MMA2606KGCWR2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MMA2606KGCWR2Last Revision (GMT):
Monday, 31 May 2021, 07:59:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MMA2606KGCWR2SOT1574-3HQFN16199.151291 mg YesNoYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 156 375282019-11-065Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-80.19459097.2995000.097710
Palladium and its compoundsPalladium, metal7440-05-30.0054012.7005000.002712
Subtotal0.199991100.00000000.100422
Copper Lead-FrameCopper AlloyCopper and its compoundsCopper, metal7440-50-854.83077697.52000027.532222
Iron and its compoundsIron, metal7439-89-61.2931792.3000000.649345
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0168680.0300000.008470
Zinc and its compoundsZinc, metal7440-66-60.0843380.1500000.042349
Subtotal56.225160100.000000028.232385
Silver PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000170.0100000.000009
Silver and its compoundsSilver, metal7440-22-40.17482299.9900000.087784
Subtotal0.174840100.00000000.087793
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins3.2040002.5000001.608827
Inorganic Silicon compoundsSilica, vitreous60676-86-0102.52800080.00000051.482468
Inorganic Silicon compoundsSilicon dioxide7631-86-912.1752009.5000006.113543
Inorganic compoundsCarbon Black1333-86-40.6408000.5000000.321765
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins9.6120007.5000004.826481
Subtotal128.160000100.000000064.353085
Epoxy Adhesive 1Epoxy AdhesiveMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0500509.1000000.025132
PolymersOther acrylic resins0.0467508.5000000.023475
PolymersPlastic: EP - Epoxide, Epoxy0.0071501.3000000.003590
PolymersPlastic: PBR - Polybutadiene Rubber0.0264004.8000000.013256
Silver and its compoundsSilver, metal7440-22-40.41965076.3000000.210719
Subtotal0.550000100.00000000.276172
Epoxy Adhesive 2Epoxy AdhesiveAnhydridesPolybutadiene adducted with maleic anhydride25655-35-00.0005000.5000000.000251
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0005000.5000000.000251
Organic compoundsOther Bismaleimides0.04900049.0000000.024604
PolymersPolytetrafluoroethylene9002-84-00.04000040.0000000.020085
Titanium and its compoundsTitanium (IV) Oxide13463-67-70.01000010.0000000.005021
Subtotal0.100000100.00000000.050213
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0003180.0200000.000160
Tin and its compoundsTin, metal7440-31-51.58768299.9800000.797224
Subtotal1.588000100.00000000.797384
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsFibrous-glass-wool65997-17-30.0586640.9943000.029457
Inorganic Silicon compoundsSilicon, doped5.72142596.9733002.872904
Lead and its compoundsLead titanium oxide (PbTiO3)12060-00-30.0612481.0381000.030755
Organic compounds2,2,4-trimethyl-1,3-pentanediol-1-monoisobutyrate25265-77-40.0586640.9943000.029457
Subtotal5.900000100.00000002.962572
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon7440-21-36.12823498.0000003.077175
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1250662.0000000.062799
Subtotal6.253300100.00000003.139975
Total199.151291100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MMA2606KGCWR2
Product content declaration of MMA2606KGCWR2
上次修订 Last Revision (GMT):
Monday, 31 May 2021, 07:59:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
铜引线框架
Copper Lead-Frame
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
XOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MMA2606KGCWR2Last Revision (GMT):
Monday, 31 May 2021, 07:59:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
2 Feb 2021
Test Report
2 Feb 2021
Test Report
2 Feb 2021
Test Report
2 Feb 2021
Copper Lead-FrameAG PLATINGTest Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
C7025Test Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
Test Report
20 Nov 2020
Die EncapsulantTest Report
16 Sep 2020
Test Report
16 Sep 2020
Test Report
16 Sep 2020
Test Report
16 Sep 2020
Epoxy Adhesive 1Test Report
27 Jul 2020
Test Report
27 Jul 2020
Test Report
27 Jul 2020
Test Report
27 Jul 2020
Epoxy Adhesive 2Test Report
4 Jan 2021
Test Report
4 Jan 2021
Test Report
3 Mar 2020
Test Report
3 Mar 2020
Post-plating - Lead FreeTest Report
3 Sep 2020
Test Report
3 Sep 2020
Test Report
16 Dec 2019
Test Report
18 Dec 2019
Semiconductor Die 1CAP DIETest Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
LEAD GLASS FRIT DIETest Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Semiconductor Die 2Test Report
10 Aug 2020
Test Report
10 Aug 2020
Test Report
10 Aug 2020
Test Report
10 Aug 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.