SPC5566MVR132

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5566MVR132Last Revision (GMT):
Thursday, 10 June 2021, 10:12:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5566MVR132SOT1705-1BGA4163108.852022 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 194 295572020-08-1153 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Kuala Lumpur, Malaysia
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-510.48097499.9900000.337133
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0010480.0100000.000034
Subtotal10.482022100.00000000.337167
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-536.5024433.0895001.174145
Arsenic and its compoundsArsenic, metal7440-38-20.0118150.0010000.000380
Cadmium and its compoundsCadmium, metal7440-43-90.0118150.0010000.000380
Epoxy ResinsProprietary Material-Other Epoxy resins36.5024433.0895001.174145
Inorganic Silicon compoundsSilica, vitreous60676-86-01034.23665887.53590033.267478
Inorganic compoundsCarbon Black1333-86-43.6508350.3090000.117433
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0118150.0010000.000380
Organic Phosphorus compoundsOther organic phosphorous compounds3.6508350.3090000.117433
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins66.9213415.6641002.152606
Subtotal1181.500000100.000000038.004382
Epoxy AdhesiveEpoxy AdhesiveAromatic amines and their salts1,3,5-Triazine-2,4-diamine, 6-[2-(2-methyl-1H-imidazol-1-yl)ethyl]38668-46-10.1470470.8451000.004730
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-52.25467512.9579000.072524
Phenols and Phenolic Resins4,4'-Dihydroxydiphenyl92-88-60.1470470.8451000.004730
Silver and its compoundsSilver, metal7440-22-414.85123185.3519000.477708
Subtotal17.400000100.00000000.559692
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped41.11100098.0000001.322385
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.8390002.0000000.026988
Subtotal41.950000100.00000001.349373
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAntimony and its compoundsAntimony, metal7440-36-00.0035010.0010000.000113
Arsenic and its compoundsArsenic, metal7440-38-20.0035010.0010000.000113
Bismuth and its compoundsBismuth, metal7440-69-90.0035010.0010000.000113
Copper and its compoundsCopper, metal7440-50-82.4508400.7000000.078834
Iron and its compoundsIron, metal7439-89-60.0063020.0018000.000203
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0196070.0056000.000631
Silver and its compoundsSilver, metal7440-22-413.1645123.7600000.423453
Tin and its compoundsTin, metal7440-31-5334.46823595.52960010.758577
Subtotal350.120000100.000000011.262035
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-8561.91098399.98000018.074549
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1124050.0200000.003616
Subtotal562.023388100.000000018.078165
Copper PlatingCopper and its compoundsCopper, metal7440-50-8589.90250499.98000018.974930
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1180040.0200000.003796
Subtotal590.020508100.000000018.978726
Gold PlatingGold and its compoundsGold, metal7440-57-51.91764399.9900000.061683
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001920.0100000.000006
Subtotal1.917835100.00000000.061690
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0036480.0300000.000117
Nickel and its compoundsNickel, metal7440-02-012.15674499.9700000.391036
Subtotal12.160392100.00000000.391154
Solder MaskBarium and its compoundsBarium sulfate7727-43-78.96626829.1000000.288411
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1848710.6000000.005947
Magnesium and its compoundsTalc14807-96-60.9243583.0000000.029733
Organic compoundsOther organic compounds.1.1092293.6000000.035680
PolymersPlastic: EP - Epoxide, Epoxy6.03913619.6000000.194256
PolymersPlastic: PAK13.58805644.1000000.437076
Subtotal30.811919100.00000000.991103
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-346.28431546.6666001.488788
Inorganic Silicon compoundsSilica, vitreous60676-86-06.6120736.6667000.212685
PolymersPlastic: PI - Polyimide46.28431546.6667001.488791
Subtotal99.180604100.00000003.190265
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-378.17558137.0000002.514613
Inorganic Silicon compoundsSilica, vitreous60676-86-033.80565716.0000001.087400
PolymersPlastic: PI - Polyimide99.30411647.0000003.194237
Subtotal211.285354100.00000006.796250
Total3108.852022100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5566MVR132
Product content declaration of SPC5566MVR132
上次修订 Last Revision (GMT):
Thursday, 10 June 2021, 10:12:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5566MVR132Last Revision (GMT):
Thursday, 10 June 2021, 10:12:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Test Report
18 Aug 2020
Die EncapsulantTest Report
27 Jul 2018
Test Report
27 Jul 2018
Test Report
27 Jul 2018
Test Report
27 Jul 2018
Epoxy AdhesiveTest Report
16 Nov 2020
Test Report
16 Nov 2020
Test Report
16 Nov 2020
Test Report
16 Nov 2020
Semiconductor DieTest Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Test Report
4 Aug 2020
Solder Ball - SAC, Lead FreeTest Report
23 Jul 2018
Test Report
23 Jul 2018
Test Report
23 Jul 2018
Test Report
23 Jul 2018
Substrate, Pre-plated NiAuAU PLATINGTest Report
19 Jun 2020
Test Report
19 Jun 2020
Test Report
19 Jun 2020
Test Report
19 Jun 2020
COPPERTest Report
14 Jan 2020
Test Report
14 Jan 2020
Test Report
14 Jan 2020
Test Report
14 Jan 2020
COPPER FOILTest Report
4 May 2020
Test Report
4 May 2020
Test Report
4 May 2020
Test Report
4 May 2020
E679FGBTest Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
23 Dec 2020
Test Report
14 Jan 2020
NI PLATINGTest Report
9 Jun 2020
Test Report
9 Jun 2020
Test Report
9 Jun 2020
Test Report
9 Jun 2020
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.