MPC8347CZUAGDB

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

Product content declaration of MPC8347CZUAGDB
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MPC8347CZUAGDBSOT1706-1LBGA6729352.175766 mg NoNoNoOtherOthere0contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
| Floor Life
Peak Package temperatureMax time at peak temperature
9353 191 685572019-04-306Not ApplicableNot ApplicableNot Applicable3 | 168 hours26040 sec.3Kuala Lumpur, Malaysia
SubpartCategorySubstancesCAS numberMass(mg)Mass(%) of
Subpart
Mass(%) of
Total part
Bonding WireCopper and its compoundsCopper, metal7440-50-815.20251797.6350000.162556
Gold and its compoundsGold, metal7440-57-50.0264080.1696000.000282
Palladium and its compoundsPalladium, metal7440-05-30.3418412.1954000.003655
Subtotal15.570766100.00000000.166493
Die EncapsulantEpoxy ResinsOther Epoxy resins11.6640006.0000000.124720
Inorganic Silicon compoundsSilica, vitreous60676-86-0167.18400086.0000001.787648
Inorganic compoundsCarbon Black1333-86-41.9440001.0000000.020787
Inorganic compoundsOther inorganic compounds3.8880002.0000000.041573
Phenols and Phenolic ResinsOther phenolic resins9.7200005.0000000.103933
Subtotal194.400000100.00000002.078661
Epoxy AdhesiveAromatic amines and their salts1,3,5-Triazine-2,4-diamine, 6-[2-(2-methyl-1H-imidazol-1-yl)ethyl]38668-46-10.3802950.8451000.004066
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-55.83105512.9579000.062350
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-60.3802950.8451000.004066
Silver and its compoundsSilver, metal7440-22-438.40835585.3519000.410689
Subtotal45.000000100.00000000.481171
Semiconductor DieInorganic Silicon compoundsSilicon, doped29.40000098.0000000.314365
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.6000002.0000000.006416
Subtotal30.000000100.00000000.320781
Solder Ball - Low LeadLead and its compoundsLead, metallic lead and lead alloys7439-92-1321.19380036.0000003.434429
Silver and its compoundsSilver, metal7440-22-417.8441002.0000000.190802
Tin and its compoundsTin, metal7440-31-5553.16710062.0000005.914849
Subtotal892.205000100.00000009.540079
Substrate, Pre-plated NiAuAromatic hydrocarbon compoundsOther Aromatic hydrocarbon compounds3.2209500.0394000.034441
Barium and its compoundsOther barium compounds2.5179000.0308000.026923
Copper and its compoundsCopper, metal7440-50-87361.11335090.04420078.710169
Copper and its compoundsCupric oxide1317-38-0214.8144752.6277002.296946
Copper and its compoundsOther copper compounds0.0817500.0010000.000874
Gold and its compoundsGold, metal7440-57-51.1199750.0137000.011976
Inorganic compoundsOther inorganic compounds10.1370000.1240000.108392
Nickel and its compoundsNickel, metal7440-02-010.3495500.1266000.110665
Organic Silicon compoundsOther organic Silicon Compounds192.6602252.3567002.060058
Organic compoundsOther organic compounds.12.8347500.1570000.137238
PhthalatesPolyethylene terephthalate25038-59-93.2046000.0392000.034266
PolymersOther non-halogenated polymers7.2430500.0886000.077448
PolymersPoly[(1,1',3,3'-tetrahydro-1,1',3,3'-tetraoxo[5,5'-bi-2H-isoindole]-2,2'-diyl)-1,4-phenylene]32197-39-070.5829500.8634000.754722
PolymersProprietary Material-Other acrylic/epoxy resin mixture256.6623003.1396002.744413
Zirconium and its compoundsZirconium, metal7440-67-728.4571750.3481000.304284
Subtotal8175.000000100.000000087.412814
Total9352.175766100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
Product content declaration of MPC8347CZUAGDB
产品内容声明 MPC8347CZUAGDB
Name of the part
部件名称
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
Bonding Wire
焊线
OOOOOO
Die Encapsulant
芯片密封胶
OOOOOO
Epoxy Adhesive
环氧树脂粘合剂
OOOOOO
Semiconductor Die
半导体芯片
OOOOOO
Solder Ball - Low Lead
焊球 - 低铅
XOOOOO
Substrate, Pre-plated NiAu
基板,镍金预镀
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
Disclaimer
免责声明
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。
Compliance Documentation of MPC8347CZUAGDB
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding WireTest Report
18 Feb 2019
Test Report
18 Feb 2019
Test Report
18 Feb 2019
Test Report
18 Feb 2019
Die EncapsulantTest Report
22 Mar 2019
Test Report
22 Mar 2019
Test Report
22 Mar 2019
Test Report
22 Mar 2019
Epoxy AdhesiveTest Report
21 Nov 2018
Test Report
21 Nov 2018
Test Report
21 Nov 2018
Test Report
21 Nov 2018
Semiconductor DieTest Report
1 Aug 2017
Test Report
1 Aug 2017
Not AvailableNot Available
Solder Ball - Low LeadNot AvailableNot AvailableNot AvailableNot Available
Substrate, Pre-plated NiAuNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.