SPC5643LFK0MMM1

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5643LFK0MMM1Last Revision (GMT):
Friday, 04 June 2021, 06:01:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5643LFK0MMM1SOT1547-1LFBGA257464.873104 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 123 945572020-06-1153 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-81.34799698.1000000.289971
Gold and its compoundsGold, metal7440-57-50.0013740.1000000.000296
Palladium and its compoundsPalladium, metal7440-05-30.0247341.8000000.005321
Subtotal1.374104100.00000000.295587
Die EncapsulantDie EncapsulantAcrylonitrile compoundsAcrylonitrile/Butadiene copolymer, carboxyl terminated (26/74)68891-46-30.1189500.0500000.025588
Aluminum and its compoundsProprietary Material-Other aluminum compounds2.3790001.0000000.511753
Epoxy ResinsProprietary Material-Other Epoxy resins11.8950005.0000002.558763
Inorganic Silicon compoundsSilica, vitreous60676-86-0165.22155069.45000035.541215
Inorganic Silicon compoundsSilicon dioxide7631-86-947.58000020.00000010.235051
Inorganic compoundsCarbon Black1333-86-41.1895000.5000000.255876
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins9.5160004.0000002.047010
Subtotal237.900000100.000000051.175256
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.67500045.0000000.145201
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0001500.0100000.000032
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0750005.0000000.016133
PolymersPlastic: EP - Epoxide, Epoxy0.74985049.9900000.161302
Subtotal1.500000100.00000000.322669
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped34.59400098.0000007.441601
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.7060002.0000000.151869
Subtotal35.300000100.00000007.593470
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0021380.0032000.000460
Antimony and its compoundsAntimony, metal7440-36-00.0083500.0125000.001796
Arsenic and its compoundsArsenic, metal7440-38-20.0050100.0075000.001078
Bismuth and its compoundsBismuth, metal7440-69-90.0125580.0188000.002701
Cadmium and its compoundsCadmium, metal7440-43-90.0008680.0013000.000187
Copper and its compoundsCopper, metal7440-50-80.0042080.0063000.000905
Gold and its compoundsGold, metal7440-57-50.0042080.0063000.000905
Indium and its compoundsIndium, metal7440-74-60.0042080.0063000.000905
Inorganic compoundsSulfur7704-34-90.0006680.0010000.000144
Iron and its compoundsIron, metal7439-89-60.0083500.0125000.001796
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0209080.0313000.004498
Nickel and its compoundsNickel, metal7440-02-00.0021380.0032000.000460
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0042080.0063000.000905
Silver and its compoundsSilver, metal7440-22-42.3380993.5002000.502954
Tin and its compoundsTin, metal7440-31-564.38181196.38140013.849330
Zinc and its compoundsZinc, metal7440-66-60.0012690.0019000.000273
Subtotal66.799000100.000000014.369298
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAcrylonitrile compoundsAcrylonitrile/Butadiene copolymer, carboxyl terminated (26/74)68891-46-30.6078040.4982000.130746
Barium and its compoundsBarium sulfate7727-43-75.6420124.6246001.213667
Copper and its compoundsCopper, metal7440-50-850.89181241.71460010.947463
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-529.16483223.9056006.273719
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-63.2344642.6512000.695774
Gold and its compoundsGold, metal7440-57-50.2882860.2363000.062014
Inorganic Silicon compoundsFibrous-glass-wool65997-17-322.02490418.0532004.737831
Inorganic Silicon compoundsSilicon7440-21-30.0734440.0602000.015799
Nickel and its compoundsNickel, metal7440-02-02.9223882.3954000.628642
PolymersOther acrylic resins4.2900083.5164000.922834
PolymersOther acrylic/epoxy resin mixture2.8600462.3443000.615232
Subtotal122.000000100.000000026.243721
Total464.873104100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5643LFK0MMM1
Product content declaration of SPC5643LFK0MMM1
上次修订 Last Revision (GMT):
Friday, 04 June 2021, 06:01:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5643LFK0MMM1Last Revision (GMT):
Friday, 04 June 2021, 06:01:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
2 Feb 2021
Test Report
2 Feb 2021
Test Report
2 Feb 2021
Test Report
2 Feb 2021
Die EncapsulantTest Report
24 Apr 2020
Test Report
24 Apr 2020
Test Report
24 Apr 2020
Test Report
24 Apr 2020
Epoxy AdhesiveTest Report
8 Sep 2020
Test Report
8 Sep 2020
Test Report
8 Sep 2020
Not Available
Semiconductor DieTest Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Test Report
25 Dec 2020
Solder Ball - Lead FreeTest Report
3 Nov 2020
Test Report
3 Nov 2020
Test Report
3 Nov 2020
Test Report
3 Nov 2020
Substrate, Pre-plated NiAuAUS308Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
E679FGTest Report
14 Jan 2020
Test Report
14 Jan 2020
Test Report
7 Jan 2021
Test Report
22 Jan 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.