MRF8P9300HSR6

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of MRF8P9300HSR6
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MRF8P9300HSR6SOT1829-1CFM4F13441.716604 mg YesYesYesN/ANot Applicablee4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 101 661282019-10-294NA | Not Available26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding WireAluminum and its compoundsAluminum, metal7429-90-52.199924100.0000000.016366
Subtotal2.199924100.00000000.016366
CapAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-11703.52636394.94100012.673429
Calcium and its compoundsCalcium monoxide1305-78-83.5347710.1970000.026297
Epoxy ResinsProprietary Material-Other Epoxy resins27.1549361.5134000.202020
Inorganic Silicon compoundsQuartz14808-60-742.4118692.3637000.315524
Magnesium and its compoundsMagnesium-oxide1309-48-417.6720610.9849000.131472
Subtotal1794.300000100.000000013.348741
Header Assembly/FlangeAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1443.9147533.9402003.302515
Cobalt and its compoundsCobalt, metal7440-48-442.2148260.3747000.314058
Copper and its compoundsCopper, metal7440-50-85192.84046346.09180038.632272
Gold and its compoundsGold, metal7440-57-514.3983310.1278000.107117
Inorganic Silicon compoundsProprietary Material-Other glass compounds (without lead, chromium, cadmium or mercury)33.2130520.2948000.247089
Inorganic Silicon compoundsQuartz14808-60-715.4010320.1367000.114576
Iron and its compoundsIron, metal7439-89-6238.8568262.1201001.776982
Molybdenum and its compoundsMolybdenum, metal7439-98-74799.95078442.60450035.709359
Nickel and its compoundsNickel, metal7440-02-0271.2587052.4077002.018036
Palladium and its compoundsPalladium, metal7440-05-310.8043820.0959000.080380
Silver and its compoundsSilver, metal7440-22-498.2196030.8718000.730707
Titanium and its compoundsTitanium (IV) Oxide13463-67-72.8053090.0249000.020870
Tungsten and its compoundsTungsten, metal7440-33-7102.4219330.9091000.761971
Subtotal11266.300000100.000000083.815932
Semiconductor Die 1Gold and its compoundsGold, metal7440-57-50.6609601.0200000.004917
Inorganic Silicon compoundsSilicon, doped62.85625997.0004000.467621
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.2827811.9796000.009543
Subtotal64.800000100.00000000.482081
Semiconductor Die 2Gold and its compoundsGold, metal7440-57-50.9151101.0200000.006808
Inorganic Silicon compoundsSilicon, doped87.02553897.0004000.647429
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.7760311.9796000.013213
Subtotal89.716680100.00000000.667450
Semiconductor Die 3Gold and its compoundsGold, metal7440-57-52.2888801.0200000.017028
Inorganic Silicon compoundsSilicon, doped217.66889897.0004001.619353
Miscellaneous substancesOther miscellaneous substances (less than 10%).4.4422221.9796000.033048
Subtotal224.400000100.00000001.669430
Total13441.716604100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MRF8P9300HSR6
产品内容声明 MRF8P9300HSR6
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire
焊线
OOOOOO
Cap
盖子
OOOOOO
Header Assembly/Flange
封装焊头/法兰
OOOOOO
Semiconductor Die 1
半导体芯片
OOOOOO
Semiconductor Die 2
半导体芯片
OOOOOO
Semiconductor Die 3
半导体芯片
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MRF8P9300HSR6
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding WireTest Report
26 Nov 2019
Test Report
26 Nov 2019
Test Report
26 Nov 2019
Test Report
26 Nov 2019
CapNot AvailableNot AvailableNot AvailableNot Available
Header Assembly/FlangeAGCU SOLDERTest Report
2 Mar 2016
Not AvailableNot AvailableNot Available
ALLOY 42Test Report
13 Jan 2017
Test Report
5 Jul 2016
Not AvailableNot Available
AU PLATINGTest Report
20 Apr 2015Test Report
19 Feb 2016
Test Report
25 Apr 2018Test Report
19 Feb 2016
Test Report
25 Apr 2018Test Report
19 Feb 2016
Not Available
CPC BOARDTest Report
26 Oct 2015
Not AvailableNot AvailableNot Available
NI PLATINGTest Report
7 Nov 2018
Test Report
7 Nov 2018
Test Report
7 Nov 2018
Not Available
PD PLATINGTest Report
12 Dec 2017Test Report
31 Mar 2016
Test Report
12 Dec 2017Test Report
31 Mar 2016
Test Report
12 Dec 2017
Not Available
Semiconductor Die 1Test Report
29 May 2018
Test Report
29 May 2018
Test Report
29 May 2018
Test Report
20 May 2019
Semiconductor Die 2Test Report
29 May 2018
Test Report
29 May 2018
Test Report
29 May 2018
Test Report
20 May 2019
Semiconductor Die 3Test Report
29 May 2018
Test Report
29 May 2018
Test Report
29 May 2018
Test Report
20 May 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.