LPC1113JHN33/303E

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LPC1113JHN33/303ELast Revision (GMT):
Monday, 07 June 2021, 10:48:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC1113JHN33/303ESOT865-3HVQFN32132.907450 mg YesYesYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 038 155512013-12-1813 / 168 hours26030 sec.3 / 168 hours24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.67205299.0000000.505654
Palladium and its compoundsPalladium, metal7440-05-30.0067881.0000000.005108
Subtotal0.678840100.00000000.510761
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-853.60850097.47000040.335211
Iron and its compoundsIron, metal7439-89-61.3200002.4000000.993172
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0165000.0300000.012415
Zinc and its compoundsZinc, metal7440-66-60.0550000.1000000.041382
Subtotal55.000000100.000000041.382180
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins2.5347003.5700001.907117
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-61.0863001.5300000.817336
Inorganic Silicon compoundsSilica, vitreous60676-86-059.98080084.48000045.129750
Inorganic compoundsCarbon Black1333-86-40.1278000.1800000.096157
Magnesium and its compoundsMagnesium dihydroxide1309-42-82.5347003.5700001.907117
Miscellaneous substancesProprietary Material-Other miscellaneous substances.2.2507003.1700001.693434
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-62.4850003.5000001.869722
Subtotal71.000000100.000000053.420632
Epoxy AdhesiveEpoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.0430223.3094000.032370
AcrylatesProprietary Material-Other acrylates0.1147288.8252000.086321
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.0430223.3094000.032370
Palladium and its compoundsPalladium, metal7440-05-30.0021520.1655000.001619
PolymersProprietary Material-Other polymers0.0215111.6547000.016185
Silver and its compoundsSilver, metal7440-22-41.07556582.7358000.809259
Subtotal1.300000100.00000000.978124
Pre-plating - Precious metal - NiPdAuPre-plating - Precious metal - NiPdAuGold and its compoundsGold, metal7440-57-50.0170001.0000000.012791
Nickel and its compoundsNickel, metal7440-02-01.64900097.0000001.240713
Palladium and its compoundsPalladium, metal7440-05-30.0340002.0000000.025582
Subtotal1.700000100.00000001.279086
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-33.16403898.0000002.380632
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0645722.0000000.048584
Subtotal3.228610100.00000002.429217
Total132.907450100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC1113JHN33/303E
Product content declaration of LPC1113JHN33/303E
上次修订 Last Revision (GMT):
Monday, 07 June 2021, 10:48:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
预电镀-贵金属-镍钯金
Pre-plating - Precious metal - NiPdAu
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC1113JHN33_303ELast Revision (GMT):
Monday, 07 June 2021, 10:48:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Copper Lead-Frame, Pre-Plated NiPdAuAU PLATINGTest Report
19 May 2020
Test Report
19 May 2020
Test Report
19 May 2020
Test Report
19 May 2020
CDA 194Test Report
26 Feb 2021
Test Report
26 Feb 2021
Test Report
26 Feb 2021
Test Report
26 Feb 2021
NI PLATINGTest Report
19 May 2020
Test Report
19 May 2020
Test Report
19 May 2020
Test Report
19 May 2020
PD PLATINGTest Report
19 May 2020
Test Report
19 May 2020
Test Report
19 May 2020
Test Report
19 May 2020
Die EncapsulantTest Report
14 Dec 2020
Test Report
14 Dec 2020
Test Report
14 Dec 2020
Test Report
24 Dec 2019
Epoxy AdhesiveTest Report
21 Jan 2021
Test Report
21 Jan 2021
Test Report
21 Jan 2021
Test Report
23 Mar 2020
Pre-plating - Precious metal - NiPdAuNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.