MC8641DVJ1000NE

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

Product content declaration of MC8641DVJ1000NE
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC8641DVJ1000NESOT1601-1CBGA10235456.534700 mg YesYesYesTin/Silver (Sn/Ag)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 156 185572019-07-0743 | 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
CapacitorBarium and its compoundsBarium titanate12047-27-795.61480065.4000001.752299
Copper and its compoundsCopper, metal7440-50-820.17560013.8000000.369751
Nickel and its compoundsNickel, metal7440-02-028.50900019.5000000.522474
Tin and its compoundsTin, metal7440-31-51.9006001.3000000.034832
Subtotal146.200000100.00000002.679356
Ceramic SubstrateAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-1106.6969562.7220001.955398
Barium and its compoundsBarium oxide1304-28-5636.86950516.24750011.671684
Boron and its compoundsBoron oxide1303-86-2140.2818023.5788002.570895
Calcium and its compoundsCalcium monoxide1305-78-877.5258041.9778001.420788
Chromium and Chromium III compoundsDichromium trioxide1308-38-913.5821070.3465000.248915
Copper and its compoundsCopper, metal7440-50-8496.23100112.6596009.094252
Copper and its compoundsCuprous oxide1317-39-13.1358400.0800000.057469
Gold and its compoundsGold, metal7440-57-52.2970030.0586000.042096
Inorganic Silicon compoundsSilicon dioxide7631-86-92347.01552859.87590043.012931
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0391980.0010000.000718
Magnesium and its compoundsMagnesium-oxide1309-48-43.1358400.0800000.057469
Nickel and its compoundsNickel, metal7440-02-015.8791100.4051000.291011
Palladium and its compoundsPalladium, metal7440-05-30.1959900.0050000.003592
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-01.5679200.0400000.028735
Strontium and its compoundsStrontium Oxide1314-11-08.3726930.2136000.153443
Titanium and its compoundsTitanium (IV) Oxide13463-67-70.0627170.0016000.001149
Zinc and its compoundsZinc oxide1314-13-20.0509570.0013000.000934
Zirconium and its compoundsZirconium oxide1314-23-466.8600291.7057001.225320
Subtotal3919.800000100.000000071.836801
Semiconductor DieInorganic Silicon compoundsSilicon, doped287.40696389.6000005.267207
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.8869000.9000000.052907
Nickel and its compoundsNickel, metal7440-02-01.6038330.5000000.029393
Silver and its compoundsSilver, metal7440-22-41.0104150.3150000.018517
Tin and its compoundsTin, metal7440-31-527.8585888.6850000.510555
Subtotal320.766700100.00000005.878579
Solder Ball - Lead FreeSilver and its compoundsSilver, metal7440-22-430.0369303.5000000.550476
Tin and its compoundsTin, metal7440-31-5828.16107096.50000015.177418
Subtotal858.198000100.000000015.727894
Solder FluxCopper and its compoundsCopper, metal7440-50-80.2670000.5000000.004893
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0044320.0083000.000081
Silver and its compoundsSilver, metal7440-22-41.6020003.0000000.029359
Tin and its compoundsTin, metal7440-31-551.52656896.4917000.944309
Subtotal53.400000100.00000000.978643
Solder PasteAromatic amines and their saltsProprietary Material-Other aromatic amines2.1131802.4704000.038727
Copper and its compoundsCopper, metal7440-50-80.5282950.6176000.009682
Glycidyl ethersPoly(ethylene glycol-ran-propylene glycol) monobutyl ether9038-95-34.3125855.0416000.079035
Organic compoundsOther organic compounds.3.6440904.2601000.066784
Silver and its compoundsSilver, metal7440-22-42.8679003.3527000.052559
Tin and its compoundsTin, metal7440-31-572.07395184.2576001.320874
Subtotal85.540000100.00000001.567662
UnderfillAromatic amines and their salts4,4'-Methylenebis(2-ethylbenzenamine)19900-65-37.98930011.0000000.146417
Bismuth and its compoundsBismuth nitrate10361-44-10.0726300.1000000.001331
Bismuth and its compoundsBismuth trioxide1304-76-30.5810400.8000000.010648
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-610.16820014.0000000.186349
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-57.26300010.0000000.133106
Inorganic Silicon compoundsSilica, vitreous60676-86-043.57800060.0000000.798639
Inorganic compoundsCarbon Black1333-86-40.0726300.1000000.001331
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-62.9052004.0000000.053243
Subtotal72.630000100.00000001.331065
Total5456.534700100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MC8641DVJ1000NE
产品内容声明 MC8641DVJ1000NE
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Capacitor
电容器
OOOOOO
Ceramic Substrate
陶瓷基板
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
Solder Ball - Lead Free
焊锡球-无铅
OOOOOO
Solder Flux
助焊剂
OOOOOO
Solder Paste
焊锡膏
OOOOOO
Underfill
底注
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MC8641DVJ1000NE
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
CapacitorCERAMICTest Report
22 Jan 2020
Test Report
22 Jan 2020
Test Report
22 Jan 2020
Test Report
22 Jan 2020
INNER ELECTRODETest Report
21 Nov 2019
Test Report
21 Nov 2019
Test Report
7 Dec 2018
Test Report
7 Dec 2018
NI PLATINGTest Report
21 Jun 2019
Test Report
21 Jun 2019
Test Report
21 Jun 2019
Test Report
21 Jun 2019
OUTER ELECTRODETest Report
21 Nov 2019
Test Report
21 Nov 2019
Test Report
7 Dec 2018
Test Report
7 Dec 2018
SN PLATINGTest Report
21 Jun 2019
Test Report
21 Jun 2019
Test Report
21 Jun 2019
Test Report
21 Jun 2019
Ceramic SubstrateNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieTest Report
10 Sep 2019
Test Report
10 Sep 2019
Test Report
10 Sep 2019
Not Available
Solder Ball - Lead FreeNot AvailableNot AvailableNot AvailableNot Available
Solder FluxNot AvailableNot AvailableNot AvailableNot Available
Solder PasteNot AvailableNot AvailableNot AvailableNot Available
UnderfillTest Report
10 Mar 2020
Test Report
10 Mar 2020
Test Report
10 Mar 2020
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.