MC8641DHX1500KE

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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Product content declaration of MC8641DHX1500KE
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC8641DHX1500KESOT1601-1CBGA10235887.294000 mg YesNoYesTin/Lead (Sn10Pb90)Othere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 141 285572020-01-247Not ApplicableNot ApplicableNot Applicable3 | 168 hours24530 sec.3Kuala Lumpur, Malaysia
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
CapacitorBarium and its compoundsBarium titanate12047-27-795.61480065.4000001.624087
Copper and its compoundsCopper, metal7440-50-820.17560013.8000000.342697
Nickel and its compoundsNickel, metal7440-02-028.50900019.5000000.484246
Tin and its compoundsTin, metal7440-31-51.9006001.3000000.032283
Subtotal146.200000100.00000002.483314
Ceramic SubstrateAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1106.6969562.7220001.812326
Barium and its compoundsBarium oxide1304-28-5636.86950516.24750010.817695
Boron and its compoundsBoron oxide1303-86-2140.2818023.5788002.382789
Calcium and its compoundsCalcium monoxide1305-78-877.5258041.9778001.316833
Chromium and Chromium III compoundsDichromium trioxide1308-38-913.5821070.3465000.230702
Copper and its compoundsCopper, metal7440-50-8496.23100112.6596008.428847
Copper and its compoundsCuprous oxide1317-39-13.1358400.0800000.053264
Gold and its compoundsGold, metal7440-57-52.2970030.0586000.039016
Inorganic Silicon compoundsSilicon dioxide7631-86-92347.01552859.87590039.865778
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0391980.0010000.000666
Magnesium and its compoundsMagnesium-oxide1309-48-43.1358400.0800000.053264
Nickel and its compoundsNickel, metal7440-02-015.8791100.4051000.269718
Palladium and its compoundsPalladium, metal7440-05-30.1959900.0050000.003329
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-01.5679200.0400000.026632
Strontium and its compoundsStrontium Oxide1314-11-08.3726930.2136000.142216
Titanium and its compoundsTitanium (IV) Oxide13463-67-70.0627170.0016000.001065
Zinc and its compoundsZinc oxide1314-13-20.0509570.0013000.000865
Zirconium and its compoundsZirconium oxide1314-23-466.8600291.7057001.135666
Subtotal3919.800000100.000000066.580673
Semiconductor DieInorganic Silicon compoundsSilicon, doped309.44430089.1000005.256138
Lead and its compoundsLead, metallic lead and lead alloys7439-92-132.7076729.4177000.555564
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.1257000.9000000.053092
Nickel and its compoundsNickel, metal7440-02-00.2865230.0825000.004867
Tin and its compoundsTin, metal7440-31-51.7212190.4956000.029236
Titanium and its compoundsTitanium, metal7440-32-60.0145870.0042000.000248
Subtotal347.300000100.00000005.899145
Solder Ball - High LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-11130.75317789.57000019.206671
Tin and its compoundsTin, metal7440-31-5131.67082310.4300002.236525
Subtotal1262.424000100.000000021.443196
Solder FluxCopper and its compoundsCopper, metal7440-50-80.2670000.5000000.004535
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0044320.0083000.000075
Silver and its compoundsSilver, metal7440-22-41.6020003.0000000.027211
Tin and its compoundsTin, metal7440-31-551.52656896.4917000.875216
Subtotal53.400000100.00000000.907038
Solder PasteLead and its compoundsLead, metallic lead and lead alloys7439-92-131.64980037.0000000.537595
Tin and its compoundsTin, metal7440-31-553.89020063.0000000.915365
Subtotal85.540000100.00000001.452959
UnderfillCyanide compoundsOther inorganic cyanide compounds14.52600020.0000000.246735
Epoxy ResinsProprietary Material-Other Epoxy resins14.52600020.0000000.246735
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.1789003.0000000.037010
Organic Silicon compoundsProprietary Material-Methoxysilane2.1789003.0000000.037010
Organic Silicon compoundsProprietary Material-Other organic silicon compounds39.22020054.0000000.666184
Subtotal72.630000100.00000001.233674
Total5887.294000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MC8641DHX1500KE
产品内容声明 MC8641DHX1500KE
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Capacitor
电容器
OOOOOO
Ceramic Substrate
陶瓷基板
OOOOOO
Semiconductor Die
半导体芯片
XOOOOO
Solder Ball - High Lead
焊球 - 高铅
XOOOOO
Solder Flux
助焊剂
OOOOOO
Solder Paste
焊锡膏
XOOOOO
Underfill
底注
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MC8641DHX1500KE
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
31 Jan 2019
Test Report
31 Jan 2019
Test Report
31 Jan 2019
Not Available
INNER ELECTRODETest Report
21 Nov 2019
Test Report
21 Nov 2019
Test Report
7 Dec 2018
Not Available
NI PLATINGTest Report
21 Jun 2019
Test Report
21 Jun 2019
Test Report
21 Jun 2019
Not Available
OUTER ELECTRODETest Report
21 Nov 2019
Test Report
21 Nov 2019
Test Report
7 Dec 2018
Not Available
SN PLATINGTest Report
21 Jun 2019
Test Report
21 Jun 2019
Test Report
21 Jun 2019
Not Available
Ceramic SubstrateNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
10 Sep 2019
Test Report
10 Sep 2019
Test Report
10 Sep 2019
Not Available
Solder Ball - High LeadNot AvailableNot AvailableNot AvailableNot Available
Solder FluxNot AvailableNot AvailableNot AvailableNot Available
Solder PasteNot AvailableNot AvailableNot AvailableNot Available
UnderfillNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.