000.514267
Zinc and its compoundsZinc Hydroxide20427-58-10.1800000.5000000.257133
Subtotal36.000000100.000000051.426688
Epoxy AdhesiveEpoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.0066193.3094000.009455
AcrylatesProprietary Material-Other acrylates0.0176508.8252000.025214
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.0066193.3094000.009455
Palladium and its compoundsPalladium, metal7440-05-30.0003310.1655000.000473
PolymersProprietary Material-Other polymers0.0033091.6547000.004727
Silver and its compoundsSilver, metal7440-22-40.16547282.7358000.236379
Subtotal0.200000100.00000000.285704
Pre-plating - Precious metal - OtherPre-plating - Precious metal - OtherGold and its compoundsGold, metal7440-57-50.0210003.0000000.029999
Nickel and its compoundsNickel, metal7440-02-00.64610092.3000000.922966
Palladium and its compoundsPalladium, metal7440-05-30.0217003.1000000.030999
Silver and its compoundsSilver, metal7440-22-40.0112001.6000000.015999
Subtotal0.700000100.00000000.999963
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-31.03765398.0000001.482308
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0211772.0000000.030251
Subtotal1.058830100.00000001.512559
Total70.002564100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 TJA1027T/20,118
Product content declaration of TJA1027T/20,118
上次修订 Last Revision (GMT):
Sunday, 04 April 2021, 01:21:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预电镀-贵金属-其它
Pre-plating - Precious metal - Other
预电镀-贵金属-其它
Pre-plating - Precious metal - Other
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of TJA1027T_20_118Last Revision (GMT):
Sunday, 04 April 2021, 01:21:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Copper Lead-Frame, Pre-PlatedNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
27 Jan 2021
Test Report
27 Jan 2021
Test Report
27 Jan 2021
Test Report
27 Jan 2021
Epoxy AdhesiveTest Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
23 Mar 2020
Pre-plating - Precious metal - OtherNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.