AFT23S160W02GSR3

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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Product content declaration of AFT23S160W02GSR3
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
AFT23S160W02GSR3SOT1802-1CFM24487.242889 mg YesYesYesN/ANot Applicablee4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 152 161282019-04-137NA | Not Available26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding WireAluminum and its compoundsAluminum, metal7429-90-55.799729100.0000000.129249
Subtotal5.799729100.00000000.129249
CapAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1760.31415394.23620016.943905
Epoxy ResinsProprietary Material-Other Epoxy resins17.6999622.1938000.394451
Inorganic Silicon compoundsQuartz14808-60-719.3337682.3963000.430861
Magnesium and its compoundsMagnesium-oxide1309-48-47.8914820.9781000.175865
Miscellaneous substancesProprietary Material-Other miscellaneous substances.1.5781350.1956000.035169
Subtotal806.817500100.000000017.980250
CapacitorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-11.1938783.1063000.026606
Barium and its compoundsBarium titanate12047-27-730.70580279.8921000.684291
Copper and its compoundsCopper, metal7440-50-82.3706156.1680000.052830
Gold and its compoundsGold, metal7440-57-52.4654706.4148000.054944
Manganese and its compoundsManganese dioxide1313-13-90.0388570.1011000.000866
Nickel and its compoundsNickel, metal7440-02-01.2801633.3308000.028529
Tin and its compoundsTin, metal7440-31-50.3793060.9869000.008453
Subtotal38.434090100.00000000.856519
Header Assembly/FlangeAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1240.4509926.8000005.358546
Chromium and Chromium III compoundsChromium, metal7440-47-30.6647760.0188000.014815
Cobalt and its compoundsCobalt, metal7440-48-414.0769910.3981000.313711
Copper and its compoundsCopper, metal7440-50-8969.73531527.42430021.610939
Gold and its compoundsGold, metal7440-57-55.0282550.1422000.112057
Inorganic Silicon compoundsQuartz14808-60-70.7743940.0219000.017258
Iron and its compoundsIron, metal7439-89-6152.4918974.3125003.398343
Manganese and its compoundsManganese, metal7439-96-52.6767850.0757000.059653
Molybdenum and its compoundsMolybdenum, metal7439-98-71917.50118854.22730042.732280
Nickel and its compoundsNickel, metal7440-02-0138.4750193.9161003.085971
Palladium and its compoundsPalladium, metal7440-05-342.3900961.1988000.944680
PolymersEthyl cellulose9004-57-30.3854290.0109000.008589
Silver and its compoundsSilver, metal7440-22-441.2125931.1655000.918439
Small Mineral and Ceramic FibersSilica, crystalline - tridymite15468-32-310.0105410.2831000.223089
Titanium and its compoundsTitanium (III, IV) oxide (Ti3O5)12065-65-50.1697300.0048000.003782
Subtotal3536.044000100.000000078.802153
Semiconductor Die 1Gold and its compoundsGold, metal7440-57-50.1473511.0200000.003284
Inorganic Silicon compoundsSilicon, doped14.01282397.0004000.312281
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2859761.9796000.006373
Subtotal14.446150100.00000000.321938
Semiconductor Die 2Gold and its compoundsGold, metal7440-57-50.4284001.0200000.009547
Inorganic Silicon compoundsSilicon, doped40.74016897.0004000.907911
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8314321.9796000.018529
Subtotal42.000000100.00000000.935987
Semiconductor Die 3Inorganic Silicon compoundsSilicon, doped32.50799298.0000000.724454
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.6634282.0000000.014785
Subtotal33.171420100.00000000.739238
Semiconductor Die 4Gold and its compoundsGold, metal7440-57-50.1074061.0200000.002394
Inorganic Silicon compoundsSilicon, doped10.21414297.0004000.227626
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2084521.9796000.004645
Subtotal10.530000100.00000000.234665
Total4487.242889100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of AFT23S160W02GSR3
产品内容声明 AFT23S160W02GSR3
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire
焊线
OOOOOO
Cap
盖子
OOOOOO
Capacitor
电容器
OOOOOO
Header Assembly/Flange
封装焊头/法兰
OOOOOO
Semiconductor Die 1
半导体芯片
OOOOOO
Semiconductor Die 2
半导体芯片
OOOOOO
Semiconductor Die 3
半导体芯片
OOOOOO
Semiconductor Die 4
半导体芯片
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of AFT23S160W02GSR3
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding WireTest Report
7 Dec 2018
Test Report
7 Dec 2018
Test Report
7 Dec 2018
Test Report
7 Dec 2018
CapTest Report
7 Nov 2018
Test Report
7 Nov 2018
Test Report
7 Nov 2018
Test Report
7 Nov 2018
CapacitorNot AvailableNot AvailableNot AvailableNot Available
Header Assembly/FlangeAGCU SOLDERTest Report
26 May 2017
Not AvailableNot AvailableNot Available
ALLOYTest Report
5 Jul 2016
Test Report
5 Jul 2016
Not AvailableNot Available
AU PLATINGTest Report
5 Apr 2018
Test Report
5 Apr 2018
Test Report
5 Apr 2018
Not Available
CERAMICTest Report
7 Nov 2018
Test Report
7 Nov 2018
Test Report
7 Nov 2018
Not Available
CPC BOARDTest Report
26 Oct 2015
Not AvailableNot AvailableNot Available
ELECTRIC CONDUCTOR (TUNGSTEN)Test Report
19 Feb 2016
Test Report
19 Feb 2016
Test Report
19 Feb 2016
Not Available
NICO PLATINGTest Report
12 Dec 2017
Test Report
12 Dec 2017
Test Report
12 Dec 2017
Not Available
PD PLATINGTest Report
31 Mar 2016
Test Report
31 Mar 2016
Not AvailableNot Available
Semiconductor Die 1Test Report
29 May 2018
Test Report
29 May 2018
Test Report
29 May 2018
Not Available
Semiconductor Die 2Test Report
29 May 2018
Test Report
29 May 2018
Test Report
29 May 2018
Not Available
Semiconductor Die 3Not AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 4Test Report
29 May 2018
Test Report
29 May 2018
Test Report
29 May 2018
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.