MMA2612NKWR2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MMA2612NKWR2Last Revision (GMT):
Wednesday, 31 March 2021, 04:02:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MMA2612NKWR2SOT1574HQFN16176.504885 mg YesNoYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 105 955282019-10-047Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.18823499.0000000.106645
Palladium and its compoundsPalladium, metal7440-05-30.0019011.0000000.001077
Subtotal0.190135100.00000000.107722
Copper Lead-FrameCopper AlloyCopper and its compoundsCopper, metal7440-50-855.09394797.29100031.213837
Iron and its compoundsIron, metal7439-89-61.3420842.3700000.760366
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0096270.0170000.005454
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0940030.1660000.053258
Tin and its compoundsTin, metal7440-31-50.0169880.0300000.009625
Zinc and its compoundsZinc, metal7440-66-60.0713510.1260000.040425
Subtotal56.628000100.000000032.082965
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000570.0100000.000032
Silver and its compoundsSilver, metal7440-22-40.57194399.9900000.324038
Subtotal0.572000100.00000000.324070
Die EncapsulantDie EncapsulantEpoxy ResinsOther Non-halogenated Epoxy resins6.7844007.0000003.843746
Inorganic Silicon compoundsSilica, vitreous60676-86-084.32040087.00000047.772275
Inorganic compoundsCarbon Black1333-86-40.9692001.0000000.549107
Phenols and Phenolic ResinsOther phenolic resins4.8460005.0000002.745533
Subtotal96.920000100.000000054.910662
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.02934816.3043000.016627
Guanidine compounds1-cyanoguanidine461-58-50.0019571.0870000.001108
Organic compoundsProprietary Material-Other organic compounds.0.0019571.0870000.001108
Silver and its compoundsSilver, metal7440-22-40.14673981.5217000.083136
Subtotal0.180000100.00000000.101980
Epoxy Adhesive 2Epoxy AdhesiveAnhydridesPolybutadiene adducted with maleic anhydride25655-35-00.0011000.5000000.000623
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0011000.5000000.000623
Organic compoundsOther Bismaleimides0.10780049.0000000.061075
PolymersPolytetrafluoroethylene9002-84-00.08800040.0000000.049857
Titanium and its compoundsTitanium (IV) Oxide13463-67-70.02200010.0000000.012464
Subtotal0.220000100.00000000.124642
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0004820.0200000.000273
Tin and its compoundsTin, metal7440-31-52.40951899.9800001.365128
Subtotal2.410000100.00000001.365401
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped7.23705598.0000004.100201
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1476952.0000000.083678
Subtotal7.384750100.00000004.183879
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsFibrous-glass-wool65997-17-30.1193160.9943000.067599
Inorganic Silicon compoundsSilicon, doped11.63679696.9733006.592903
Lead and its compoundsLead titanium oxide (PbTiO3)12060-00-30.1245721.0381000.070577
Organic compounds2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate25265-77-40.1193160.9943000.067599
Subtotal12.000000100.00000006.798679
Total176.504885100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MMA2612NKWR2
Product content declaration of MMA2612NKWR2
上次修订 Last Revision (GMT):
Wednesday, 31 March 2021, 04:02:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
铜引线框架
Copper Lead-Frame
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MMA2612NKWR2Last Revision (GMT):
Wednesday, 31 March 2021, 04:02:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
Test Report
23 Jun 2020
Copper Lead-FrameTest Report
5 Mar 2020
Test Report
5 Mar 2020
Test Report
5 Mar 2020
Test Report
5 Mar 2020
Die EncapsulantTest Report
18 Dec 2020
Test Report
18 Dec 2020
Test Report
18 Dec 2020
Test Report
18 Dec 2020
Epoxy Adhesive 1Test Report
5 Dec 2017
Test Report
5 Dec 2017
Test Report
7 Dec 2017
Test Report
7 Dec 2017
Epoxy Adhesive 2Test Report
4 Jan 2021
Test Report
4 Jan 2021
Test Report
3 Mar 2020
Test Report
3 Mar 2020
Post-plating - Lead FreeTest Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Semiconductor Die 1Test Report
10 Aug 2020
Test Report
10 Aug 2020
Test Report
10 Aug 2020
Test Report
10 Aug 2020
Semiconductor Die 2Test Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.