P1025NXE5DFB

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of P1025NXE5DFBLast Revision (GMT):
Friday, 09 April 2021, 04:38:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
P1025NXE5DFBSOT1718-1FBGA5611570.525774 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 104 035572021-03-0583 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-86.47536297.6350000.412305
Gold and its compoundsGold, metal7440-57-50.0112480.1696000.000716
Palladium and its compoundsPalladium, metal7440-05-30.1456042.1954000.009271
Subtotal6.632214100.00000000.422293
Die EncapsulantDie EncapsulantEpoxy ResinsOther Epoxy resins46.5720006.0000002.965376
Inorganic Silicon compoundsSilica, vitreous60676-86-0667.53200086.00000042.503728
Inorganic compoundsCarbon Black1333-86-47.7620001.0000000.494229
Inorganic compoundsOther inorganic compounds15.5240002.0000000.988459
Phenols and Phenolic ResinsOther phenolic resins38.8100005.0000002.471147
Subtotal776.200000100.000000049.422939
Epoxy AdhesiveEpoxy AdhesiveAromatic amines and their salts1,3,5-Triazine-2,4-diamine, 6-[2-(2-methyl-1H-imidazol-1-yl)ethyl]38668-46-10.0481710.8451000.003067
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.73860012.9579000.047029
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-60.0481710.8451000.003067
Silver and its compoundsSilver, metal7440-22-44.86505885.3519000.309773
Subtotal5.700000100.00000000.362936
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped41.72796998.0000002.656943
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8515912.0000000.054223
Subtotal42.579560100.00000002.711166
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0046660.0032000.000297
Antimony and its compoundsAntimony, metal7440-36-00.0182270.0125000.001161
Arsenic and its compoundsArsenic, metal7440-38-20.0109360.0075000.000696
Bismuth and its compoundsBismuth, metal7440-69-90.0274130.0188000.001746
Cadmium and its compoundsCadmium, metal7440-43-90.0018960.0013000.000121
Copper and its compoundsCopper, metal7440-50-80.0091860.0063000.000585
Gold and its compoundsGold, metal7440-57-50.0091860.0063000.000585
Indium and its compoundsIndium, metal7440-74-60.0091860.0063000.000585
Inorganic compoundsSulfur7704-34-90.0014580.0010000.000093
Iron and its compoundsIron, metal7439-89-60.0182270.0125000.001161
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0456400.0313000.002906
Nickel and its compoundsNickel, metal7440-02-00.0046660.0032000.000297
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0091860.0063000.000585
Silver and its compoundsSilver, metal7440-22-45.1037823.5002000.324973
Tin and its compoundsTin, metal7440-31-5140.53757596.3814008.948441
Zinc and its compoundsZinc, metal7440-66-60.0027700.0019000.000176
Subtotal145.814000100.00000009.284407
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAcrylatesOther acrylates7.7025541.2976000.490444
Aluminum and its compoundsAluminum Oxides (Al2O3)1344-28-131.2981545.2726001.992846
Barium and its compoundsBarium7440-39-36.9243441.1665000.440893
Copper and its compoundsCopper, metal7440-50-8396.65064366.82120025.255914
Epoxy ResinsBisphenol A diglycidyl ether1675-54-31.2198480.2055000.077671
Epoxy ResinsOther Non-halogenated Epoxy resins29.3903234.9512001.871368
Gold and its compoundsGold, metal7440-57-50.7491230.1262000.047699
Inorganic Silicon compoundsFibrous-glass-wool65997-17-367.44127011.3614004.294184
Inorganic Silicon compoundsSilicon dioxide7631-86-938.5003026.4859002.451428
Miscellaneous substancesProprietary Material-Other miscellaneous substances.7.3048421.2306000.465121
Nickel and its compoundsNickel, metal7440-02-06.2084621.0459000.395311
Organic Silicon compoundsOther organic Silicon Compounds0.2101340.0354000.013380
Subtotal593.600000100.000000037.796260
Total1570.525774100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 P1025NXE5DFB
Product content declaration of P1025NXE5DFB
上次修订 Last Revision (GMT):
Friday, 09 April 2021, 04:38:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of P1025NXE5DFBLast Revision (GMT):
Friday, 09 April 2021, 04:38:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdAuTest Report
2 Feb 2021
Test Report
2 Feb 2021
Test Report
2 Feb 2021
Test Report
2 Feb 2021
Die EncapsulantTest Report
24 Apr 2020
Test Report
24 Apr 2020
Test Report
24 Apr 2020
Test Report
24 Apr 2020
Epoxy AdhesiveTest Report
16 Nov 2020
Test Report
16 Nov 2020
Test Report
16 Nov 2020
Test Report
16 Nov 2020
Semiconductor DieTest Report
31 Jul 2019
Test Report
31 Jul 2019
Test Report
31 Jul 2019
Not Available
Solder Ball - Lead FreeTest Report
3 Nov 2020
Test Report
3 Nov 2020
Test Report
3 Nov 2020
Test Report
3 Nov 2020
Substrate, Pre-plated NiAuAUS 703Test Report
6 Aug 2020
Test Report
6 Aug 2020
Test Report
26 Sep 2019
Test Report
26 Sep 2019
COPPER FOILTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
14 Jan 2020
Test Report
14 Jan 2020
E679FG SERIESTest Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
7 Jan 2021
Test Report
14 Jan 2020
PHP-900 IR-6Test Report
16 Jul 2020
Test Report
22 Nov 2018
Test Report
19 Sep 2018
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.