SPC5533MVZ80R

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5533MVZ80RLast Revision (GMT):
Thursday, 26 November 2020, 04:10:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5533MVZ80RSOT1129-3BGA3241698.660271 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 098 965182020-07-2543 / 168 hours24030 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-515.89791199.9900000.935909
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0015900.0100000.000094
Subtotal15.899501100.00000000.936002
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-523.3906043.0895001.377003
Arsenic and its compoundsArsenic, metal7440-38-20.0075710.0010000.000446
Cadmium and its compoundsCadmium, metal7440-43-90.0075710.0010000.000446
Epoxy ResinsProprietary Material-Other Epoxy resins23.3906043.0895001.377003
Inorganic Silicon compoundsSilica, vitreous60676-86-0662.73429987.53590039.015117
Inorganic compoundsCarbon Black1333-86-42.3394390.3090000.137723
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0075710.0010000.000446
Organic Phosphorus compoundsOther organic phosphorous compounds2.3394390.3090000.137723
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins42.8829015.6641002.524513
Subtotal757.100000100.000000044.570419
Epoxy AdhesiveEpoxy AdhesiveAromatic amines and their salts1,3,5-Triazine-2,4-diamine, 6-[2-(2-methyl-1H-imidazol-1-yl)ethyl]38668-46-10.1225390.8451000.007214
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.87889612.9579000.110610
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-60.1225390.8451000.007214
Silver and its compoundsSilver, metal7440-22-412.37602685.3519000.728576
Subtotal14.500000100.00000000.853614
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped45.54233598.0000002.681074
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9294352.0000000.054716
Subtotal46.471770100.00000002.735790
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0027270.0010000.000160
Arsenic and its compoundsArsenic, metal7440-38-20.0027270.0010000.000160
Bismuth and its compoundsBismuth, metal7440-69-90.0027270.0010000.000160
Copper and its compoundsCopper, metal7440-50-81.9088230.7000000.112372
Iron and its compoundsIron, metal7439-89-60.0049080.0018000.000289
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0152710.0056000.000899
Silver and its compoundsSilver, metal7440-22-410.2531063.7600000.603600
Tin and its compoundsTin, metal7440-31-5260.49871195.52960015.335539
Subtotal272.689000100.000000016.053181
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAromatic hydrocarbon compoundsProprietary Material-Other Aromatic carbonyl compounds4.5915520.7756000.270304
Barium and its compoundsBarium sulfate7727-43-732.9513125.5661001.939841
Copper and its compoundsCopper, metal7440-50-8208.68296035.25050012.285150
Epoxy ResinsProprietary Material-Other Epoxy resins44.5805607.5305002.624454
Gold and its compoundsGold, metal7440-57-58.3637761.4128000.492375
Nickel and its compoundsNickel, metal7440-02-063.82174410.7807003.757181
Organic Phosphorus compoundsProprietary Material-Other organic phosphorous compounds74.63580812.6074004.393804
Small Mineral and Ceramic FibersSilica, crystalline - tridymite15468-32-3154.37228826.0764009.087885
Subtotal592.000000100.000000034.850995
Total1698.660271100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5533MVZ80R
Product content declaration of SPC5533MVZ80R
上次修订 Last Revision (GMT):
Thursday, 26 November 2020, 04:10:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5533MVZ80RLast Revision (GMT):
Thursday, 26 November 2020, 04:10:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
14 Jul 2020
Test Report
14 Jul 2020
Test Report
14 Jul 2020
Test Report
14 Jul 2020
Epoxy AdhesiveNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
Solder Ball - SAC, Lead FreeTest Report
23 Jul 2018
Test Report
23 Jul 2018
Test Report
23 Jul 2018
Test Report
23 Jul 2018
Substrate, Pre-plated NiAuNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.