MK40DX128VMD10

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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Product content declaration of MK40DX128VMD10
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
MK40DX128VMD10SOT1535-1LBGA144465.667244 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 147 815572019-08-2353 | 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - CuCopper and its compoundsCopper, metal7440-50-83.58901497.0000000.770725
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1110003.0000000.023837
Subtotal3.700014100.00000000.794562
Die EncapsulantAluminum and its compoundsOther aluminum compounds7.0860003.0000001.521687
Epoxy ResinsOther Non-halogenated Epoxy resins11.8100005.0000002.536146
Inorganic Silicon compoundsSilica, vitreous60676-86-0200.77000085.00000043.114478
Inorganic compoundsCarbon Black1333-86-42.3620001.0000000.507229
Phenols and Phenolic ResinsOther phenolic resins7.0860003.0000001.521687
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-47.0860003.0000001.521687
Subtotal236.200000100.000000050.722915
Epoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.90000060.0000000.193271
Organic Silicon compounds3-(trimethoxysilyl)propyl methacrylate2530-85-00.0750005.0000000.016106
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.0750005.0000000.016106
Organic compoundsOther Bismaleimides0.30000020.0000000.064424
Polymers1-Methoxy-2-propyl acetate108-65-60.15000010.0000000.032212
Subtotal1.500000100.00000000.322118
Semiconductor DieInorganic Silicon compoundsSilicon, doped24.58548598.0000005.279625
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5017452.0000000.107747
Subtotal25.087230100.00000005.387373
Solder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.4359000.5000000.093608
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0185690.0213000.003988
Silver and its compoundsSilver, metal7440-22-43.4872004.0000000.748861
Tin and its compoundsTin, metal7440-31-583.23833195.47870017.875067
Subtotal87.180000100.000000018.721523
Substrate, Pre-plated NiAuAluminum and its compoundsAluminum Hydroxide21645-51-24.2557763.7998000.913909
Aromatic amines and their saltsOther aromatic amines and their salts0.0189280.0169000.004065
Aromatic hydrocarbon compounds1,2,4-Trimethylbenzene95-63-60.0057120.0051000.001227
Aromatic hydrocarbon compoundsOther Aromatic carbonyl compounds0.1198400.1070000.025735
Barium and its compoundsBarium sulfate7727-43-70.6397440.5712000.137382
Copper and its compoundsCopper phthalocyanine147-14-80.0057120.0051000.001227
Copper and its compoundsCopper, metal7440-50-850.93356845.47640010.937760
Epoxy ResinsOther Epoxy resins4.7579844.2482001.021756
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-51.7081121.5251000.366810
Epoxy ResinsProprietary Material-Other Epoxy resins2.0377281.8194000.437593
Gold and its compoundsGold, metal7440-57-51.5148001.3525000.325297
Inorganic Silicon compoundsFibrous-glass-wool65997-17-326.24182423.4302005.635317
Inorganic Silicon compoundsSilicon dioxide7631-86-93.4941763.1198000.750359
Magnesium and its compoundsTalc14807-96-60.3222240.2877000.069196
Nickel and its compoundsNickel, metal7440-02-011.82059210.5541002.538420
Organic compounds3-methoxy-3-methyl-1-butyl acetate103429-90-90.7013440.6262000.150611
Organic compoundsBis(3-ethyl-5-methyl-4-maleimidophenyl)methane105391-33-11.7081121.5251000.366810
Organic compoundsQuinacridone pigment1047-16-10.0057120.0051000.001227
PolymersTriazine25722-66-11.7081121.5251000.366810
Subtotal112.000000100.000000024.051509
Total465.667244100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MK40DX128VMD10
产品内容声明 MK40DX128VMD10
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - Cu
焊丝-铜
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
OOOOOO
Substrate, Pre-plated NiAu
基板,镍金预镀
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MK40DX128VMD10
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
3 Jun 2019
Test Report
3 Jun 2019
Test Report
3 Jun 2019
Test Report
3 Jun 2019
Die EncapsulantTest Report
18 Jul 2019
Test Report
18 Jul 2019
Test Report
18 Jul 2019
Test Report
18 Jul 2019
Epoxy AdhesiveTest Report
25 Sep 2019
Test Report
25 Sep 2019
Test Report
29 Sep 2019
Not Available
Semiconductor DieTest Report
10 Sep 2019
Test Report
10 Sep 2019
Test Report
10 Sep 2019
Not Available
Solder Ball - SAC, Lead FreeTest Report
24 Sep 2019
Test Report
24 Sep 2019
Test Report
24 Sep 2019
Test Report
5 Sep 2018
Substrate, Pre-plated NiAuAU PLATINGTest Report
8 Aug 2019
Test Report
8 Aug 2019
Test Report
8 Aug 2019
Test Report
8 Aug 2019
AUS308Test Report
15 Feb 2019
Test Report
15 Feb 2019
Test Report
15 Feb 2019
Test Report
15 Feb 2019
COPPER FOILTest Report
14 Jan 2020
Test Report
14 Jan 2020
Test Report
14 Jan 2020
Test Report
14 Jan 2020
CU PLATINGTest Report
3 Jul 2018
Test Report
3 Jul 2018
Test Report
3 Jul 2018
Test Report
3 Jul 2018
E679FG SERIESTest Report
14 Jan 2020
Test Report
14 Jan 2020
Test Report
14 Jan 2020
Test Report
14 Jan 2020
NI PLATINGTest Report
3 Jan 2019
Test Report
31 May 2019
Test Report
3 Jan 2019
Test Report
31 May 2019
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.