LPC1111FDH20/002,5

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LPC1111FDH20/002,5Last Revision (GMT):
Tuesday, 08 June 2021, 12:51:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC1111FDH20/002,5SOT360-1TSSOP2090.798110 mg YesYesYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9352 970 315182020-10-1541 / Unlimited26030 sec.1 / Unlimited24020 sec.3Bangkok, Thailand
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuAluminum and its compoundsAluminum, metal7429-90-50.0000040.0010000.000004
Calcium and its compoundsCalcium7440-70-20.0000080.0020000.000009
Copper and its compoundsCopper, metal7440-50-80.0000040.0010000.000004
Gold and its compoundsGold, metal7440-57-50.39372798.8420000.433629
Iron and its compoundsIron, metal7439-89-60.0000040.0010000.000004
Magnesium and its compoundsMagnesium, metal7439-95-40.0000040.0010000.000004
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000040.0010000.000004
Palladium and its compoundsPalladium, metal7440-05-30.0045811.1500000.005045
Silver and its compoundsSilver, metal7440-22-40.0000040.0010000.000004
Subtotal0.398340100.00000000.438710
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-828.26630097.47000031.130934
Iron and its compoundsIron, metal7439-89-60.6960002.4000000.766536
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0087000.0300000.009582
Zinc and its compoundsZinc, metal7440-66-60.0290000.1000000.031939
Subtotal29.000000100.000000031.938991
Die EncapsulantDie EncapsulantBoron and its compoundsTetraphenylphosphonium tetraphenylborate15525-15-20.2700000.5000000.297363
Epoxy Resins2,5-Di-tert-butyl-1,4-phenylenebis(oxymethyloxirane)64777-22-61.0800002.0000001.189452
Epoxy ResinsProprietary Material-Other Epoxy resins1.0800002.0000001.189452
Inorganic Silicon compoundsSilica, vitreous60676-86-046.44000086.00000051.146439
Inorganic compoundsCarbon Black1333-86-40.2700000.5000000.297363
Magnesium and its compoundsMagnesium Aluminum Hydroxide Carbonate11097-59-90.2700000.5000000.297363
Magnesium and its compoundsMagnesium dihydroxide1309-42-80.8100001.5000000.892089
Organic Silicon compoundsOther organic Silicon Compounds0.2700000.5000000.297363
Organic Silicon compounds[3-(2,3-epoxypropoxy)propyl]trimethoxysilane2530-83-80.2700000.5000000.297363
Organic compoundsOther organic compounds.0.2700000.5000000.297363
Phenols and Phenolic ResinsPhenol polymer with 4, 4'- bis (methoxymethyl)- 1, 1'-bisphenyl205830-20-22.1600004.0000002.378904
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.5400001.0000000.594726
Zinc and its compoundsZinc Hydroxide20427-58-10.2700000.5000000.297363
Subtotal54.000000100.000000059.472603
Epoxy AdhesiveEpoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.1290673.3094000.142147
AcrylatesProprietary Material-Other acrylates0.3441838.8252000.379064
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.1290673.3094000.142147
Palladium and its compoundsPalladium, metal7440-05-30.0064550.1655000.007109
PolymersProprietary Material-Other polymers0.0645331.6547000.071073
Silver and its compoundsSilver, metal7440-22-43.22669682.7358003.553704
Subtotal3.900000100.00000004.295243
Pre-plating - Precious metal - NiPdAuPre-plating - Precious metal - NiPdAuGold and its compoundsGold, metal7440-57-50.0010001.0000000.001101
Nickel and its compoundsNickel, metal7440-02-00.09700097.0000000.106830
Palladium and its compoundsPalladium, metal7440-05-30.0020002.0000000.002203
Subtotal0.100000100.00000000.110134
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-33.33177598.0000003.669432
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0679952.0000000.074886
Subtotal3.399770100.00000003.744318
Total90.798110100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC1111FDH20/002,5
Product content declaration of LPC1111FDH20/002,5
上次修订 Last Revision (GMT):
Tuesday, 08 June 2021, 12:51:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC1111FDH20_002_5Last Revision (GMT):
Tuesday, 08 June 2021, 12:51:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Copper Lead-Frame, Pre-Plated NiPdAuNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
27 Jan 2021
Test Report
27 Jan 2021
Test Report
27 Jan 2021
Test Report
27 Jan 2021
Epoxy AdhesiveTest Report
21 Jan 2021
Test Report
21 Jan 2021
Test Report
21 Jan 2021
Test Report
23 Mar 2020
Pre-plating - Precious metal - NiPdAuNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.