MC33932VWR2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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Product content declaration of MC33932VWR2
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC33932VWR2SOT1305-2HSOP441910.528945 mg NoNoYesOtherCu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 169 465182019-10-042Not ApplicableNot ApplicableNot Applicable3 | 168 hours24530 sec.3External manufacturing
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding Wire - AuGold and its compoundsGold, metal7440-57-51.539945100.0000000.080603
Subtotal1.539945100.00000000.080603
Copper Lead-Frame, Pre-PlatedCopper and its compoundsCopper, metal7440-50-81115.42026797.79550058.382799
Gold and its compoundsGold, metal7440-57-50.3912130.0343000.020477
Iron and its compoundsIron, metal7439-89-613.6662381.1982000.715312
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.2349560.0206000.012298
Nickel and its compoundsNickel, metal7440-02-09.9993250.8767000.523380
Palladium and its compoundsPalladium, metal7440-05-30.8520010.0747000.044595
Subtotal1140.564000100.000000059.698860
Die EncapsulantAntimony OxidesAntimony(III) oxide1309-64-410.6949131.4479000.559788
Bismuth and its compoundsBismuth, metal7440-69-97.3754200.9985000.386041
Epoxy ResinsProprietary Material-Other Epoxy resins43.5160875.8913002.277698
Inorganic Silicon compoundsSilica, vitreous60676-86-0608.83964982.42600031.867596
Inorganic compoundsCarbon Black1333-86-42.2129950.2996000.115832
Organic Phosphorus compoundsOther organic phosphorous compounds7.3754200.9985000.386041
Organic Silicon compoundsOther organic Silicon Compounds7.3754200.9985000.386041
Phenols - Specific3,5,3',5'-Tetrabromobisphenol A, epichlorohydrin polymer40039-93-84.4252520.5991000.231624
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-428.7645083.8942001.505578
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins10.6949131.4479000.559788
Zinc and its compoundsZinc, metal7440-66-67.3754200.9985000.386041
Subtotal738.650000100.000000038.662068
Semiconductor DieInorganic Silicon compoundsSilicon, doped14.57750098.0000000.763009
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2975002.0000000.015572
Subtotal14.875000100.00000000.778580
Solder WireCadmium and its compoundsCadmium, metal7440-43-90.0001490.0010000.000008
Chromium VI and its compoundsChromium(VI)18540-29-90.0001490.0010000.000008
Lead and its compoundsLead, metallic lead and lead alloys7439-92-114.22815995.4910000.744724
Mercury and its compoundsMercury7439-97-60.0001490.0010000.000008
Silver and its compoundsSilver, metal7440-22-40.3729922.5033000.019523
Tin and its compoundsTin, metal7440-31-50.2984022.0027000.015619
Subtotal14.900000100.00000000.779889
Total1910.528945100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MC33932VWR2
产品内容声明 MC33932VWR2
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire - Au
焊丝-金
OOOOOO
Copper Lead-Frame, Pre-Plated
铜引线框架,预镀
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
Solder Wire
焊丝
XOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MC33932VWR2
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuNot AvailableNot AvailableNot AvailableNot Available
Copper Lead-Frame, Pre-PlatedAU PLATINGTest Report
2 Aug 2019
Test Report
2 Aug 2019
Test Report
2 Aug 2019
Not Available
CDA 10200Test Report
2 Aug 2019
Test Report
2 Aug 2019
Test Report
2 Aug 2019
Not Available
CDA 194Test Report
2 Aug 2019
Test Report
2 Aug 2019
Test Report
2 Aug 2019
Not Available
CDA 194 + NIPDAU PLATINGTest Report
2 Aug 2019
Test Report
2 Aug 2019
Test Report
2 Aug 2019
Not Available
Die EncapsulantTest Report
9 Sep 2019
Test Report
9 Sep 2019
Not AvailableTest Report
27 Aug 2018
Semiconductor DieTest Report
20 May 2019
Test Report
20 May 2019
Test Report
20 May 2019
Test Report
20 May 2019
Solder WireNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.