LPC1820FBD144/CPAE

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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Product content declaration of LPC1820FBD144/CPAE
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LPC1820FBD144/CPAESOT486-1LQFP1441349.747045 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 084 065512019-07-1133 | 168 hours26030 sec.NA | Not Available22520 sec.3Kaohsiung, Taiwan
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding WireCopper and its compoundsCopper, metal7440-50-81.66374997.8650000.123264
Gold and its compoundsGold, metal7440-57-50.0022950.1350000.000170
Palladium and its compoundsPalladium, metal7440-05-30.0340012.0000000.002519
Subtotal1.700045100.00000000.125953
Copper Lead-Frame, Pre-Plated AgCopper and its compoundsCopper, metal7440-50-8299.73000097.00000022.206383
Nickel and its compoundsNickel, metal7440-02-09.2700003.0000000.686795
Subtotal309.000000100.000000022.893179
Die EncapsulantEpoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-639.3600004.0000002.916102
Inorganic Silicon compoundsSilica, vitreous60676-86-0865.92000088.00000064.154243
Inorganic compoundsCarbon Black1333-86-41.9680000.2000000.145805
Miscellaneous substancesProprietary Material-Other miscellaneous substances.35.4240003.6000002.624492
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins40.3440004.1000002.989005
Phosphorus compoundsProprietary Material-Other inorganic phosphorous compounds0.9840000.1000000.072902
Subtotal984.000000100.000000072.902549
Epoxy AdhesivePolymersProprietary Material-Other acrylic/epoxy resin mixture0.57710019.9000000.042756
Silver and its compoundsSilver, metal7440-22-42.32290080.1000000.172099
Subtotal2.900000100.00000000.214855
Post-plating - Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0005700.0030000.000042
Bismuth and its compoundsBismuth, metal7440-69-90.0001900.0010000.000014
Copper and its compoundsCopper, metal7440-50-80.0001900.0010000.000014
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0009500.0050000.000070
Tin and its compoundsTin, metal7440-31-518.99810099.9900001.407530
Subtotal19.000000100.00000001.407671
Pre-plating - Precious metal - AgSilver and its compoundsSilver, metal7440-22-410.000000100.0000000.740880
Subtotal10.000000100.00000000.740880
Semiconductor DieInorganic Silicon compoundsSilicon7440-21-322.68406098.0000001.680616
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.4629402.0000000.034298
Subtotal23.147000100.00000001.714914
Total1349.747045100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of LPC1820FBD144/CPAE
产品内容声明 LPC1820FBD144/CPAE
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire
焊线
OOOOOO
Copper Lead-Frame, Pre-Plated Ag
铜引线框架,预镀银
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Post-plating - Lead Free
封装后电镀- 无铅
OOOOOO
Pre-plating - Precious metal - Ag
预镀 - 贵金属 - 银
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of LPC1820FBD144_CPAE
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding WireTest Report
8 May 2019
Test Report
8 May 2019
Test Report
8 May 2019
Test Report
8 May 2019
Copper Lead-Frame, Pre-Plated AgNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
11 Jan 2019
Test Report
8 Jan 2019
Test Report
11 Jan 2019
Not Available
Epoxy AdhesiveTest Report
1 Apr 2019
Test Report
1 Apr 2019
Not AvailableNot Available
Post-plating - Lead FreeTest Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Pre-plating - Precious metal - AgTest Report
25 Dec 2017
Test Report
25 Dec 2017
Test Report
25 Dec 2017
Test Report
25 Dec 2017
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.