SA604AHRZ

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of SA604AHRZ
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SA604AHRZSOT1039-2HXQFN16(U)14.869000 mg YesYesYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 061 451472019-06-0431 | Unlimited26030 sec.1 | Unlimited24020 sec.3Bangkok, Thailand
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - AuGold and its compoundsGold, metal7440-57-50.00899999.9900000.060523
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000006
Subtotal0.009000100.00000000.060529
Copper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-85.82000097.00000039.141839
Nickel and its compoundsNickel, metal7440-02-00.1800003.0000001.210572
Subtotal6.000000100.000000040.352411
Die EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins0.2570403.5700001.728697
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-60.1101601.5300000.740870
Inorganic Silicon compoundsSilica, vitreous60676-86-06.08256084.48000040.907660
Inorganic compoundsCarbon Black1333-86-40.0129600.1800000.087161
Magnesium and its compoundsMagnesium dihydroxide1309-42-80.2570403.5700001.728697
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2282403.1700001.535006
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.2520003.5000001.694801
Subtotal7.200000100.000000048.422893
Epoxy AdhesiveAcrylatesProprietary Material-Other Methacrylate compounds0.0198563.3094000.133542
AcrylatesProprietary Material-Other acrylates0.0529518.8252000.356118
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-50.0198563.3094000.133542
Palladium and its compoundsPalladium, metal7440-05-30.0009930.1655000.006678
PolymersProprietary Material-Other polymers0.0099281.6547000.066771
Silver and its compoundsSilver, metal7440-22-40.49641582.7358003.338589
Subtotal0.600000100.00000004.035241
Pre-plating - Precious metal - NiPdAuGold and its compoundsGold, metal7440-57-50.0020001.0000000.013451
Nickel and its compoundsNickel, metal7440-02-00.19400097.0000001.304728
Palladium and its compoundsPalladium, metal7440-05-30.0040002.0000000.026902
Subtotal0.200000100.00000001.345080
Semiconductor DieInorganic Silicon compoundsSilicon7440-21-30.84280098.0000005.668169
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0172002.0000000.115677
Subtotal0.860000100.00000005.783846
Total14.869000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of SA604AHRZ
产品内容声明 SA604AHRZ
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - Au
焊丝-金
OOOOOO
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Pre-plating - Precious metal - NiPdAu
预电镀-贵金属-镍钯金
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of SA604AHRZ
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
26 Sep 2019
Test Report
26 Sep 2019
Test Report
26 Sep 2019
Test Report
26 Sep 2019
Copper Lead-Frame, Pre-Plated NiPdAuTest Report
12 Mar 2019
Test Report
12 Mar 2019
Test Report
12 Mar 2019
Test Report
12 Mar 2019
Die EncapsulantTest Report
24 Dec 2019
Test Report
24 Dec 2019
Test Report
18 Dec 2019
Test Report
24 Dec 2019
Epoxy AdhesiveTest Report
23 Mar 2020
Test Report
23 Mar 2020
Test Report
1 Apr 2019
Test Report
23 Mar 2020
Pre-plating - Precious metal - NiPdAuAU PLATINGTest Report
16 Nov 2018
Test Report
16 Nov 2018
Test Report
16 Nov 2018
Test Report
16 Nov 2018
NI PLATINGTest Report
18 Nov 2018
Test Report
18 Nov 2018
Test Report
18 Nov 2018
Test Report
18 Nov 2018
PD PLATINGTest Report
16 Nov 2018
Test Report
16 Nov 2018
Test Report
16 Nov 2018
Test Report
16 Nov 2018
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.