SAF3600EL/V1042AK

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of SAF3600EL/V1042AK
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
SAF3600EL/V1042AKSOT1322-1LFBGA223371.510500 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 035 035572016-02-1273 | 168 hours26030 sec.3 | 168 hours24020 sec.3Kaohsiung, Taiwan
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding WireCopper and its compoundsCopper, metal7440-50-80.42189098.0000000.113561
Palladium and its compoundsPalladium, metal7440-05-30.0086102.0000000.002318
Subtotal0.430500100.00000000.115878
Die EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins18.37500010.5000004.946024
Inorganic Silicon compoundsOther silica compounds156.62500089.50000042.158970
Subtotal175.000000100.000000047.104994
Epoxy AdhesivePolymersPlastic: PTFE - Polytetrafluoroethylene2.89800042.0000000.780059
PolymersProprietary Material-Other acrylic/epoxy resin mixture4.00200058.0000001.077224
Subtotal6.900000100.00000001.857283
Semiconductor DieInorganic Silicon compoundsSilicon7440-21-317.81640098.0000004.795665
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.3636002.0000000.097871
Subtotal18.180000100.00000004.893536
Solder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.2750000.5000000.074022
Silver and its compoundsSilver, metal7440-22-40.5500001.0000000.148044
Tin and its compoundsTin, metal7440-31-554.17500098.50000014.582360
Subtotal55.000000100.000000014.804427
SubstrateAluminum and its compoundsAluminum Hydroxide21645-51-210.5242169.0726002.832818
Arsenic and its compoundsArsenic, metal7440-38-20.0117160.0101000.003154
Barium and its compoundsBarium sulfate7727-43-70.8993480.7753000.242079
Copper and its compoundsCopper phthalocyanine147-14-80.0117160.0101000.003154
Copper and its compoundsCopper, metal7440-50-831.56093227.2077008.495300
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-511.64558810.0393003.134659
Gold and its compoundsGold, metal7440-57-50.2219080.1913000.059731
Inorganic Silicon compoundsFibrous-glass-wool65997-17-331.56093227.2077008.495300
Inorganic Silicon compoundsSilicon dioxide7631-86-90.4555320.3927000.122616
Magnesium and its compoundsTalc14807-96-60.4555320.3927000.122616
Miscellaneous substancesProprietary Material-Other miscellaneous substances.1.5651881.3493000.421304
Nickel and its compoundsNickel, metal7440-02-01.0278760.8861000.276675
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-511.64558810.0393003.134659
Organic compounds1,3,5-Triazine290-87-911.64558810.0393003.134659
Organic compounds3-Methoxy-3-methylbutyl acetate103429-90-90.9928440.8559000.267245
PolymersOther acrylic resins1.7754961.5306000.477913
Subtotal116.000000100.000000031.223882
Total371.510500100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of SAF3600EL/V1042AK
产品内容声明 SAF3600EL/V1042AK
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire
焊线
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
OOOOOO
Substrate
基板
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of SAF3600EL_V1042AK
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding WireNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
18 Jan 2019
Test Report
18 Jan 2019
Test Report
18 Jan 2019
Test Report
18 Jan 2019
Epoxy AdhesiveTest Report
15 Jun 2018
Test Report
15 Jun 2018
Test Report
15 Jun 2018
Not Available
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
Solder Ball - SAC, Lead FreeTest Report
14 May 2018
Test Report
14 May 2018
Test Report
14 May 2018
Test Report
14 May 2018
SubstrateAU PLATINGTest Report
23 Mar 2018
Test Report
23 Mar 2018
Test Report
23 Mar 2018
Not Available
AUS 308Test Report
20 Aug 2018
Test Report
20 Aug 2018
Test Report
23 Feb 2018
Not Available
COPPERTest Report
27 Mar 2019
Test Report
27 Mar 2019
Not AvailableNot Available
CU PLATINGTest Report
9 May 2018
Test Report
9 May 2018
Test Report
9 May 2018
Not Available
HL832NXATest Report
21 May 2018
Test Report
21 May 2018
Test Report
21 May 2018
Not Available
NI PLATINGTest Report
20 Mar 2018
Test Report
20 Mar 2018
Test Report
20 Mar 2018
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.