LPC1115FET48/303EL

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LPC1115FET48/303ELLast Revision (GMT):
Friday, 11 June 2021, 09:15:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC1115FET48/303ELSOT1155-2TFBGA4837.146508 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 004 051572020-07-3021 / Unlimited26030 sec.NA / Not Available24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuAluminum and its compoundsAluminum, metal7429-90-50.0000010.0010000.000000
Calcium and its compoundsCalcium7440-70-20.0000010.0020000.000000
Copper and its compoundsCopper, metal7440-50-80.0000010.0010000.000000
Gold and its compoundsGold, metal7440-57-50.00922498.8420000.024847
Iron and its compoundsIron, metal7439-89-60.0000010.0010000.000000
Magnesium and its compoundsMagnesium, metal7439-95-40.0000010.0010000.000000
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0010000.000000
Palladium and its compoundsPalladium, metal7440-05-30.0001071.1500000.000289
Silver and its compoundsSilver, metal7440-22-40.0000010.0010000.000000
Subtotal0.009338100.00000000.025139
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins1.95700010.3000005.268328
Inorganic Silicon compoundsOther silica compounds17.04300089.70000045.880490
Subtotal19.000000100.000000051.148819
Epoxy AdhesiveEpoxy AdhesiveAcrylatesIsobornyl methacrylate7534-94-30.12000010.0000000.323045
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0240002.0000000.064609
Organic compoundsN,N'-Bismaleimido-4,4'-diphenylmethane35325-39-40.12000010.0000000.323045
Silver and its compoundsSilver, metal7440-22-40.93600078.0000002.519752
Subtotal1.200000100.00000003.230452
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-31.89842798.0000005.110646
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0387432.0000000.104299
Subtotal1.937170100.00000005.214945
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0250000.5000000.067301
Silver and its compoundsSilver, metal7440-22-40.0500001.0000000.134602
Tin and its compoundsTin, metal7440-31-54.92500098.50000013.258312
Subtotal5.000000100.000000013.460216
SubstrateSubstrateAluminum and its compoundsAluminum Hydroxide21645-51-20.9072609.0726002.442383
Arsenic and its compoundsArsenic, metal7440-38-20.0010100.0101000.002719
Barium and its compoundsBarium sulfate7727-43-70.0775300.7753000.208714
Copper and its compoundsCopper phthalocyanine147-14-80.0010100.0101000.002719
Copper and its compoundsCopper, metal7440-50-82.72077027.2077007.324430
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.00393010.0393002.702623
Gold and its compoundsGold, metal7440-57-50.0191300.1913000.051499
Inorganic Silicon compoundsFibrous-glass-wool65997-17-32.72077027.2077007.324430
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0392700.3927000.105717
Magnesium and its compoundsTalc14807-96-60.0392700.3927000.105717
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1349301.3493000.363237
Nickel and its compoundsNickel, metal7440-02-00.0886100.8861000.238542
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-51.00393010.0393002.702623
Organic compounds1,3,5-Triazine290-87-91.00393010.0393002.702623
Organic compounds3-Methoxy-3-methylbutyl acetate103429-90-90.0855900.8559000.230412
PolymersOther acrylic resins0.1530601.5306000.412044
Subtotal10.000000100.000000026.920431
Total37.146508100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC1115FET48/303EL
Product content declaration of LPC1115FET48/303EL
上次修订 Last Revision (GMT):
Friday, 11 June 2021, 09:15:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC1115FET48_303ELLast Revision (GMT):
Friday, 11 June 2021, 09:15:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Die EncapsulantTest Report
14 Dec 2020
Test Report
14 Dec 2020
Test Report
14 Dec 2020
Test Report
14 Dec 2020
Epoxy AdhesiveTest Report
18 Sep 2020
Test Report
18 Sep 2020
Test Report
18 Sep 2020
Test Report
18 Sep 2020
Semiconductor DieTest Report
22 Feb 2021
Test Report
22 Feb 2021
Test Report
22 Feb 2021
Test Report
22 Feb 2021
Solder Ball - SAC, Lead FreeTest Report
26 Feb 2021
Test Report
26 Feb 2021
Test Report
26 Feb 2021
Test Report
26 Feb 2021
SubstrateAU PLATINGTest Report
6 Mar 2020
Test Report
6 Mar 2020
Test Report
6 Mar 2020
Test Report
6 Mar 2020
AUS 308Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
COPPERTest Report
9 Mar 2021
Test Report
9 Mar 2021
Test Report
9 Mar 2021
Test Report
9 Mar 2021
CU PLATINGTest Report
9 May 2019
Test Report
9 May 2019
Test Report
9 May 2019
Test Report
9 May 2019
HL832NXATest Report
22 Mar 2021
Test Report
22 Mar 2021
Test Report
22 Mar 2021
Test Report
22 Mar 2021
NI PLATINGTest Report
9 May 2019
Test Report
9 May 2019
Test Report
9 May 2019
Test Report
9 May 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.