MSC8251SAG1000B

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
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Please see also our Restricted Substances Declaration.

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Product content declaration of MSC8251SAG1000B
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MSC8251SAG1000BSOT1624-1BGA78310922.739000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 177 185572019-04-0973 | 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Capacitor 1Barium and its compoundsBarium titanate12047-27-71.13785785.8760000.010417
Calcium and its compoundsCalcium monoxide1305-78-80.0238341.7988000.000218
Copper and its compoundsCuprous oxide1317-39-10.0617934.6636000.000566
Nickel and its compoundsNickel, metal7440-02-00.0829786.2625000.000760
Tin and its compoundsTin, metal7440-31-50.0185381.3991000.000170
Subtotal1.325000100.00000000.012131
Capacitor 2Barium and its compoundsBarium titanate12047-27-71.13785785.8760000.010417
Calcium and its compoundsCalcium monoxide1305-78-80.0238341.7988000.000218
Copper and its compoundsCuprous oxide1317-39-10.0617934.6636000.000566
Nickel and its compoundsNickel, metal7440-02-00.0829786.2625000.000760
Tin and its compoundsTin, metal7440-31-50.0185381.3991000.000170
Subtotal1.325000100.00000000.012131
Capacitor 3Barium and its compoundsBarium titanate12047-27-71.13785785.8760000.010417
Calcium and its compoundsCalcium monoxide1305-78-80.0238341.7988000.000218
Copper and its compoundsCuprous oxide1317-39-10.0617934.6636000.000566
Nickel and its compoundsNickel, metal7440-02-00.0829786.2625000.000760
Tin and its compoundsTin, metal7440-31-50.0185381.3991000.000170
Subtotal1.325000100.00000000.012131
Capacitor 4Barium and its compoundsBarium titanate12047-27-79.96161685.8760000.091201
Calcium and its compoundsCalcium monoxide1305-78-80.2086611.7988000.001910
Copper and its compoundsCuprous oxide1317-39-10.5409784.6636000.004953
Nickel and its compoundsNickel, metal7440-02-00.7264506.2625000.006651
Tin and its compoundsTin, metal7440-31-50.1622961.3991000.001486
Subtotal11.600000100.00000000.106201
Capacitor 5Barium and its compoundsBarium titanate12047-27-79.96161685.8760000.091201
Calcium and its compoundsCalcium monoxide1305-78-80.2086611.7988000.001910
Copper and its compoundsCuprous oxide1317-39-10.5409784.6636000.004953
Nickel and its compoundsNickel, metal7440-02-00.7264506.2625000.006651
Tin and its compoundsTin, metal7440-31-50.1622961.3991000.001486
Subtotal11.600000100.00000000.106201
Die EncapsulantAluminum and its compoundsAluminum, metal7429-90-520.70000072.0000000.189513
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2875001.0000000.002632
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones2.5875009.0000000.023689
Zinc and its compoundsZinc oxide1314-13-25.17500018.0000000.047378
Subtotal28.750000100.00000000.263212
Epoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-711.67200040.0000000.106860
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-64.37700015.0000000.040072
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-213.13100045.0000000.120217
Subtotal29.180000100.00000000.267149
Heat SpreaderCopper and its compoundsCopper, metal7440-50-86990.43161094.02060063.998889
Nickel and its compoundsNickel, metal7440-02-0444.5683905.9794004.070118
Subtotal7435.000000100.000000068.069007
Semiconductor DieInorganic Silicon compoundsSilicon, doped195.05920089.6000001.785808
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.9593000.9000000.017938
Nickel and its compoundsNickel, metal7440-02-01.0885000.5000000.009965
Silver and its compoundsSilver, metal7440-22-40.6857550.3150000.006278
Tin and its compoundsTin, metal7440-31-518.9072458.6850000.173100
Subtotal217.700000100.00000001.993090
Solder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-83.2868260.5009000.030092
Silver and its compoundsSilver, metal7440-22-419.7209543.0054000.180550
Tin and its compoundsTin, metal7440-31-5633.17622096.4937005.796863
Subtotal656.184000100.00000006.007504
SubstrateAcrylonitrile compoundsProprietary Material-Other acrylonitrile compounds228.5475009.1419002.092401
Arsenic and its compoundsArsenic, metal7440-38-20.0250000.0010000.000229
Barium and its compoundsBarium sulfate7727-43-711.5500000.4620000.105743
Copper and its compoundsCopper, metal7440-50-81141.27750045.65110010.448638
Inorganic Silicon compoundsFibrous-glass-wool65997-17-31022.90750040.9163009.364936
Inorganic Silicon compoundsSilicon dioxide7631-86-973.2350002.9294000.670482
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0250000.0010000.000229
Silver and its compoundsSilver, metal7440-22-40.5375000.0215000.004921
Tin and its compoundsTin, metal7440-31-521.8950000.8758000.200453
Subtotal2500.000000100.000000022.888032
UnderfillInorganic Silicon compoundsSilica, vitreous60676-86-017.25000060.0000000.157927
Inorganic compoundsCarbon Black1333-86-40.0287500.1000000.000263
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.2587500.9000000.002369
PolymersPlastic: EP - Epoxide, Epoxy11.21250039.0000000.102653
Subtotal28.750000100.00000000.263212
Total10922.739000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MSC8251SAG1000B
产品内容声明 MSC8251SAG1000B
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Capacitor 1
电容器
OOOOOO
Capacitor 2
电容器
OOOOOO
Capacitor 3
电容器
OOOOOO
Capacitor 4
电容器
OOOOOO
Capacitor 5
电容器
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Heat Spreader
散热片
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
OOOOOO
Substrate
基板
OOOOOO
Underfill
底注
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MSC8251SAG1000B
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Capacitor 1Not AvailableNot AvailableNot AvailableNot Available
Capacitor 2Not AvailableNot AvailableNot AvailableNot Available
Capacitor 3Not AvailableNot AvailableNot AvailableNot Available
Capacitor 4Not AvailableNot AvailableNot AvailableNot Available
Capacitor 5Not AvailableNot AvailableNot AvailableNot Available
Die EncapsulantTest Report
23 Nov 2018
Test Report
23 Nov 2018
Test Report
23 Nov 2018
Test Report
23 Nov 2018
Epoxy AdhesiveTest Report
7 Mar 2019
Test Report
7 Mar 2019
Test Report
7 Mar 2019
Test Report
7 Mar 2019
Heat SpreaderNot AvailableNot AvailableNot AvailableNot Available
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
Solder Ball - SAC, Lead FreeTest Report
29 Oct 2018
Test Report
29 Oct 2018
Test Report
29 Oct 2018
Test Report
29 Oct 2018
SubstrateNot AvailableNot AvailableNot AvailableNot Available
UnderfillTest Report
2 Apr 2019
Test Report
2 Apr 2019
Test Report
2 Apr 2019
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.