LS1012ASN7HKA

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of LS1012ASN7HKA
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen FreeLead FreeEU RoHS CompliantPlatingBase Alloy
LS1012ASN7HKASOT1868-1VFLGA211164.320000 mg YesYesYesNot ApplicableOtherNot Applicablecontact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 187 545572019-12-0373 | 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Die EncapsulantInorganic Silicon compoundsSilica, vitreous60676-86-067.24296175.03120040.921958
Inorganic Silicon compoundsSilicon dioxide7631-86-917.90159519.97500010.894349
Inorganic compoundsCarbon Black1333-86-44.4754444.9938002.723615
Subtotal89.620000100.000000054.539922
Semiconductor DieInorganic Silicon compoundsSilicon, doped17.56160089.60000010.687439
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1764000.9000000.107352
Nickel and its compoundsNickel, metal7440-02-00.0980000.5000000.059640
Silver and its compoundsSilver, metal7440-22-40.0617400.3150000.037573
Tin and its compoundsTin, metal7440-31-51.7022608.6850001.035942
Subtotal19.600000100.000000011.927945
Solder PasteCopper and its compoundsCopper, metal7440-50-80.0451000.5500000.027446
Silver and its compoundsSilver, metal7440-22-40.2705923.2999000.164674
Tin and its compoundsTin, metal7440-31-57.88430896.1501004.798143
Subtotal8.200000100.00000004.990263
SubstrateAcrylonitrile compoundsAcrylonitrile/Butadiene copolymer, carboxyl terminated (26/74)68891-46-32.9789946.3518001.812922
Barium and its compoundsBarium sulfate7727-43-75.47735711.6788003.333348
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-518.71863439.91180011.391574
Epoxy ResinsTetramethylbiphenyl diglycidyl ether85954-11-64.99522510.6508003.039937
Inorganic Silicon compoundsFibrous-glass-wool65997-17-312.45237226.5509007.578123
Inorganic Silicon compoundsSilicon7440-21-32.2774174.8559001.385965
Subtotal46.900000100.000000028.541870
Total164.320000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of LS1012ASN7HKA
产品内容声明 LS1012ASN7HKA
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Die Encapsulant
芯片密封胶
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
Solder Paste
焊锡膏
OOOOOO
Substrate
基板
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of LS1012ASN7HKA
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Die EncapsulantTest Report
12 Apr 2019
Test Report
12 Apr 2019
Test Report
12 Apr 2019
Test Report
12 Apr 2019
Semiconductor DieTest Report
28 Dec 2018
Test Report
28 Dec 2018
Test Report
28 Dec 2018
Test Report
28 Dec 2018
Solder PasteTest Report
24 May 2019
Test Report
24 May 2019
Test Report
24 May 2019
Test Report
24 May 2019
SubstrateAUS 320Test Report
31 Jul 2019
Test Report
31 Jul 2019
Test Report
16 Nov 2018
Not Available
COPPER FOILTest Report
27 Mar 2019
Test Report
27 Mar 2019
Test Report
27 Mar 2019
Not Available
HL832NSTest Report
16 Apr 2019
Test Report
16 Apr 2019
Not AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.