MPC8347EZQAGDB

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of MPC8347EZQAGDB
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8347EZQAGDBSOT1627-1HBGA6204367.477408 mg NoNoNoTin/Lead (Sn63/Pb37)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 136 525572019-05-077Not ApplicableNot ApplicableNot Applicable3 | 168 hours26040 sec.3Kuala Lumpur, Malaysia
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding WireCopper and its compoundsCopper, metal7440-50-87.68376697.0000000.175931
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2376423.0000000.005441
Subtotal7.921408100.00000000.181373
Die EncapsulantEpoxy ResinsOther Epoxy resins68.8020006.0000001.575326
Inorganic Silicon compoundsSilica, vitreous60676-86-0986.16200086.00000022.579670
Inorganic compoundsCarbon Black1333-86-411.4670001.0000000.262554
Inorganic compoundsOther inorganic compounds22.9340002.0000000.525109
Phenols and Phenolic ResinsOther phenolic resins57.3350005.0000001.312771
Subtotal1146.700000100.000000026.255430
Epoxy Adhesive 1Aromatic amines and their salts1,3,5-Triazine-2,4-diamine, 6-[2-(2-methyl-1H-imidazol-1-yl)ethyl]38668-46-10.0785940.8451000.001800
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.20508512.9579000.027592
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-60.0785940.8451000.001800
Silver and its compoundsSilver, metal7440-22-47.93772785.3519000.181746
Subtotal9.300000100.00000000.212938
Epoxy Adhesive 2Inorganic Silicon compoundsProprietary Material-Other silica compounds1.25563221.2819000.028750
Inorganic Silicon compoundsQuartz14808-60-70.0472710.8012000.001082
Inorganic Silicon compoundsSilica, vitreous60676-86-01.25563221.2819000.028750
Inorganic compoundsCarbon Black1333-86-40.0472710.8012000.001082
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.59088510.0150000.013529
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.3397575.7586000.007779
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.36355240.0602000.054117
Subtotal5.900000100.00000000.135089
Heat SpreaderCopper and its compoundsCopper, metal7440-50-81117.800000100.00000025.593721
Subtotal1117.800000100.000000025.593721
Semiconductor DieInorganic Silicon compoundsSilicon, doped29.40000098.0000000.673157
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.6000002.0000000.013738
Subtotal30.000000100.00000000.686895
Solder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-1222.64416036.0000005.097775
Silver and its compoundsSilver, metal7440-22-412.3691202.0000000.283210
Tin and its compoundsTin, metal7440-31-5383.44272062.0000008.779501
Subtotal618.456000100.000000014.160485
SubstrateAromatic hydrocarbon compoundsOther Aromatic hydrocarbon compounds11.0990760.7754000.254130
Barium and its compoundsBarium sulfate7727-43-779.3224625.5416001.816208
Copper and its compoundsCopper, metal7440-50-8504.59426535.25180011.553449
Gold and its compoundsGold, metal7440-57-519.8993231.3902000.455625
Inorganic Silicon compoundsOther silica compounds374.78203126.1829008.581201
Nickel and its compoundsOther nickel compounds153.86691210.7494003.523016
Organic Phosphorus compoundsOther organic phosphorous compounds180.58685512.6161004.134809
PolymersOther polymers107.2490767.4926002.455630
Subtotal1431.400000100.000000032.774068
Total4367.477408100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MPC8347EZQAGDB
产品内容声明 MPC8347EZQAGDB
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire
焊线
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive 1
环氧树脂粘合剂
OOOOOO
Epoxy Adhesive 2
环氧树脂粘合剂
OOOOOO
Heat Spreader
散热片
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
Solder Ball - Low Lead
焊球 - 低铅
XOOOOO
Substrate
基板
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MPC8347EZQAGDB
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding WireTest Report
24 Oct 2018
Test Report
24 Oct 2018
Test Report
24 Oct 2018
Test Report
24 Oct 2018
Die EncapsulantTest Report
23 May 2018
Test Report
23 May 2018
Test Report
23 May 2018
Test Report
23 May 2018
Epoxy Adhesive 1Test Report
21 Nov 2018
Test Report
21 Nov 2018
Test Report
21 Nov 2018
Test Report
21 Nov 2018
Epoxy Adhesive 2Test Report
15 May 2018
Not AvailableNot AvailableNot Available
Heat SpreaderNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
1 Aug 2017
Test Report
1 Aug 2017
Not AvailableNot Available
Solder Ball - Low LeadTest Report
5 Sep 2018
Test Report
5 Sep 2018
Test Report
5 Sep 2018
Test Report
5 Sep 2018
SubstrateAUS 703Test Report
20 Mar 2019
Test Report
20 Mar 2019
Test Report
18 Nov 2018
Not Available
COPPER FOILTest Report
30 Jan 2019
Test Report
30 Jan 2019
Test Report
30 Jan 2019
Not Available
E679FG SERIESTest Report
30 Jan 2019
Test Report
30 Jan 2019
Test Report
30 Jan 2019
Not Available
PHP-900 IR-6Test Report
19 Sep 2018
Test Report
22 Nov 2018
Test Report
19 Sep 2018
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.