LPC4367JBD208E

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LPC4367JBD208ELast Revision (GMT):
Friday, 02 April 2021, 07:48:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC4367JBD208ESOT459-1LQFP2082558.231310 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 061 325512019-01-2253 / 168 hours26030 sec.3 / 168 hours24020 sec.3Kaohsiung, Taiwan
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-55.73804099.0000000.224297
Palladium and its compoundsPalladium, metal7440-05-30.0579601.0000000.002266
Subtotal5.796000100.00000000.226563
Copper Lead-Frame, Pre-Plated AgCopper AlloyCopper and its compoundsCopper, metal7440-50-8553.10713995.01600021.620685
Inorganic Silicon compoundsSilicon7440-21-34.2494760.7300000.166110
Iron and its compoundsIron, metal7439-89-60.7392920.1270000.028899
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.1746360.0300000.006826
Magnesium and its compoundsMagnesium, metal7439-95-41.0303520.1770000.040276
Manganese and its compoundsManganese, metal7439-96-50.3492720.0600000.013653
Nickel and its compoundsNickel, metal7440-02-018.8024763.2300000.734980
Zinc and its compoundsZinc, metal7440-66-63.6673560.6300000.143355
Subtotal582.120000100.000000022.754784
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0005880.0100000.000023
Silver and its compoundsSilver, metal7440-22-45.87941299.9900000.229823
Subtotal5.880000100.00000000.229846
Die EncapsulantDie EncapsulantEpoxy ResinsOther Epoxy resins29.8584001.5600001.167150
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-669.6696003.6400002.723350
Inorganic Silicon compoundsSilica, vitreous60676-86-01504.59540078.61000058.813892
Inorganic Silicon compoundsSilicon dioxide7631-86-9167.2836008.7400006.539033
Inorganic compoundsCarbon Black1333-86-43.2538000.1700000.127189
Miscellaneous substancesOther miscellaneous substances (less than 10%).59.5254003.1100002.326818
Phenols and Phenolic ResinsOther phenolic resins5.9334000.3100000.231934
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-673.8804003.8600002.887948
Subtotal1914.000000100.000000074.817316
Epoxy AdhesiveEpoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.1158293.3094000.004528
AcrylatesProprietary Material-Other acrylates0.3088828.8252000.012074
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.1158293.3094000.004528
Palladium and its compoundsPalladium, metal7440-05-30.0057920.1655000.000226
PolymersProprietary Material-Other polymers0.0579151.6547000.002264
Silver and its compoundsSilver, metal7440-22-42.89575382.7358000.113194
Subtotal3.500000100.00000000.136813
Post-plating - Lead FreePost-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0005700.0030000.000022
Bismuth and its compoundsBismuth, metal7440-69-90.0001900.0010000.000007
Copper and its compoundsCopper, metal7440-50-80.0001900.0010000.000007
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0009500.0050000.000037
Tin and its compoundsTin, metal7440-31-518.99810099.9900000.742626
Subtotal19.000000100.00000000.742701
Pre-plating - Precious metal - AgPre-plating - Precious metal - AgMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000500.0100000.000002
Silver and its compoundsSilver, metal7440-22-40.49995099.9900000.019543
Subtotal0.500000100.00000000.019545
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-326.88660498.0000001.050984
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5487062.0000000.021449
Subtotal27.435310100.00000001.072433
Total2558.231310100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LPC4367JBD208E
Product content declaration of LPC4367JBD208E
上次修订 Last Revision (GMT):
Friday, 02 April 2021, 07:48:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
Pre-plating - Precious metal - Ag
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LPC4367JBD208ELast Revision (GMT):
Friday, 02 April 2021, 07:48:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Copper Lead-Frame, Pre-Plated AgNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
14 Dec 2020
Test Report
14 Dec 2020
Test Report
14 Dec 2020
Test Report
24 Dec 2019
Epoxy AdhesiveTest Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
23 Mar 2020
Post-plating - Lead FreeNot AvailableNot AvailableNot AvailableNot Available
Pre-plating - Precious metal - AgNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.