LPC1823JBD144E

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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Product content declaration of LPC1823JBD144E
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
LPC1823JBD144ESOT486-1LQFP1441334.680976 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9352 997 885512019-07-1163 | 168 hours26030 sec.3 | 168 hours22520 sec.3Kaohsiung, Taiwan
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-81.70869997.8650000.128023
Gold and its compoundsGold, metal7440-57-50.0023570.1350000.000177
Palladium and its compoundsPalladium, metal7440-05-30.0349192.0000000.002616
Subtotal1.745976100.00000000.130816
Copper Lead-Frame, Pre-Plated AgCopper and its compoundsCopper, metal7440-50-8353.08000097.00000026.454262
Nickel and its compoundsNickel, metal7440-02-010.9200003.0000000.818173
Subtotal364.000000100.000000027.272435
Die EncapsulantEpoxy ResinsOther Epoxy resins14.1804001.5600001.062456
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-633.0876003.6400002.479064
Inorganic Silicon compoundsSilica, vitreous60676-86-0714.56490078.61000053.538255
Inorganic Silicon compoundsSilicon dioxide7631-86-979.4466008.7400005.952479
Inorganic compoundsCarbon Black1333-86-41.5453000.1700000.115780
Miscellaneous substancesOther miscellaneous substances (less than 10%).28.2699003.1100002.118102
Phenols and Phenolic ResinsOther phenolic resins2.8179000.3100000.211129
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-635.0874003.8600002.628898
Subtotal909.000000100.000000068.106163
Epoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.1158293.3094000.008678
AcrylatesProprietary Material-Other acrylates0.3088828.8252000.023143
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.1158293.3094000.008678
Palladium and its compoundsPalladium, metal7440-05-30.0057920.1655000.000434
PolymersProprietary Material-Other polymers0.0579151.6547000.004339
Silver and its compoundsSilver, metal7440-22-42.89575382.7358000.216962
Subtotal3.500000100.00000000.262235
Post-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0005700.0030000.000043
Bismuth and its compoundsBismuth, metal7440-69-90.0001900.0010000.000014
Copper and its compoundsCopper, metal7440-50-80.0001900.0010000.000014
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0009500.0050000.000071
Tin and its compoundsTin, metal7440-31-518.99810099.9900001.423419
Subtotal19.000000100.00000001.423561
Pre-plating - Precious metal - AgSilver and its compoundsSilver, metal7440-22-410.000000100.0000000.749243
Subtotal10.000000100.00000000.749243
Semiconductor DieInorganic Silicon compoundsSilicon7440-21-326.88630098.0000002.014436
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5487002.0000000.041111
Subtotal27.435000100.00000002.055547
Total1334.680976100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of LPC1823JBD144E
产品内容声明 LPC1823JBD144E
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - CuPdAu
OOOOOO
Copper Lead-Frame, Pre-Plated Ag
铜引线框架,预镀银
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Post-plating - Lead Free
封装后电镀- 无铅
OOOOOO
Pre-plating - Precious metal - Ag
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of LPC1823JBD144E
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
8 May 2019
Test Report
8 May 2019
Test Report
8 May 2019
Test Report
8 May 2019
Copper Lead-Frame, Pre-Plated AgNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
24 Dec 2019
Test Report
24 Dec 2019
Test Report
24 Dec 2019
Test Report
24 Dec 2019
Epoxy AdhesiveTest Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
1 Apr 2019
Test Report
23 Mar 2020
Post-plating - Lead FreeTest Report
20 Jun 2019
Test Report
20 Jun 2019
Test Report
20 Jun 2019
Test Report
20 Jun 2019
Pre-plating - Precious metal - AgTest Report
25 Dec 2017
Test Report
25 Dec 2017
Test Report
25 Dec 2017
Test Report
25 Dec 2017
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.