PCA2129T/Q900/2,51

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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Product content declaration of PCA2129T/Q900/2,51
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
PCA2129T/Q900/2,51SOT162SO16450.934014 mg YesYesYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9352 969 235182012-11-0613 | 168 hours26030 sec.3 | 168 hours24020 sec.3Bangkok, Thailand
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - AuAluminum and its compoundsAluminum, metal7429-90-50.0000040.0010000.000001
Beryllium and its compoundsBeryllium, metal7440-41-70.0000040.0010000.000001
Copper and its compoundsCopper, metal7440-50-80.0000040.0010000.000001
Gold and its compoundsGold, metal7440-57-50.36398999.9930000.080719
Iron and its compoundsIron, metal7439-89-60.0000040.0010000.000001
Magnesium and its compoundsMagnesium, metal7439-95-40.0000040.0010000.000001
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000040.0010000.000001
Silver and its compoundsSilver, metal7440-22-40.0000040.0010000.000001
Subtotal0.364014100.00000000.080724
Copper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-8118.91340097.47000026.370466
Iron and its compoundsIron, metal7439-89-62.9280002.4000000.649319
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0366000.0300000.008117
Zinc and its compoundsZinc, metal7440-66-60.1220000.1000000.027055
Subtotal122.000000100.000000027.054956
Crystal OscillatorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-18.29946469.1622001.840505
Cobalt and its compoundsCobalt, metal7440-48-40.0840720.7006000.018644
Copper and its compoundsCopper, metal7440-50-80.9440527.8671000.209355
Gold and its compoundsGold, metal7440-57-50.0840720.7006000.018644
Inorganic Silicon compoundsQuartz14808-60-70.4083723.4031000.090561
Inorganic Silicon compoundsSilicon7440-21-30.0120120.1001000.002664
Iron and its compoundsIron, metal7439-89-60.1801681.5014000.039954
Manganese and its compoundsManganese (III) oxide1317-34-60.3603243.0027000.079906
Manganese and its compoundsManganese, metal7439-96-50.0120120.1001000.002664
Molybdenum and its compoundsMolybdenum, metal7439-98-70.7446726.2056000.165140
Nickel and its compoundsNickel, metal7440-02-00.4143723.4531000.091892
Silver and its compoundsSilver, metal7440-22-40.4564083.8034000.101214
Subtotal12.000000100.00000002.661143
Die EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins24.9050008.5000005.522981
Inorganic Silicon compoundsOther silica compounds259.30500088.50000057.503979
Miscellaneous substancesProprietary Material-Other miscellaneous substances.8.7900003.0000001.949287
Subtotal293.000000100.000000064.976247
Epoxy AdhesivePolymersProprietary Material-Other acrylic/epoxy resin mixture2.30000023.0000000.510053
Silver and its compoundsSilver, metal7440-22-47.70000077.0000001.707567
Subtotal10.000000100.00000002.217619
Pre-plating - Precious metal - OtherGold and its compoundsGold, metal7440-57-50.1380003.0000000.030603
Nickel and its compoundsNickel, metal7440-02-04.24580092.3000000.941557
Palladium and its compoundsPalladium, metal7440-05-30.1426003.1000000.031623
Silver and its compoundsSilver, metal7440-22-40.0736001.6000000.016322
Subtotal4.600000100.00000001.020105
Semiconductor DieInorganic Silicon compoundsSilicon7440-21-38.79060098.0000001.949421
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1794002.0000000.039784
Subtotal8.970000100.00000001.989205
Total450.934014100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of PCA2129T/Q900/2,51
产品内容声明 PCA2129T/Q900/2,51
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - Au
焊丝-金
OOOOOO
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
OOOOOO
Crystal Oscillator
晶体振荡器
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Pre-plating - Precious metal - Other
预电镀-贵金属-其它
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of PCA2129T_Q900_2_51
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
26 Sep 2019
Test Report
26 Sep 2019
Test Report
26 Sep 2019
Test Report
26 Sep 2019
Copper Lead-Frame, Pre-PlatedTest Report
1 Feb 2019
Test Report
1 Feb 2019
Test Report
1 Feb 2019
Test Report
1 Feb 2019
Crystal OscillatorAU PLATINGTest Report
10 Jan 2020
Not AvailableNot AvailableNot Available
CERAMICTest Report
18 Feb 2020
Not AvailableNot AvailableNot Available
CRYSTALTest Report
3 Apr 2020
Test Report
3 Apr 2020
Test Report
3 Apr 2020
Not Available
INNER ELECTRODE AUTest Report
20 Jan 2020
Test Report
20 Jan 2020
Not AvailableNot Available
LID COPPERTest Report
21 Feb 2020
Not AvailableNot AvailableNot Available
LID KOVARTest Report
21 Feb 2020
Not AvailableNot AvailableNot Available
LID NICKELTest Report
21 Feb 2020
Not AvailableNot AvailableNot Available
LID SILVERTest Report
21 Feb 2020
Not AvailableNot AvailableNot Available
METALLIZATIONTest Report
4 Feb 2020
Not AvailableNot AvailableNot Available
NI PLATINGTest Report
10 Jan 2020
Not AvailableNot AvailableNot Available
Die EncapsulantTest Report
5 Feb 2020
Test Report
5 Feb 2020
Test Report
5 Feb 2020
Test Report
5 Feb 2020
Epoxy AdhesiveTest Report
19 Mar 2019
Test Report
3 Mar 2020
Test Report
15 Jun 2018
Test Report
3 Mar 2020
Pre-plating - Precious metal - OtherNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.