MK81FN256VDC15R

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MK81FN256VDC15RLast Revision (GMT):
Tuesday, 08 December 2020, 09:34:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MK81FN256VDC15RSOT1557-1XFBGA12176.681835 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 130 435182020-06-2153 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-80.78481098.0994001.023463
Gold and its compoundsGold, metal7440-57-50.0008000.1000000.001043
Palladium and its compoundsPalladium, metal7440-05-30.0144051.8006000.018786
Subtotal0.800015100.00000001.043291
Die EncapsulantDie EncapsulantAluminum and its compoundsOther aluminum compounds0.5200002.0000000.678127
Epoxy ResinsOther Epoxy resins1.3000005.0000001.695317
Inorganic Silicon compoundsSilica, vitreous60676-86-022.10000085.00000028.820385
Inorganic compoundsCarbon Black1333-86-40.2600001.0000000.339063
Organic Phosphorus compoundsOther organic phosphorous compounds0.2600001.0000000.339063
Phenols and Phenolic ResinsOther phenolic resins0.7800003.0000001.017190
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.7800003.0000001.017190
Subtotal26.000000100.000000033.906335
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.07000010.0000000.091286
Inorganic Silicon compoundsSilicon dioxide7631-86-90.17500025.0000000.228216
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.21000030.0000000.273859
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.17500025.0000000.228216
PolymersAcrylic acid ester copolymer78506-70-40.07000010.0000000.091286
Subtotal0.700000100.00000000.912863
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-326.41964498.00000034.453588
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5391762.0000000.703134
Subtotal26.958820100.000000035.156723
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0186600.5012000.024334
Silver and its compoundsSilver, metal7440-22-40.0373191.0024000.048668
Tin and its compoundsTin, metal7440-31-53.66702198.4964004.782125
Subtotal3.723000100.00000004.855126
Substrate, Pre-plated NiAuSubstrate, Pre-plated NiAuAluminum and its compoundsAluminum Hydroxide21645-51-20.4770412.5786000.622104
Aluminum and its compoundsAluminum, metal7429-90-50.0481550.2603000.062799
Arsenic and its compoundsArsenic, metal7440-38-20.0022390.0121000.002919
Barium and its compoundsBarium sulfate7727-43-70.5038292.7234000.657038
Copper and its compoundsCopper, metal7440-50-86.78813136.6926008.852332
Epoxy ResinsMethacrylic acid, polymer with 2,2-bis(p-(2,3-epoxypropoxy)phenyl)propane26875-67-21.2326736.6631001.607517
Gold and its compoundsGold, metal7440-57-51.0466745.6577001.364958
Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.9904345.3537001.291616
Magnesium and its compoundsMagnesium, metal7439-95-40.1724760.9323000.224923
Nickel and its compoundsNickel, metal7440-02-06.80681636.7936008.876699
Organic compounds3-methoxy-3-methyl-1-butyl acetate103429-90-90.4038182.1828000.526615
Zinc and its compoundsZinc, metal7440-66-60.0277130.1498000.036140
Subtotal18.500000100.000000024.125661
Total76.681835100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MK81FN256VDC15R
Product content declaration of MK81FN256VDC15R
上次修订 Last Revision (GMT):
Tuesday, 08 December 2020, 09:34:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
基板,镍金预镀
Substrate, Pre-plated NiAu
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MK81FN256VDC15RLast Revision (GMT):
Tuesday, 08 December 2020, 09:34:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
14 Jul 2020
Test Report
14 Jul 2020
Test Report
14 Jul 2020
Test Report
14 Jul 2020
Epoxy AdhesiveNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
Solder Ball - SAC, Lead FreeNot AvailableNot AvailableNot AvailableNot Available
Substrate, Pre-plated NiAuAU PLATINGTest Report
6 Mar 2020
Test Report
6 Mar 2020
Test Report
6 Mar 2020
Test Report
6 Mar 2020
AUS 308Not AvailableNot AvailableTest Report
10 Feb 2020
Test Report
10 Feb 2020
AUS308Test Report
10 Feb 2020
Test Report
10 Feb 2020
Not AvailableNot Available
COPPERTest Report
24 Jul 2020
Test Report
24 Jul 2020
Test Report
24 Jul 2020
Test Report
30 Jul 2020
COPPER FOILTest Report
16 Mar 2020
Test Report
16 Mar 2020
Test Report
16 Mar 2020
Test Report
16 Mar 2020
HL832NXATest Report
6 Apr 2020
Test Report
6 Apr 2020
Test Report
6 Apr 2020
Test Report
6 Apr 2020
NI PLATINGTest Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
12 Jun 2020
Test Report
12 Jun 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.