PN5180A0ET/C2QL

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

Product content declaration of PN5180A0ET/C2QL
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
PN5180A0ET/C2QLSOT1336-1TFBGA6463.419000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 087 461512016-04-0631 | Unlimited26030 sec.1 | Unlimited24020 sec.3Kaohsiung, Taiwan
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - AuGold and its compoundsGold, metal7440-57-50.23760099.0000000.374651
Palladium and its compoundsPalladium, metal7440-05-30.0024001.0000000.003784
Subtotal0.240000100.00000000.378435
Die EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins3.70800010.3000005.846828
Inorganic Silicon compoundsOther silica compounds32.29200089.70000050.918495
Subtotal36.000000100.000000056.765323
Epoxy AdhesiveAcrylatesIsobornyl methacrylate7534-94-30.03000010.0000000.047304
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0060002.0000000.009461
Organic compoundsN,N'-Bismaleimido-4,4'-diphenylmethane35325-39-40.03000010.0000000.047304
Silver and its compoundsSilver, metal7440-22-40.23400078.0000000.368975
Subtotal0.300000100.00000000.473044
Semiconductor DieInorganic Silicon compoundsSilicon7440-21-32.82142098.0000004.448856
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0575802.0000000.090793
Subtotal2.879000100.00000004.539649
Solder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0350000.5000000.055189
Silver and its compoundsSilver, metal7440-22-40.0700001.0000000.110377
Tin and its compoundsTin, metal7440-31-56.89500098.50000010.872136
Subtotal7.000000100.000000011.037702
SubstrateAluminum and its compoundsAluminum Hydroxide21645-51-21.5423429.0726002.431987
Arsenic and its compoundsArsenic, metal7440-38-20.0017170.0101000.002707
Barium and its compoundsBarium sulfate7727-43-70.1318010.7753000.207826
Copper and its compoundsCopper phthalocyanine147-14-80.0017170.0101000.002707
Copper and its compoundsCopper, metal7440-50-84.62530927.2077007.293254
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.70668110.0393002.691119
Gold and its compoundsGold, metal7440-57-50.0325210.1913000.051280
Inorganic Silicon compoundsFibrous-glass-wool65997-17-34.62530927.2077007.293254
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0667590.3927000.105267
Magnesium and its compoundsTalc14807-96-60.0667590.3927000.105267
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2293811.3493000.361691
Nickel and its compoundsNickel, metal7440-02-00.1506370.8861000.237527
Organic compounds1,1'-(methylenedi-p-phenylene)bismaleimide13676-54-51.70668110.0393002.691119
Organic compounds1,3,5-Triazine290-87-91.70668110.0393002.691119
Organic compounds3-Methoxy-3-methylbutyl acetate103429-90-90.1455030.8559000.229431
PolymersOther acrylic resins0.2602021.5306000.410290
Subtotal17.000000100.000000026.805847
Total63.419000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of PN5180A0ET/C2QL
产品内容声明 PN5180A0ET/C2QL
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - Au
焊丝-金
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
OOOOOO
Substrate
基板
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of PN5180A0ET_C2QL
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
26 Sep 2019
Test Report
26 Sep 2019
Test Report
26 Sep 2019
Test Report
26 Sep 2019
Die EncapsulantTest Report
24 Dec 2019
Test Report
24 Dec 2019
Test Report
24 Dec 2019
Test Report
24 Dec 2019
Epoxy AdhesiveTest Report
25 Sep 2019
Test Report
25 Sep 2019
Test Report
25 Sep 2019
Test Report
25 Sep 2019
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
Solder Ball - SAC, Lead FreeTest Report
14 May 2018
Test Report
14 May 2018
Test Report
14 May 2018
Test Report
14 May 2018
SubstrateAUS 308Test Report
10 Feb 2020
Test Report
10 Feb 2020
Not AvailableNot Available
AUS308Not AvailableNot AvailableTest Report
15 Feb 2019
Test Report
15 Feb 2019
COPPERTest Report
27 Mar 2019
Test Report
27 Mar 2019
Test Report
16 Mar 2020
Test Report
27 Mar 2019
HL832NXATest Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
21 May 2018
Test Report
16 Apr 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.