MRFE6S9125NR1

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MRFE6S9125NR1Last Revision (GMT):
Wednesday, 14 April 2021, 01:38:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MRFE6S9125NR1SOT1736-1FM4F1638.975560 mg YesNoYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 140 595282020-10-177Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AlBonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-517.19884099.9900001.049365
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0017200.0100000.000105
Subtotal17.200560100.00000001.049470
Copper Lead-FrameCopper Lead-FrameCopper and its compoundsCopper, metal7440-50-8961.23182796.39550058.648332
Iron and its compoundsIron, metal7439-89-623.4336122.3500001.429772
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.1695200.0170000.010343
Nickel and its compoundsNickel, metal7440-02-09.9717501.0000000.608414
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.8226690.0825000.050194
Tin and its compoundsTin, metal7440-31-50.2991520.0300000.018252
Zinc and its compoundsZinc, metal7440-66-61.2464690.1250000.076052
Subtotal997.175000100.000000060.841359
Die EncapsulantDie EncapsulantAnhydridesBenzophenonetetracarboxylic Acid Dianhydride2421-28-542.1263107.4838002.570283
Epoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-216.8504112.9935001.028106
Epoxy ResinsProprietary Material-Other Epoxy resins16.8504112.9935001.028106
Inorganic Silicon compoundsQuartz14808-60-716.8504112.9935001.028106
Inorganic Silicon compoundsSilica, vitreous60676-86-0449.34956079.82760027.416489
Magnesium and its compoundsMagnesium, metal7439-95-41.0047760.1785000.061305
Organic Silicon compoundsOther organic Silicon Compounds3.0177070.5361000.184121
PolymersPoly[(phenyl glycidyl ether)-co-dicyclopentadiene]119345-05-016.8504112.9935001.028106
Subtotal562.900000100.000000034.344624
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0022800.0200000.000139
Tin and its compoundsTin, metal7440-31-511.39772099.9800000.695417
Subtotal11.400000100.00000000.695556
Semiconductor DieSemiconductor DieGold and its compoundsGold, metal7440-57-50.2621401.0200000.015994
Inorganic Silicon compoundsSilicon, doped24.92910397.0004001.521017
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5087571.9796000.031041
Subtotal25.700000100.00000001.568053
Solder WireSolder WireLead and its compoundsLead, metallic lead and lead alloys7439-92-123.49300095.5000001.433395
Silver and its compoundsSilver, metal7440-22-40.6150002.5000000.037523
Tin and its compoundsTin, metal7440-31-50.4920002.0000000.030019
Subtotal24.600000100.00000001.500938
Total1638.975560100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MRFE6S9125NR1
Product content declaration of MRFE6S9125NR1
上次修订 Last Revision (GMT):
Wednesday, 14 April 2021, 01:38:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铝
Bonding Wire - Al
焊丝-铝
Bonding Wire - Al
OOOOOO
铜引线框架
Copper Lead-Frame
铜引线框架
Copper Lead-Frame
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊丝
Solder Wire
焊丝
Solder Wire
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MRFE6S9125NR1Last Revision (GMT):
Wednesday, 14 April 2021, 01:38:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
16 Oct 2020
Test Report
16 Oct 2020
Test Report
16 Oct 2020
Test Report
16 Oct 2020
Copper Lead-FrameCDA 10200Test Report
2 Aug 2019
Test Report
2 Aug 2019
Test Report
2 Aug 2019
Not Available
CDA 194Test Report
2 Aug 2019
Test Report
2 Aug 2019
Test Report
2 Aug 2019
Not Available
CDA 194 + NI PLATINGTest Report
2 Aug 2019
Test Report
2 Aug 2019
Test Report
2 Aug 2019
Not Available
Die EncapsulantTest Report
12 Jun 2019
Test Report
12 Jun 2019
Test Report
12 Jun 2019
Test Report
12 Jun 2019
Post-plating - Lead FreeTest Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Semiconductor DieTest Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
Solder WireTest Report
30 Nov 2018
Test Report
30 Nov 2018
Not AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.