MRF8VP13350NR5

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MRF8VP13350NR5Last Revision (GMT):
Saturday, 24 April 2021, 01:13:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MRF8VP13350NR5SOT1818-4FM4F3240.842414 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 160 895782018-02-2033 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AlBonding Wire - AlAluminum and its compoundsAluminum, metal7429-90-52.23971099.9900000.069109
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002240.0100000.000007
Subtotal2.239934100.00000000.069116
Copper Lead-FrameCopper AlloyCopper and its compoundsCopper, metal7440-50-8500.41572497.29100015.440915
Iron and its compoundsIron, metal7439-89-612.1900822.3700000.376139
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0874390.0170000.002698
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.8538200.1660000.026346
Tin and its compoundsTin, metal7440-31-50.1543050.0300000.004761
Zinc and its compoundsZinc, metal7440-66-60.6480800.1260000.019997
Subtotal514.349451100.000000015.870857
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0005190.0100000.000016
Silver and its compoundsSilver, metal7440-22-45.19492999.9900000.160296
Subtotal5.195449100.00000000.160312
Die EncapsulantDie EncapsulantAnhydridesBenzophenonetetracarboxylic Acid Dianhydride2421-28-562.7217287.4838001.935353
Epoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-225.0885242.9935000.774136
Epoxy ResinsOther Epoxy resins25.0885242.9935000.774136
Epoxy ResinsProprietary Material-Other Epoxy resins25.0885242.9935000.774136
Inorganic Silicon compoundsQuartz14808-60-725.0885242.9935000.774136
Inorganic Silicon compoundsSilica, vitreous60676-86-0669.03511679.82760020.643864
Magnesium and its compoundsMagnesium, metal7439-95-41.4960090.1785000.046161
Organic Silicon compoundsProprietary Material-Other organic silicon compounds4.4930540.5361000.138638
Subtotal838.100000100.000000025.860560
Header Assembly/FlangeHeader Assembly/FlangeCobalt and its compoundsCobalt, metal7440-48-45.8016050.3383000.179015
Copper and its compoundsCopper, metal7440-50-81684.95375698.25210051.991228
Gold and its compoundsGold, metal7440-57-58.8781870.5177000.273947
Nickel and its compoundsNickel, metal7440-02-013.6251110.7945000.420419
Zirconium and its compoundsZirconium, metal7440-67-71.6703410.0974000.051540
Subtotal1714.929000100.000000052.916149
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0050000.0200000.000154
Tin and its compoundsTin, metal7440-31-524.99500099.9800000.771250
Subtotal25.000000100.00000000.771404
Semiconductor Die 1Semiconductor DieGold and its compoundsGold, metal7440-57-50.2940521.0200000.009073
Inorganic Silicon compoundsSilicon, doped27.96383897.0004000.862857
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.5706911.9796000.017609
Subtotal28.828580100.00000000.889540
Semiconductor Die 2Semiconductor DieGold and its compoundsGold, metal7440-57-51.1444401.0200000.035313
Inorganic Silicon compoundsSilicon, doped108.83444997.0004003.358215
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.2211111.9796000.068535
Subtotal112.200000100.00000003.462063
Total3240.842414100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MRF8VP13350NR5
Product content declaration of MRF8VP13350NR5
上次修订 Last Revision (GMT):
Saturday, 24 April 2021, 01:13:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铝
Bonding Wire - Al
焊丝-铝
Bonding Wire - Al
OOOOOO
铜引线框架
Copper Lead-Frame
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
封装焊头/法兰
Header Assembly/Flange
封装焊头/法兰
Header Assembly/Flange
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MRF8VP13350NR5Last Revision (GMT):
Saturday, 24 April 2021, 01:13:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AlTest Report
26 Nov 2019
Test Report
26 Nov 2019
Test Report
26 Nov 2019
Test Report
26 Nov 2019
Copper Lead-FrameCDA 194Test Report
2 Aug 2019
Test Report
2 Aug 2019
Test Report
2 Aug 2019
Not Available
CDA 194 + NI PLATINGTest Report
2 Aug 2019
Test Report
2 Aug 2019
Test Report
2 Aug 2019
Not Available
Die EncapsulantTest Report
12 Jun 2019
Test Report
12 Jun 2019
Test Report
12 Jun 2019
Test Report
12 Jun 2019
Header Assembly/FlangeC151Test Report
2 Aug 2019
Test Report
2 Aug 2019
Test Report
2 Aug 2019
Not Available
C151 + CU_NICO_AU PLATINGTest Report
2 Aug 2019
Test Report
2 Aug 2019
Test Report
2 Aug 2019
Not Available
Post-plating - Lead FreeTest Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Test Report
16 Apr 2019
Semiconductor Die 1Test Report
20 May 2019
Test Report
20 May 2019
Test Report
20 May 2019
Test Report
20 May 2019
Semiconductor Die 2Test Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
Test Report
3 Aug 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.