MM912J637AV1EPR2

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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Product content declaration of MM912J637AV1EPR2
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MM912J637AV1EPR2SOT619-16HVQFN48148.190325 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 188 665642018-06-0623 | 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding WireGold and its compoundsGold, metal7440-57-51.519965100.0000001.025684
Subtotal1.519965100.00000001.025684
Copper Lead-FrameCopper and its compoundsCopper, metal7440-50-877.79116896.39550052.494094
Iron and its compoundsIron, metal7439-89-61.8964502.3500001.279739
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0137190.0170000.009258
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0665770.0825000.044927
Silver and its compoundsSilver, metal7440-22-40.8070001.0000000.544570
Tin and its compoundsTin, metal7440-31-50.0242100.0300000.016337
Zinc and its compoundsZinc, metal7440-66-60.1008750.1250000.068071
Subtotal80.700000100.000000054.456996
Die EncapsulantArsenic and its compoundsArsenic, metal7440-38-20.0004650.0010000.000314
Cadmium and its compoundsCadmium, metal7440-43-90.0004650.0010000.000314
Epoxy ResinsProprietary Material-Other Epoxy resins3.5353627.6062002.385690
Inorganic Silicon compoundsSilica, vitreous60676-86-040.06775986.20430027.038040
Inorganic compoundsCarbon Black1333-86-40.1414390.3043000.095444
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0004650.0010000.000314
Organic Phosphorus compoundsOther organic phosphorous compounds0.1414390.3043000.095444
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins2.5926085.5779001.749512
Subtotal46.480000100.000000031.365071
Epoxy AdhesiveCadmium and its compoundsCadmium, metal7440-43-90.0000320.0011000.000022
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0003250.0112000.000219
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-60.0341361.1771000.023035
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.0341361.1771000.023035
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.2048187.0627000.138213
Silver and its compoundsSilver, metal7440-22-42.62655390.5708001.772419
Subtotal2.900000100.00000001.956943
Post-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0006160.0200000.000416
Tin and its compoundsTin, metal7440-31-53.07938499.9800002.077993
Subtotal3.080000100.00000002.078408
Semiconductor Die 1Inorganic Silicon compoundsSilicon, doped6.79763398.0000004.587096
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1387272.0000000.093614
Subtotal6.936360100.00000004.680710
Semiconductor Die 2Inorganic Silicon compoundsSilicon, doped6.44252098.0000004.347463
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1314802.0000000.088724
Subtotal6.574000100.00000004.436187
Total148.190325100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MM912J637AV1EPR2
产品内容声明 MM912J637AV1EPR2
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire
焊线
OOOOOO
Copper Lead-Frame
铜引线框架
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Post-plating - Lead Free
封装后电镀- 无铅
OOOOOO
Semiconductor Die 1
半导体芯片
OOOOOO
Semiconductor Die 2
半导体芯片
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MM912J637AV1EPR2
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding WireTest Report
22 Aug 2018
Test Report
22 Aug 2018
Test Report
22 Aug 2018
Test Report
22 Aug 2018
Copper Lead-FrameTest Report
12 Mar 2019
Test Report
12 Mar 2019
Test Report
12 Mar 2019
Test Report
12 Mar 2019
Die EncapsulantTest Report
23 Jan 2019
Test Report
23 Jan 2019
Test Report
23 Jan 2019
Test Report
23 Jan 2019
Epoxy AdhesiveTest Report
21 Sep 2018
Test Report
21 Sep 2018
Test Report
21 Sep 2018
Test Report
21 Sep 2018
Post-plating - Lead FreeTest Report
17 Aug 2018
Test Report
14 Mar 2018
Test Report
17 Aug 2018
Test Report
17 Aug 2018
Semiconductor Die 1Test Report
28 Dec 2018
Test Report
28 Dec 2018
Test Report
28 Dec 2018
Test Report
28 Dec 2018
Semiconductor Die 2Not AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.