FXLN8361QR1

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of FXLN8361QR1
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
FXLN8361QR1SOT1679-2VQFN1223.323959 mg YesNoYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 148 461472019-10-044Not ApplicableNot ApplicableNot Applicable1 | Unlimited26040 sec.3External manufacturing
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - AuCopper and its compoundsCopper, metal7440-50-80.04164896.5429000.178562
Gold and its compoundsGold, metal7440-57-50.0001510.3507000.000649
Palladium and its compoundsPalladium, metal7440-05-30.0013403.1064000.005745
Subtotal0.043139100.00000000.184956
Copper Lead-FrameCopper and its compoundsCopper, metal7440-50-85.59540394.05620023.989938
Inorganic Silicon compoundsSilicon7440-21-30.0431300.7250000.184918
Iron and its compoundsIron, metal7439-89-60.0074360.1250000.031883
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0018620.0313000.007983
Magnesium and its compoundsMagnesium, metal7439-95-40.0104110.1750000.044635
Manganese and its compoundsManganese, metal7439-96-50.0037180.0625000.015941
Nickel and its compoundsNickel, metal7440-02-00.1903683.2000000.816191
Silver and its compoundsSilver, metal7440-22-40.0594901.0000000.255060
Zinc and its compoundsZinc, metal7440-66-60.0371810.6250000.159412
Subtotal5.949000100.000000025.505962
Die EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins0.3315002.5000001.421285
Inorganic Silicon compoundsSilica, vitreous60676-86-010.60800080.00000045.481130
Inorganic Silicon compoundsSilicon dioxide7631-86-91.2597009.5000005.400884
Inorganic compoundsCarbon Black1333-86-40.0663000.5000000.284257
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.9945007.5000004.263856
Subtotal13.260000100.000000056.851412
Epoxy AdhesiveOrganic Silicon compoundsSilicone modified epoxy resin218163-11-20.32400090.0000001.389129
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.03600010.0000000.154348
Subtotal0.360000100.00000001.543477
Post-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0000060.0200000.000026
Tin and its compoundsTin, metal7440-31-50.02999499.9800000.128597
Subtotal0.030000100.00000000.128623
Semiconductor Die 1Inorganic Silicon compoundsSilicon, doped0.96218498.0000004.125301
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0196362.0000000.084190
Subtotal0.981820100.00000004.209491
Semiconductor Die 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.0268460.9943000.115101
Inorganic Silicon compoundsSilicon, doped2.61827996.97330011.225706
Lead and its compoundsLead titanium oxide (PbTiO3)12060-00-30.0280291.0381000.120171
Organic compounds2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate25265-77-40.0268460.9943000.115101
Subtotal2.700000100.000000011.576080
Total23.323959100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of FXLN8361QR1
产品内容声明 FXLN8361QR1
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - Au
焊丝-金
OOOOOO
Copper Lead-Frame
铜引线框架
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Post-plating - Lead Free
封装后电镀- 无铅
OOOOOO
Semiconductor Die 1
半导体芯片
OOOOOO
Semiconductor Die 2
半导体芯片
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of FXLN8361QR1
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
18 Feb 2019
Test Report
18 Feb 2019
Test Report
18 Feb 2019
Test Report
18 Feb 2019
Copper Lead-FrameNot AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
16 Oct 2019
Test Report
16 Oct 2019
Test Report
16 Oct 2019
Test Report
16 Oct 2019
Epoxy AdhesiveTest Report
29 Jul 2019
Test Report
29 Jul 2019
Test Report
28 Dec 2018
Not Available
Post-plating - Lead FreeTest Report
17 Aug 2018
Test Report
14 Mar 2018
Test Report
17 Aug 2018
Test Report
17 Aug 2018
Semiconductor Die 1Not AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 2CAP DIETest Report
29 May 2018
Test Report
29 May 2018
Not AvailableNot Available
LEAD GLASS FRIT DIETest Report
29 May 2018
Test Report
29 May 2018
Not AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.