MPXA4100A6T1

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MPXA4100A6T1Last Revision (GMT):
Saturday, 28 November 2020, 07:31:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPXA4100A6T1SOT1694-1SO81253.930102 mg YesNoYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 096 231182020-10-155Not ApplicableNot ApplicableNot ApplicableNA / Not Available24530 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-5184.45646599.99000014.710267
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0184470.0100000.001471
Subtotal184.474912100.000000014.711738
CapCapChromium and Chromium III compoundsChromium, metal7440-47-336.08006618.4270002.877359
Copper and its compoundsCopper, metal7440-50-80.4902830.2504000.039100
Inorganic Silicon compoundsSilicon7440-21-30.9803710.5007000.078184
Inorganic compoundsCarbon7440-44-00.0932010.0476000.007433
Inorganic compoundsSulfur7704-34-90.0097900.0050000.000781
Iron and its compoundsIron, metal7439-89-6139.18971771.08770011.100277
Manganese and its compoundsManganese, metal7439-96-52.2550291.1517000.179837
Nickel and its compoundsNickel, metal7440-02-016.4712838.4123001.313573
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0342650.0175000.002733
Titanium and its compoundsTitanium, metal7440-32-60.1959960.1001000.015630
Subtotal195.800000100.000000015.614905
Copper Lead-Frame, Pre-PlatedCopper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-8432.89491855.15920034.523050
Epoxy ResinsProprietary Material-Other Epoxy resins16.6175672.1174001.325239
Gold and its compoundsGold, metal7440-57-50.6207850.0791000.049507
Inorganic Silicon compoundsFibrous-glass-wool65997-17-3216.53221827.59040017.268285
Iron and its compoundsIron, metal7439-89-610.4348341.3296000.832170
Nickel and its compoundsNickel, metal7440-02-06.5319740.8323000.520920
Palladium and its compoundsPalladium, metal7440-05-30.3202030.0408000.025536
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.3649370.0465000.029103
PolymersPolyphenylene Sulfide (PPS)26125-40-699.93849012.7341007.970021
Zinc and its compoundsZinc, metal7440-66-60.5540760.0706000.044187
Subtotal784.810000100.000000062.588018
Die Encapsulant 1Die EncapsulantMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0036900.0100000.000294
Organic Silicon compoundsSiloxanes and Silicones, Me 3,3,3-trifluoropropyl, hydroxy-terminated68607-77-236.89631099.9900002.942454
Subtotal36.900000100.00000002.942748
Die Encapsulant 2Die EncapsulantMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0036900.0100000.000294
Organic Silicon compoundsSiloxanes and Silicones, Me 3,3,3-trifluoropropyl, hydroxy-terminated68607-77-236.89631099.9900002.942454
Subtotal36.900000100.00000002.942748
Epoxy AdhesiveEpoxy AdhesiveOrganic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0810003.0000000.006460
Organic Silicon compoundsSilanamine, 1,1,1-trimethyl-N-(trimethylsilyl)-, reaction products with ammonia, octamethylcyclotetrasiloxane and silica68937-51-90.67500025.0000000.053831
Organic Silicon compoundsSiloxanes and Silicones, di-Me, Me vinyl, vinyl group-terminated68083-18-10.67500025.0000000.053831
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-21.26900047.0000000.101202
Subtotal2.700000100.00000000.215323
Semiconductor DieSemiconductor DieInorganic Silicon compoundsFibrous-glass-wool65997-17-30.1227480.9943000.009789
Inorganic Silicon compoundsSilicon, doped11.97153896.9733000.954721
Lead and its compoundsLead titanium oxide (PbTiO3)12060-00-30.1281551.0381000.010220
Organic compounds2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate25265-77-40.1227480.9943000.009789
Subtotal12.345190100.00000000.984520
Total1253.930102100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MPXA4100A6T1
Product content declaration of MPXA4100A6T1
上次修订 Last Revision (GMT):
Saturday, 28 November 2020, 07:31:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
盖子
Cap
盖子
Cap
OOOOOO
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
Copper Lead-Frame, Pre-Plated
OOOOOO
芯片密封胶
Die Encapsulant 1
芯片密封胶
Die Encapsulant
OOOOOO
芯片密封胶
Die Encapsulant 2
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MPXA4100A6T1Last Revision (GMT):
Saturday, 28 November 2020, 07:31:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuNot AvailableNot AvailableNot AvailableNot Available
CapNot AvailableNot AvailableNot AvailableNot Available
Copper Lead-Frame, Pre-PlatedNot AvailableNot AvailableNot AvailableNot Available
Die Encapsulant 1Not AvailableNot AvailableNot AvailableNot Available
Die Encapsulant 2Not AvailableNot AvailableNot AvailableNot Available
Epoxy AdhesiveNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.