SPC5605BK0VLU6R

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of SPC5605BK0VLU6R
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5605BK0VLU6RSOT506-2LQFP1761886.488248 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 116 045282020-08-0563 | 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - CuCopper and its compoundsCopper, metal7440-50-81.07500197.0000000.056984
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0332473.0000000.001762
Subtotal1.108248100.00000000.058747
Copper Lead-FrameCopper and its compoundsCopper, metal7440-50-8685.29347394.05620036.326411
Inorganic Silicon compoundsSilicon7440-21-35.2823500.7250000.280010
Iron and its compoundsIron, metal7439-89-60.9107500.1250000.048278
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.2280520.0313000.012089
Magnesium and its compoundsMagnesium, metal7439-95-41.2750500.1750000.067588
Manganese and its compoundsManganese, metal7439-96-50.4553750.0625000.024139
Nickel and its compoundsNickel, metal7440-02-023.3152003.2000001.235905
Silver and its compoundsSilver, metal7440-22-47.2860001.0000000.386220
Zinc and its compoundsZinc, metal7440-66-64.5537500.6250000.241388
Subtotal728.600000100.000000038.622027
Die EncapsulantAluminum and its compoundsAluminum, metal7429-90-53.3389760.3005000.176994
Epoxy ResinsEpoxy resin, EPON Resin 809125928-94-310.0158160.9014000.530924
Inorganic Silicon compoundsSilica, vitreous60676-86-0977.58875087.98070051.820559
Inorganic compoundsCarbon Black1333-86-45.5645890.5008000.294971
Magnesium and its compoundsMagnesium, metal7439-95-48.9035650.8013000.471965
Organic Silicon compoundsSilicone modified epoxy resin218163-11-256.7592535.1082003.008726
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins48.9690514.4071002.595778
Subtotal1111.140000100.000000058.899916
Epoxy AdhesiveAcrylates2-propenoic acid, (1-methylethylidene)bis(4,1-phenyleneoxy-2,1-ethanediyl) ester24447-78-70.1708007.0000000.009054
AcrylatesDicyclopentenyloxyethyl acrylate65983-31-50.1098004.5000000.005820
Epoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.0488002.0000000.002587
Organic Silicon compounds3-(trimethoxysilyl)propyl methacrylate2530-85-00.0268401.1000000.001423
Organic compoundsOther Organic Peroxides0.0073200.3000000.000388
Polymers1,3-Butadiene, homopolymer, epoxidized, cyclized68441-49-60.0976004.0000000.005174
PolymersPoly(acrylonitrile-co-butadiene-co-acrylic acid), dicarboxy terminated68891-50-90.0268401.1000000.001423
Silver and its compoundsSilver, metal7440-22-41.95200080.0000000.103473
Subtotal2.440000100.00000000.129341
Post-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0007800.0200000.000041
Tin and its compoundsTin, metal7440-31-53.89922099.9800000.206692
Subtotal3.900000100.00000000.206733
Semiconductor DieInorganic Silicon compoundsSilicon, doped38.51400098.0000002.041571
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.7860002.0000000.041665
Subtotal39.300000100.00000002.083236
Total1886.488248100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of SPC5605BK0VLU6R
产品内容声明 SPC5605BK0VLU6R
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - Cu
焊丝-铜
OOOOOO
Copper Lead-Frame
铜引线框架
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Post-plating - Lead Free
封装后电镀- 无铅
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of SPC5605BK0VLU6R
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
16 Oct 2019
Test Report
16 Oct 2019
Test Report
16 Oct 2019
Test Report
16 Oct 2019
Copper Lead-FrameAG PLATINGTest Report
5 Mar 2020
Test Report
5 Mar 2020
Test Report
5 Mar 2020
Test Report
5 Mar 2020
C7025Test Report
5 Mar 2020Test Report
12 Mar 2019
Test Report
5 Mar 2020Test Report
12 Mar 2019
Test Report
5 Mar 2020Test Report
12 Mar 2019
Test Report
5 Mar 2020Test Report
12 Mar 2019
Die EncapsulantTest Report
24 Dec 2019
Test Report
24 Dec 2019
Test Report
24 Dec 2019
Test Report
24 Dec 2019
Epoxy AdhesiveTest Report
27 Jul 2020
Test Report
27 Jul 2020
Test Report
27 Jul 2020
Test Report
27 Jul 2020
Post-plating - Lead FreeTest Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Semiconductor DieTest Report
28 Dec 2019
Test Report
28 Dec 2019
Test Report
28 Dec 2019
Test Report
28 Dec 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.