MRF6V12500HR5

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of MRF6V12500HR5
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MRF6V12500HR5SOT1792-1CFM2F4967.124165 mg YesYesYesN/ANot Applicablee4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 101 671782018-02-201NA | Not Available26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-534.98967298.8450000.704425
Inorganic Silicon compoundsSilicon7440-21-30.4070831.1500000.008195
Nickel and its compoundsNickel, metal7440-02-00.0017700.0050000.000036
Subtotal35.398525100.00000000.712656
CapAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1760.31415394.23620015.306929
Epoxy ResinsProprietary Material-Other Epoxy resins17.6999622.1938000.356342
Inorganic Silicon compoundsQuartz14808-60-719.3337682.3963000.389235
Magnesium and its compoundsMagnesium-oxide1309-48-47.8914820.9781000.158874
Miscellaneous substancesProprietary Material-Other miscellaneous substances.1.5781350.1956000.031772
Subtotal806.817500100.000000016.243151
Header Assembly/FlangeAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1178.3118644.6462003.589841
Cobalt and its compoundsCobalt, metal7440-48-417.0551830.4444000.343361
Copper and its compoundsCopper, metal7440-50-81753.41022645.68790035.300310
Gold and its compoundsGold, metal7440-57-56.8466350.1784000.137839
Inorganic Silicon compoundsProprietary Material-Other glass compounds (without lead, chromium, cadmium or mercury)13.4553270.3506000.270888
Inorganic Silicon compoundsQuartz14808-60-76.2632900.1632000.126095
Iron and its compoundsIron, metal7439-89-676.4528141.9921001.539177
Molybdenum and its compoundsMolybdenum, metal7439-98-71624.52155142.32950032.705475
Nickel and its compoundsNickel, metal7440-02-095.2465202.4818001.917539
Palladium and its compoundsPalladium, metal7440-05-33.3580750.0875000.067606
Silver and its compoundsSilver, metal7440-22-422.8540990.5955000.460107
Titanium and its compoundsTitanium (IV) Oxide13463-67-71.1590160.0302000.023334
Tungsten and its compoundsTungsten, metal7440-33-738.8654011.0127000.782453
Subtotal3837.800000100.000000077.264024
Semiconductor Die 1Inorganic Silicon compoundsSilicon, doped119.63840098.0000002.408605
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.4416002.0000000.049155
Subtotal122.080000100.00000002.457760
Semiconductor Die 2Inorganic Silicon compoundsSilicon, doped42.08917798.0000000.847355
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8589632.0000000.017293
Subtotal42.948140100.00000000.864648
Semiconductor Die 3Gold and its compoundsGold, metal7440-57-51.2452161.0200000.025069
Inorganic Silicon compoundsSilicon, doped118.41808897.0004002.384037
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.4166961.9796000.048654
Subtotal122.080000100.00000002.457760
Total4967.124165100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MRF6V12500HR5
产品内容声明 MRF6V12500HR5
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - Al
焊丝-铝
OOOOOO
Cap
盖子
OOOOOO
Header Assembly/Flange
封装焊头/法兰
OOOOOO
Semiconductor Die 1
半导体芯片
OOOOOO
Semiconductor Die 2
半导体芯片
OOOOOO
Semiconductor Die 3
半导体芯片
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MRF6V12500HR5
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
16 Oct 2019
Test Report
16 Oct 2019
Test Report
16 Oct 2019
Test Report
16 Oct 2019
CapTest Report
7 Nov 2018
Test Report
7 Nov 2018
Test Report
7 Nov 2018
Test Report
7 Nov 2018
Header Assembly/FlangeALLOY 42Test Report
18 Jun 2019
Test Report
18 Jun 2019
Test Report
24 Jun 2019
Test Report
24 Jun 2019
AU PLATINGTest Report
9 Sep 2019
Not AvailableNot AvailableNot Available
CERAMICTest Report
22 Oct 2019
Test Report
22 Oct 2019
Test Report
22 Oct 2019
Not Available
FLANGETest Report
16 Mar 2020
Test Report
16 Mar 2020
Test Report
16 Mar 2020
Not Available
NICO PLATINGTest Report
29 Oct 2019
Test Report
29 Oct 2019
Test Report
29 Oct 2019
Test Report
29 Oct 2019
PD PLATINGTest Report
10 Feb 2020
Test Report
10 Feb 2020
Not AvailableNot Available
Semiconductor Die 1Test Report
20 May 2019
Test Report
20 May 2019
Test Report
20 May 2019
Test Report
20 May 2019
Semiconductor Die 2Test Report
2 Nov 2018
Test Report
2 Nov 2018
Test Report
2 Nov 2018
Test Report
2 Nov 2018
Semiconductor Die 3Test Report
20 May 2019
Test Report
20 May 2019
Test Report
20 May 2019
Test Report
20 May 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.